The XC3S700AN-6FGG484I is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3AN series, designed to deliver exceptional performance for embedded applications requiring integrated non-volatile configuration memory. This advanced FPGA combines high logic density with built-in Flash memory, making it an ideal solution for space-constrained designs that demand reliable, instant-on functionality.
Product Specifications
The XC3S700AN-6FGG484I features comprehensive specifications that make it suitable for demanding applications across multiple industries.
Logic Resources:
- 700,000 system gates capacity
- 13,248 logic cells for complex digital designs
- 360 CLB (Configurable Logic Block) slices
- 1,440 CLB slice flip-flops for sequential logic implementation
Memory Architecture:
- 36 dedicated block RAM modules
- 648 Kbits total block RAM capacity
- Integrated SPI Flash memory for configuration storage
- Support for distributed RAM implementation
I/O Capabilities:
- 372 user I/O pins in FGG484 package
- Support for multiple I/O standards including LVTTL, LVCMOS, SSTL, and HSTL
- Differential signaling support for high-speed applications
- Hot-swappable I/O capability
Performance Specifications:
- Speed grade -6 for enhanced performance requirements
- Maximum operating frequency up to 326 MHz
- Low power consumption with multiple power management modes
- Operating temperature range: 0ยฐC to +85ยฐC (commercial grade)
Package Details: The XC3S700AN-6FGG484I comes in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package, providing excellent thermal performance and compact footprint for space-critical applications.
Price
The XC3S700AN-6FGG484I pricing varies based on quantity, distribution channel, and current market conditions. For the most competitive pricing on the XC3S700AN-6FGG484I, contact authorized Xilinx distributors or electronic component suppliers. Volume discounts are typically available for larger orders, making the XC3S700AN-6FGG484I cost-effective for both prototype development and production deployments.
Factors affecting XC3S700AN-6FGG484I pricing include:
- Order quantity and lead times
- Current semiconductor market conditions
- Authorized distributor relationships
- Geographic location and shipping requirements
Documents & Media
Comprehensive documentation supports successful implementation of the XC3S700AN-6FGG484I in your designs:
Technical Documentation:
- Complete datasheet with electrical characteristics and timing specifications
- Spartan-3AN FPGA Family Data Sheet detailing architecture and features
- Package and pinout information for FGG484 configuration
- DC and switching characteristics for the XC3S700AN-6FGG484I
Design Resources:
- ISE Design Suite compatibility guidelines
- Configuration and programming documentation
- Power estimation and thermal management guides
- PCB layout recommendations for optimal XC3S700AN-6FGG484I performance
Application Notes:
- SPI Flash configuration procedures
- I/O standard implementation guidelines
- Clock management and distribution strategies
- Power supply design considerations
Related Resources
The XC3S700AN-6FGG484I ecosystem includes numerous supporting resources for successful project implementation:
Development Tools:
- Xilinx ISE Design Suite for synthesis and implementation
- ChipScope Pro for embedded debugging and verification
- EDK (Embedded Development Kit) for processor-based designs
- Multiple third-party synthesis and simulation tools compatibility
Evaluation Platforms:
- Spartan-3AN development boards featuring the XC3S700AN-6FGG484I
- Reference designs and demonstration projects
- Educational resources and training materials
- Community forums and technical support channels
Compatible Components:
- Configuration memory devices and programming solutions
- Power management ICs optimized for FPGA applications
- Clock generation and distribution components
- High-speed connectors and interface solutions
Design Services: Professional design services are available to accelerate XC3S700AN-6FGG484I implementation, including custom IP development, board design consultation, and system integration support.
Environmental & Export Classifications
The XC3S700AN-6FGG484I meets stringent environmental and regulatory requirements for global deployment:
Environmental Compliance:
- RoHS compliant lead-free package construction
- REACH regulation compliance for European markets
- Conflict minerals reporting program participation
- Green packaging initiatives and recyclable materials
Quality Standards:
- Automotive-qualified versions available for demanding applications
- ISO 9001 certified manufacturing processes
- Comprehensive quality assurance and testing procedures
- Long-term product availability commitments
Export Classification: The XC3S700AN-6FGG484I is subject to export administration regulations. Consult current ECCN (Export Control Classification Number) documentation and applicable trade regulations before international shipment. Proper export licensing may be required depending on destination country and end-use application.
Operating Environment:
- Commercial temperature range: 0ยฐC to +85ยฐC
- Extended temperature variants available upon request
- Humidity and altitude specifications per JEDEC standards
- ESD protection and handling guidelines
The XC3S700AN-6FGG484I represents an excellent choice for applications requiring high-performance FPGA capabilities with integrated non-volatile configuration storage, delivering reliable operation across diverse environmental conditions while meeting global compliance requirements.
