The XC3S700AN-FGG484I is a cutting-edge Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-3AN family, designed to deliver exceptional performance and versatility for demanding embedded applications. This automotive-grade FPGA combines advanced reconfigurable logic with integrated flash memory, making the XC3S700AN-FGG484I an ideal solution for industrial, automotive, and communication systems.
Product Specifications
Core Features
- Device Family: Spartan-3AN FPGA
- Logic Cells: 700,000 system gates
- Package Type: FGG484 (Fine-pitch Ball Grid Array)
- Pin Count: 484 pins
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC)
- Speed Grade: -4 (highest performance)
Technical Specifications
- Configurable Logic Blocks (CLBs): 1,472 CLBs
- Distributed RAM: 92 Kbits
- Block RAM: 360 Kbits (20 blocks of 18 Kbits each)
- Digital Clock Managers (DCMs): 4 DCMs
- Multipliers: 20 dedicated 18×18 multipliers
- I/O Standards: Support for multiple voltage standards including LVTTL, LVCMOS, SSTL, HSTL
- Maximum User I/O: 372 pins
Memory and Configuration
- Integrated Flash Memory: Non-volatile configuration storage
- Configuration Options: Master Serial, Slave Serial, Master SelectMAP, Slave SelectMAP, Boundary Scan (JTAG)
- Power Supply: 1.2V core, 2.5V/3.3V I/O
Performance Characteristics
- Maximum System Clock: Up to 326 MHz
- Logic Delay: 0.35ns typical
- Power Consumption: Optimized for low-power applications
- Package Dimensions: 23mm x 23mm BGA package
Price Information
The XC3S700AN-FGG484I pricing varies based on quantity and distributor. For current pricing and availability:
- Sample Quantities: Contact authorized Xilinx distributors
- Production Volumes: Volume pricing available for orders over 1,000 units
- Lead Time: Typically 8-12 weeks for standard orders
- Minimum Order Quantity: 1 piece for samples, 25 pieces for production
Note: Prices are subject to change. Contact your local Xilinx representative or authorized distributor for the most current XC3S700AN-FGG484I pricing and availability information.
Documents & Media
Technical Documentation
- Datasheet: XC3S700AN-FGG484I complete electrical and mechanical specifications
- User Guide: Spartan-3AN FPGA family configuration and design guidelines
- Package Information: FGG484 package mechanical drawings and pinout diagrams
- Application Notes: Design implementation guides and best practices
Development Tools
- Xilinx ISE Design Suite: Complete development environment for XC3S700AN-FGG484I
- ChipScope Pro: Integrated logic analyzer for debugging
- Reference Designs: Pre-built design examples and templates
- Simulation Models: VHDL and Verilog behavioral models
Quality Documentation
- Quality and Reliability Reports: Device qualification and reliability data
- Product Change Notifications (PCN): Latest product updates and changes
- Certificate of Compliance: RoHS and other environmental compliance certificates
Related Resources
Development Boards
- Spartan-3AN Starter Kit: Complete evaluation platform for XC3S700AN-FGG484I
- Custom Development Boards: Third-party boards featuring the XC3S700AN-FGG484I
Software Tools
- Xilinx Vivado Design Suite: Next-generation design environment
- SDK (Software Development Kit): Embedded software development tools
- MicroBlaze Soft Processor: Embedded processor IP for system-on-chip designs
IP Cores and Libraries
- LogiCORE IP: Comprehensive library of verified IP cores
- Reference Designs: Industry-specific design examples
- Third-Party IP: Partner ecosystem IP solutions
Training and Support
- Technical Training: Xilinx University Program courses
- Application Support: Technical support from Xilinx and partners
- Community Forums: Access to developer community and expert advice
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- REACH Compliant: Complies with EU chemical regulation requirements
- Halogen-Free: Environmentally friendly package materials
- WEEE Compliant: Waste Electrical and Electronic Equipment directive compliance
Export Control Classifications
- ECCN (Export Control Classification Number): 3A991.a.2
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Manufactured in approved facilities
- Export Restrictions: Standard semiconductor export regulations apply
Quality Standards
- Automotive Grade: AEC-Q100 qualified for automotive applications
- Industrial Temperature Range: -40ยฐC to +100ยฐC operation
- Quality System: ISO 9001 certified manufacturing
- Reliability Testing: Comprehensive stress testing and qualification
Package Information
- Package Material: Lead-free, halogen-free materials
- Moisture Sensitivity Level: MSL 3 per JEDEC J-STD-020
- Storage Requirements: <30ยฐC, <60% RH in sealed bag
- Handling Precautions: ESD sensitive device, proper handling required
The XC3S700AN-FGG484I represents the pinnacle of Spartan-3AN FPGA technology, offering designers the flexibility and performance needed for next-generation embedded systems. With its comprehensive feature set and robust environmental specifications, this FPGA is the ideal choice for mission-critical applications across automotive, industrial, and communication markets.
