The XC3S700AN-5FG484C is a versatile and powerful field-programmable gate array (FPGA) from Xilinx’s Spartan-3AN family, designed to deliver exceptional performance for embedded applications requiring integrated flash memory and advanced processing capabilities.
Product Specifications
The XC3S700AN-5FG484C features a robust architecture optimized for demanding applications. This FPGA incorporates 700,000 system gates with 1,472 configurable logic blocks (CLBs), providing substantial processing power for complex digital designs. The device includes 36 dedicated 18Kb block RAMs, totaling 648Kb of embedded memory, along with 20 dedicated multipliers for efficient digital signal processing operations.
Key specifications of the XC3S700AN-5FG484C include a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with a compact 23mm x 23mm form factor. The device operates at a commercial temperature range of 0ยฐC to +85ยฐC with a speed grade of -5, ensuring reliable performance across various operating conditions. The integrated 4Mb of In-System Flash memory eliminates the need for external configuration memory, significantly reducing board space and system complexity.
The XC3S700AN-5FG484C supports multiple I/O standards including LVCMOS, LVTTL, SSTL, and HSTL, with up to 372 user I/O pins available for interfacing with external components. The device features advanced clock management resources with up to 8 Digital Clock Managers (DCMs) for precise timing control and clock distribution throughout the design.
Price Information
Pricing for the XC3S700AN-5FG484C varies based on order quantity, packaging options, and current market conditions. Volume pricing is typically available for orders exceeding 1,000 units. Contact authorized Xilinx distributors or semiconductor suppliers for current pricing information and quantity breaks. Educational institutions and qualifying organizations may be eligible for special pricing programs.
Documents & Media
Comprehensive technical documentation is available for the XC3S700AN-5FG484C to support design and implementation. The primary datasheet provides detailed electrical specifications, timing parameters, and package information. The Spartan-3AN FPGA Family Complete Data Sheet offers in-depth coverage of architecture, configuration options, and design considerations.
Application notes cover specific implementation topics including configuration procedures, power management, and design optimization techniques. The XC3S700AN-5FG484C is supported by detailed PCB layout guidelines, thermal management recommendations, and reference designs for common applications.
Development tools documentation includes user guides for Xilinx ISE Design Suite, constraints files, and simulation models. Video tutorials and webinars provide additional learning resources for engineers working with the XC3S700AN-5FG484C platform.
Related Resources
The XC3S700AN-5FG484C ecosystem includes comprehensive development tools and support resources. Xilinx ISE Design Suite provides the primary development environment with synthesis, implementation, and debugging capabilities specifically optimized for Spartan-3AN devices.
Evaluation boards and development kits featuring the XC3S700AN-5FG484C enable rapid prototyping and proof-of-concept development. Third-party IP cores and reference designs accelerate time-to-market for common applications including digital signal processing, embedded processing, and communication interfaces.
Training resources include online courses, workshops, and certification programs covering FPGA design methodologies and XC3S700AN-5FG484C-specific implementation techniques. Technical support forums and community resources provide peer-to-peer assistance and knowledge sharing among developers.
Environmental & Export Classifications
The XC3S700AN-5FG484C meets stringent environmental and quality standards for commercial and industrial applications. The device is RoHS compliant and manufactured using lead-free processes, supporting environmentally responsible design practices.
Export classification information indicates that the XC3S700AN-5FG484C may be subject to export control regulations depending on the destination country and end-use application. Customers should consult current export control guidelines and obtain necessary licenses when required for international shipments.
The device is qualified to commercial temperature standards and tested for long-term reliability under various environmental stress conditions. Quality certifications include ISO 9001 manufacturing standards and automotive-grade qualification options for safety-critical applications.
Environmental specifications include operating humidity ranges, storage conditions, and electrostatic discharge (ESD) protection ratings. The XC3S700AN-5FG484C packaging is designed for compatibility with standard surface-mount assembly processes and meets industry standards for moisture sensitivity and thermal cycling.
The XC3S700AN-5FG484C represents a proven solution for designers seeking integrated flash memory capabilities combined with the flexibility and performance of FPGA technology. Its comprehensive feature set and robust design make it suitable for a wide range of embedded applications requiring reliable, high-performance programmable logic.
