The XC3S700AN-4FG484C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3AN family, designed to deliver exceptional performance for embedded applications requiring integrated flash memory and advanced digital signal processing capabilities.
Product Specifications
The XC3S700AN-4FG484C features a robust architecture optimized for demanding applications. This FPGA contains 700,000 system gates with 13,824 logic cells, providing substantial processing capacity for complex digital designs. The device includes 360 Kbits of distributed RAM and 1,872 Kbits of block RAM, ensuring efficient data storage and retrieval operations.
Key specifications include 20 dedicated multipliers for high-speed arithmetic operations, 4 Digital Clock Managers (DCMs) for precise clock control, and 372 user I/O pins for extensive connectivity options. The XC3S700AN-4FG484C operates with a core voltage of 1.2V and I/O voltage ranging from 1.2V to 3.3V, making it compatible with various interface standards including LVTTL, LVCMOS, and differential signaling protocols.
The integrated 11 Mbit Platform Flash memory eliminates the need for external configuration devices, reducing system cost and board space requirements. This non-volatile storage ensures instant-on capability and secure configuration retention across power cycles.
Pricing Information
The XC3S700AN-4FG484C pricing varies based on order quantity, packaging requirements, and distribution channel. Contact authorized Xilinx distributors for current pricing and availability information. Volume discounts are typically available for production quantities exceeding 1,000 units. Educational institutions and development projects may qualify for special pricing programs.
Industrial temperature grade versions command premium pricing compared to commercial grade devices. Lead times generally range from 12-16 weeks for standard orders, with expedited delivery options available for urgent requirements.
Documents & Media
Comprehensive technical documentation supports XC3S700AN-4FG484C implementation and development. The official datasheet provides detailed electrical characteristics, timing specifications, and package information essential for design integration. Application notes cover specific implementation topics including power management, signal integrity, and thermal considerations.
The Spartan-3AN FPGA User Guide offers extensive architectural details and configuration procedures. Pin-out diagrams and package drawings facilitate PCB layout design. Reference designs demonstrate practical implementation examples for common applications including digital signal processing, embedded processing, and communication interfaces.
Software support includes ISE Design Suite compatibility for synthesis, implementation, and debugging. ChipScope Pro analyzer enables real-time logic analysis and verification. ModelSim simulation tools support functional and timing verification throughout the development cycle.
Related Resources
The XC3S700AN-4FG484C integrates seamlessly with Xilinx development tools and IP cores. Spartan-3AN evaluation boards provide convenient prototyping platforms for proof-of-concept development. These boards include essential peripherals, programming interfaces, and expansion connectors for comprehensive system evaluation.
IP core libraries accelerate development with pre-verified functions including DSP algorithms, communication protocols, and memory controllers. LogiCORE IP provides optimized implementations for common functions like FIR filters, FFTs, and Ethernet MACs specifically targeted for Spartan-3AN architecture.
Third-party development tools and IP solutions extend design capabilities. Popular options include embedded processors, debugging tools, and specialized application libraries from qualified partners in the Xilinx ecosystem.
Environmental & Export Classifications
The XC3S700AN-4FG484C meets stringent environmental and quality standards required for industrial applications. RoHS compliance ensures lead-free manufacturing processes meeting European environmental directives. The device operates reliably across industrial temperature ranges from -40ยฐC to +100ยฐC.
Quality certifications include ISO 9001 manufacturing standards and automotive-grade AEC-Q100 qualification for vehicular applications. Moisture sensitivity level (MSL) classification guides proper handling and storage procedures to prevent device damage during assembly processes.
Export classification follows U.S. Department of Commerce regulations with ECCN designation 3A001.a.2. This classification governs international shipping requirements and documentation for global distribution. Customers must verify compliance with applicable export control regulations based on end-use applications and destination countries.
The XC3S700AN-4FG484C represents an ideal solution for applications demanding high-performance FPGA capabilities with integrated flash memory, making it suitable for industrial automation, automotive systems, communications equipment, and advanced embedded processing applications.
