Product Specifications
The XC3SD1800A-4CS484LI delivers impressive technical specifications that set it apart in the FPGA market. This device features 1,800,000 system gates with 84,480 logic cells, providing substantial processing power for complex applications. The FPGA includes 84 dedicated 18×18 multipliers optimized for DSP operations, along with 3,456 Kbits of block RAM for efficient data storage and manipulation.
Key specifications of the XC3SD1800A-4CS484LI include a CS484 package configuration with 484 pins in a ball grid array (BGA) format. The device operates at a speed grade of -4, ensuring reliable performance across various operating conditions. The industrial temperature range (-40ยฐC to +100ยฐC) makes this FPGA suitable for harsh environmental applications where standard commercial-grade components might fail.
The XC3SD1800A-4CS484LI supports multiple I/O standards including LVTTL, LVCMOS, LVDS, and differential signaling options. With 324 user I/O pins available, designers have extensive connectivity options for interfacing with external components and systems. The device operates on multiple supply voltages (1.2V core, 2.5V auxiliary, and 3.3V I/O), providing flexibility in power management design.
Price Information
Pricing for the XC3SD1800A-4CS484LI varies based on order quantity, distribution channel, and current market conditions. Contact authorized Xilinx distributors for current pricing and availability information. Volume discounts are typically available for large-scale production requirements. The cost-effective nature of the Spartan-3A DSP family makes the XC3SD1800A-4CS484LI an attractive option for budget-conscious projects requiring high-performance FPGA capabilities.
Documents & Media
Comprehensive technical documentation is available for the XC3SD1800A-4CS484LI to support design and implementation. Essential resources include the official datasheet detailing electrical characteristics, timing specifications, and package information. The Spartan-3A DSP FPGA User Guide provides detailed architectural information and design guidelines specific to this device family.
Additional documentation includes application notes covering DSP implementation techniques, power management strategies, and PCB design considerations. Reference designs and example projects demonstrate practical implementations of the XC3SD1800A-4CS484LI in various applications. Xilinx ISE Design Suite documentation provides software tools guidance for development and programming.
Package drawings and mechanical specifications are available in multiple CAD formats to facilitate PCB layout design. Thermal modeling data helps engineers optimize cooling solutions for their specific applications using the XC3SD1800A-4CS484LI.
Related Resources
The XC3SD1800A-4CS484LI ecosystem includes various development tools and resources to accelerate project development. Xilinx ISE Design Suite provides the complete development environment for synthesis, implementation, and programming. ChipScope Pro analyzer enables real-time debugging and verification of FPGA designs.
Development boards featuring the XC3SD1800A-4CS484LI offer convenient platforms for prototyping and evaluation. These boards typically include essential peripherals, memory interfaces, and expansion connectors for rapid system development. Third-party IP cores are available for common functions like communication protocols, video processing, and mathematical operations.
Training materials and educational resources help engineers maximize the potential of the XC3SD1800A-4CS484LI. Online tutorials, webinars, and documentation provide guidance on best practices for FPGA design and DSP implementation techniques.
Environmental & Export Classifications
The XC3SD1800A-4CS484LI meets stringent environmental and regulatory standards for commercial and industrial applications. The device complies with RoHS directives, ensuring lead-free manufacturing and environmental responsibility. REACH compliance documentation is available for European market requirements.
Export classification information indicates that the XC3SD1800A-4CS484LI falls under specific ECCN (Export Control Classification Number) categories. Designers must verify current export regulations and obtain necessary licenses for international shipments or applications in restricted markets.
The device packaging uses halogen-free materials, supporting green manufacturing initiatives. Moisture sensitivity level (MSL) ratings and handling procedures ensure reliable assembly and long-term operation. Temperature cycling and thermal shock test data validate the robustness of the XC3SD1800A-4CS484LI for demanding environmental conditions.
Quality and reliability testing includes extensive burn-in procedures, ensuring consistent performance throughout the device lifecycle. The XC3SD1800A-4CS484LI undergoes rigorous testing protocols to meet automotive and industrial quality standards where applicable.
This comprehensive overview of the XC3SD1800A-4CS484LI demonstrates its capabilities as a versatile, high-performance FPGA solution for advanced digital signal processing applications across diverse industries and environmental conditions.
