High-Performance Nonvolatile FPGA for Space-Constrained Applications
The XC3S700AN-4FGG484I4346 is a cutting-edge Field Programmable Gate Array (FPGA) from Xilinx’s acclaimed Spartan-3AN family, combining advanced FPGA capabilities with integrated nonvolatile Flash memory. This innovative device represents the perfect balance of cost-effectiveness, performance, and reliability for demanding embedded applications.
1. Product Specifications
Core Architecture
- Family: Xilinx Spartan-3AN FPGA
- Logic Capacity: 700K System Gates
- Logic Cells: 13,248 configurable logic cells
- Technology Node: Advanced 90nm CMOS process
- Operating Voltage: 1.2V core voltage (1.14V – 1.26V range)
Performance Characteristics
- Maximum Frequency: 667 MHz system performance
- Speed Grade: -4 (industrial temperature range)
- I/O Pins: 372 user I/O pins
- Package Type: 484-pin Fine-pitch Ball Grid Array (FBGA)
- Package Code: FGG484
Memory and Storage
- Integrated Flash: Nonvolatile configuration memory
- MultiBoot Support: Multiple configuration files in single device
- Block RAM: Dedicated memory blocks for data storage
- Distributed RAM: Configurable logic cell memory
Key Features
- Nonvolatile Technology: Eliminates external configuration devices
- Self-Contained Configuration: Enhanced design security
- Hot-Swap Capability: Live insertion/removal support
- Power Management: Advanced power optimization features
- SelectIO Technology: Multiple I/O standards support
I/O Standards Supported
- LVCMOS (Low Voltage Complementary Metal Oxide Semiconductor)
- LVTTL (Low Voltage Transistor-Transistor Logic)
- HSTL (High Speed Transceiver Logic)
- SSTL (Stub Series Terminated Logic)
- True LVDS (Low Voltage Differential Signaling)
- RSDS (Reduced Swing Differential Signaling)
- Mini-LVDS
Operating Conditions
- Temperature Range: 0ยฐC to +85ยฐC (commercial/industrial)
- Supply Voltage Range: 1.14V to 1.26V (core)
- Package Dimensions: 23mm x 23mm FBGA
- Pin Count: 484 pins total
2. Pricing Information
Current Market Pricing (Updated June 2025)
| Quantity | Unit Price (USD) | Total Savings |
|---|---|---|
| 1-59 pcs | $179.41 | – |
| 60+ pcs | $166.41 | 7.2% discount |
| 120+ pcs | $140.40 | 21.7% discount |
| 240+ pcs | $127.40 | 29.0% discount |
| 360+ pcs | $115.44 | 35.6% discount |
| 480+ pcs | $101.40 | 43.5% discount |
| 600+ pcs | $95.16 | 47.0% discount |
| 6000+ pcs | Contact for quote | Maximum savings |
Note: Prices are subject to market fluctuations and supplier availability. For current pricing and bulk quotations, please request a quote.
Value Proposition
- Cost-Effective: Lower total system cost by eliminating external configuration memory
- Reduced BOM: Fewer components required compared to traditional FPGA solutions
- Time-to-Market: Faster development cycles with integrated nonvolatile storage
3. Documents & Media
Technical Documentation
- Datasheet: Comprehensive specifications and electrical characteristics
- User Guide: Detailed implementation and design guidelines
- Application Notes: Best practices and design examples
- Errata: Known issues and workarounds
- Migration Guide: Upgrade path from previous generations
Design Resources
- Reference Designs: Proven design starting points
- IP Cores: Pre-verified intellectual property blocks
- Constraint Files: Pin assignments and timing constraints
- Board Layout Guidelines: PCB design recommendations
Software Tools
- ISE Design Suite: Legacy development environment
- Vivado Design Suite: Modern development platform (limited support)
- ChipScope Pro: Real-time debugging and analysis
- CORE Generator: IP core customization tool
Multimedia Resources
- Product Videos: Feature demonstrations and tutorials
- Webinars: Technical deep-dives and design workshops
- Training Materials: Comprehensive learning resources
4. Related Resources
Development Platforms
- Spartan-3AN Starter Kit: Complete evaluation platform
- Custom Development Boards: Third-party evaluation options
- Reference Design Boards: Application-specific platforms
Compatible Products
- XC3S1400AN-4FGG484: Higher density alternative
- XC3S400AN-4FGG400: Lower cost option
- XC3S200AN-5FTG256: Compact package variant
Design Tools & Software
- ModelSim: HDL simulation environment
- Synplify: Advanced synthesis tools
- MATLAB/Simulink: System-level design tools
- LabVIEW FPGA: Graphical programming environment
Technical Support
- Xilinx Forums: Community-driven support
- Application Engineers: Direct technical assistance
- Training Courses: Professional development programs
- Design Services: Custom implementation support
Ecosystem Partners
- Board Vendors: Complete system solutions
- IP Providers: Ready-to-use functional blocks
- Design Services: Professional implementation support
- Distribution Partners: Global availability network
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: Not RoHS compliant (legacy product)
- REACH Compliance: Meets EU chemical regulations
- WEEE Directive: Electronic waste management compliance
- Conflict Minerals: Compliant with reporting requirements
Export Control Classifications
- ECCN: 3A991.d (Export Administration Regulations)
- HTS Code: 8542.39.0001 (Harmonized Tariff Schedule)
- Country of Origin: Various (check specific lot)
- Export License: May be required for certain destinations
Quality & Reliability
- ISO Certification: Manufactured in ISO-certified facilities
- Automotive Grade: AEC-Q100 qualified variants available
- Medical Device: Suitable for medical applications
- Military/Aerospace: Contact for qualified versions
Packaging & Shipping
- Moisture Sensitivity: Level 3 (168 hours at 30ยฐC/60% RH)
- ESD Sensitivity: Class 1 (>1000V Human Body Model)
- Lead-Free: Pb-free package available
- Tape & Reel: Standard packaging for automated assembly
Lifecycle Status
- Product Status: Active (limited new designs)
- Recommended for New Designs: No (legacy product)
- End of Life: Not announced
- Long-Term Availability: Contact Xilinx for roadmap
Why Choose XC3S700AN-4FGG484I4346?
The XC3S700AN-4FGG484I4346 stands out as the industry’s first nonvolatile FPGA with MultiBoot capability, making it ideal for applications requiring field upgrades, test modes, or multiple system configurations. Its integration of FPGA logic and Flash memory reduces system complexity while improving reliability and security.
Target Applications:
- Blade servers and data center equipment
- Medical devices and instrumentation
- Automotive infotainment and telematics
- GPS and navigation systems
- Industrial automation and control
- Portable and battery-powered devices
Get Started Today – Contact authorized distributors for pricing, samples, and technical support to accelerate your next design project with the proven XC3S700AN-4FGG484I4346 FPGA solution.
Keywords: XC3S700AN-4FGG484I4346, Xilinx FPGA, Spartan-3AN, nonvolatile FPGA, 700K gates, MultiBoot, embedded systems, programmable logic, field programmable gate array
