The XC3S700AN-6FGG484C is a powerful field-programmable gate array (FPGA) from Xilinx’s acclaimed Spartan-3AN family, designed to deliver exceptional performance for embedded applications requiring integrated configuration memory and robust processing capabilities.
Product Specification
The XC3S700AN-6FGG484C features comprehensive specifications that make it ideal for demanding digital signal processing and embedded control applications:
Core Architecture:
- Logic Cells: 700,000 system gates
- Configurable Logic Blocks (CLBs): 1,728 total
- Block RAM: 360 Kbits distributed across 20 blocks
- Dedicated Multipliers: 20 embedded 18×18 multipliers
- Speed Grade: -6 (high-performance option)
Memory and Storage:
- Integrated SPI Flash: 4 Mbit non-volatile configuration memory
- Distributed RAM: Flexible memory allocation within CLBs
- FIFO Support: Hardware-optimized first-in-first-out implementations
I/O Capabilities:
- User I/O Pins: 372 maximum user-configurable pins
- Package Type: FGG484 (Fine-pitch Ball Grid Array)
- Voltage Standards: Multiple I/O standard support including LVTTL, LVCMOS, LVDS
- Differential Pairs: High-speed signaling support
Performance Characteristics:
- Operating Frequency: Up to 300+ MHz internal clock speeds
- Power Consumption: Optimized for low-power embedded applications
- Temperature Range: Commercial and industrial grade options
The XC3S700AN-6FGG484C integrates seamlessly into space-constrained designs while providing the processing power needed for complex algorithms and real-time processing tasks.
Price
The XC3S700AN-6FGG484C pricing varies based on quantity, distribution channel, and current market conditions. Typical pricing considerations include:
Quantity Pricing Tiers:
- Single unit: Premium pricing for prototyping and development
- Volume orders (100+): Significant cost reductions available
- Production quantities (1000+): Best per-unit pricing with negotiable terms
Availability Factors:
- Lead times may vary based on global semiconductor supply conditions
- Authorized distributors offer competitive pricing and genuine parts guarantee
- Direct from manufacturer pricing available for large-volume commitments
For current XC3S700AN-6FGG484C pricing and availability, contact authorized Xilinx distributors or semiconductor suppliers who can provide real-time quotes based on your specific quantity requirements and delivery timeline.
Documents & Media
Comprehensive documentation supports successful XC3S700AN-6FGG484C implementation:
Technical Documentation:
- Datasheet: Complete electrical specifications, timing parameters, and package information
- User Guide: Detailed implementation guidelines and best practices
- Reference Manual: In-depth architectural description and programming model
- Errata: Known issues and recommended workarounds
Design Resources:
- Pinout Files: Package pin assignments and signal definitions
- PCB Layout Guidelines: Board design recommendations for optimal performance
- Thermal Management: Heat dissipation strategies and thermal modeling data
- Power Supply Design: Voltage regulation and power sequencing requirements
Software Support:
- ISE Design Suite compatibility information
- Synthesis and place-and-route optimization guides
- Simulation models and timing analysis data
- Configuration and programming utilities
Application Notes:
- Design implementation examples
- Performance optimization techniques
- System integration guidance
- Troubleshooting and debug strategies
All XC3S700AN-6FGG484C documentation is available through Xilinx’s official website and authorized distributor technical resources.
Related Resources
The XC3S700AN-6FGG484C ecosystem includes numerous complementary resources:
Development Tools:
- Xilinx ISE Design Suite: Complete development environment
- ChipScope Pro: Integrated logic analyzer for real-time debugging
- EDK (Embedded Development Kit): Embedded processor design tools
- ModelSim: Advanced simulation and verification platform
Evaluation Platforms:
- Spartan-3AN development boards featuring the XC3S700AN-6FGG484C
- Reference designs demonstrating key capabilities
- Starter kits with comprehensive tutorials and examples
- Third-party development platforms and modules
Design IP and Cores:
- LogiCORE IP library with pre-verified intellectual property
- DSP cores optimized for Spartan-3AN architecture
- Communication protocol stacks and interfaces
- Memory controllers and data processing functions
Community Resources:
- Xilinx forums with XC3S700AN-6FGG484C specific discussions
- Application engineering support and technical consultation
- Training courses and certification programs
- User groups and industry events
Compatible Devices:
- Alternative Spartan-3AN family members for scalability
- Migration paths to newer FPGA architectures
- Companion analog and mixed-signal devices
- Power management and configuration support ICs
Environmental & Export Classifications
The XC3S700AN-6FGG484C meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS Compliant: Lead-free construction meeting European environmental standards
- REACH Regulation: Compliance with EU chemical safety requirements
- Conflict Minerals: Responsible sourcing verification available
- Green Packaging: Environmentally conscious packaging materials
Operating Conditions:
- Commercial Temperature Range: 0ยฐC to +85ยฐC junction temperature
- Industrial Temperature Range: -40ยฐC to +100ยฐC (select grades)
- Humidity Tolerance: Non-condensing environments up to 95% RH
- Altitude Rating: Suitable for applications up to 3000 meters
Quality Standards:
- Automotive Grade: AEC-Q100 qualified versions available
- Military Standards: Enhanced screening options for defense applications
- ISO Certification: Manufacturing facility quality system compliance
- Reliability Testing: Extensive qualification and characterization data
Export Classifications:
- ECCN (Export Control Classification Number): Specific classification available upon request
- Country of Origin: Manufacturing location documentation provided
- Trade Compliance: Full export control documentation support
- Dual-Use Technology: Appropriate licensing guidance available when required
Packaging and Handling:
- Moisture Sensitivity Level (MSL): Appropriate storage and handling requirements
- ESD Protection: Electrostatic discharge handling procedures
- Shelf Life: Long-term storage recommendations and guidelines
- Traceability: Complete lot tracking and genealogy records
The XC3S700AN-6FGG484C environmental classifications ensure compliance with global regulations while supporting diverse application requirements across commercial, industrial, and specialized market segments.
The XC3S700AN-6FGG484C represents proven FPGA technology with integrated configuration memory, making it an excellent choice for embedded applications requiring reliable, high-performance programmable logic solutions.
