The XC3S700A-FGG484AGQ is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s renowned Spartan-3A family, designed to deliver exceptional performance for cost-sensitive, high-volume applications. This versatile FPGA combines advanced 90nm process technology with proven functionality to provide developers with an optimal balance of performance, power efficiency, and affordability.
Product Specifications
Core Technical Features
The XC3S700A-FGG484AGQ delivers robust performance capabilities with its comprehensive feature set:
Logic Resources:
- System Gates: 700,000
- Logic Cells: 13,248 configurable logic blocks (CLBs)
- Maximum Operating Frequency: Up to 667MHz
- Process Technology: Advanced 90nm manufacturing process
Memory and I/O Capabilities:
- Total RAM Bits: Distributed and block RAM for flexible memory architecture
- I/O Pins: 372 user I/O pins in 484-pin FBGA package
- Package Type: Fine-pitch Ball Grid Array (FBGA)
- Pin Count: 484 pins for maximum connectivity options
Power and Operating Conditions:
- Core Supply Voltage: 1.2V nominal
- I/O Supply Voltage: Multiple voltage standards supported
- Operating Temperature Range: Commercial grade (0ยฐC to +85ยฐC)
- Speed Grade: Various speed grades available for different performance requirements
Advanced Features:
- Dual-range VCCAUX supply simplifies 3.3V-only designs
- Digital Clock Manager (DCM) for advanced clock management
- Built-in configuration memory interface
- Support for various configuration modes
- Enhanced I/O standards compatibility
Package Details
The XC3S700A-FGG484AGQ utilizes a 484-pin Fine-pitch Ball Grid Array (FBGA) package, providing:
- Compact footprint for space-constrained applications
- Excellent thermal performance
- High pin density for maximum I/O utilization
- Industry-standard package compatible with automated assembly processes
Pricing Information
Current Market Pricing
Pricing for the XC3S700A-FGG484AGQ varies based on quantity, supplier, and market conditions. The FPGA market monitors real-time pricing from global electronic component suppliers, with historical price data available for purchasing decisions.
Typical Pricing Ranges:
- Low Volume (1-99 units): Contact authorized distributors for quotes
- Medium Volume (100-999 units): Volume discounts available
- High Volume (1000+ units): Competitive pricing with substantial savings
- OEM/Production Quantities: Custom pricing available
Ordering Information:
- Part Number: XC3S700A-FGG484AGQ
- Manufacturer: AMD Xilinx (formerly Xilinx Inc.)
- Package: 484-pin FBGA
- Lead Time: Contact suppliers for current availability
To obtain current pricing for the XC3S700A-FGG484AGQ, customers can request quotes from authorized distributors or use electronic component search engines that provide real-time market intelligence.
Documents & Media
Technical Documentation
Essential documentation for the XC3S700A-FGG484AGQ includes comprehensive technical resources:
Primary Documentation:
- Datasheet: Complete electrical specifications and AC/DC characteristics
- User Guide: Detailed implementation guidelines and design recommendations
- Package Information: Pin-out diagrams, package dimensions, and thermal data
- Configuration Guide: Programming and configuration procedures
Design Resources:
- Application Notes: Implementation examples and best practices
- Reference Designs: Proven design templates for common applications
- Simulation Models: SPICE and other simulation models for design verification
- Footprint Libraries: PCB layout libraries for major CAD tools
Software Tools:
- ISE Design Suite: Legacy development environment for Spartan-3A devices
- Vivado Design Suite: Advanced design tools with limited Spartan-3A support
- Programming Tools: Configuration and debugging utilities
- IP Core Libraries: Pre-verified intellectual property blocks
Additional Resources
- Errata Documents: Known issues and workarounds
- Migration Guides: Upgrade paths to newer FPGA families
- Training Materials: Educational content and tutorials
- Community Forums: Technical support and design discussions
Related Resources
Development and Evaluation Tools
For designers working with the XC3S700A-FGG484AGQ, several development resources are available:
Development Boards:
- Spartan-3A evaluation boards featuring the XC3S700A device
- Third-party development platforms from various manufacturers
- Educational boards designed for learning FPGA development
- Prototyping boards for rapid design validation
Compatible Products:
- Configuration devices and memory solutions
- Clock generation and management ICs
- Power management solutions optimized for FPGA applications
- Interface and connectivity components
Software and IP Solutions
Design Software:
- Xilinx ISE Design Suite for synthesis and implementation
- Third-party design tools and verification software
- Simulation and modeling applications
- Place and route optimization tools
Intellectual Property:
- Processor cores and embedded solutions
- Communication protocol stacks
- Digital signal processing (DSP) functions
- Interface controllers and peripherals
Application Areas
The XC3S700A-FGG484AGQ excels in numerous application domains:
Consumer Electronics:
- Broadband access equipment and home networking solutions
- Display and projection systems
- Digital television equipment
- Audio/video processing applications
Industrial Applications:
- Control systems and automation equipment
- Test and measurement instruments
- Communications infrastructure
- Motor control and power management
Emerging Technologies:
- Internet of Things (IoT) devices
- Edge computing applications
- Machine learning inference engines
- Adaptive signal processing systems
Environmental & Export Classifications
Environmental Compliance
The XC3S700A-FGG484AGQ meets stringent environmental and quality standards:
RoHS Compliance:
- RoHS compliant versions available for environmentally conscious designs
- Lead-free package options for compliance with environmental regulations
- Halogen-free packages available for specific applications
Quality Standards:
- Manufactured under ISO 9001 quality management systems
- Automotive-grade versions available for automotive applications
- Industrial temperature range options for harsh environment deployment
- Extended temperature range variants (Automotive I grade: -40ยฐC to +100ยฐC, Automotive Q grade: -40ยฐC to +125ยฐC)
Reliability and Testing:
- Comprehensive reliability testing and qualification
- Moisture Sensitivity Level (MSL) 3 rating (168 Hours)
- Electrostatic discharge (ESD) protection
- Long-term availability commitment for production designs
Export Control Classification
Understanding export regulations is crucial for the XC3S700A-FGG484AGQ:
Export Control Considerations:
- FPGAs may be subject to export control regulations depending on application and destination
- Commercial-grade devices typically have fewer restrictions than military-specified versions
- Customers should verify export compliance for their specific applications and destinations
- Export restrictions primarily focus on space-rated and military-specific components
Compliance Guidelines:
- Review Export Administration Regulations (EAR) for current requirements
- Consult with export control specialists for complex applications
- Maintain proper documentation for international shipments
- Consider end-use applications when determining export classification
International Availability:
- Available through global distribution networks
- Regional support and technical assistance
- Local language documentation and support materials
- Compliance with local regulations and standards
Packaging and Handling
Environmental Considerations:
- Static-sensitive device requiring proper ESD handling procedures
- Moisture-sensitive packaging with baking requirements if exposure limits exceeded
- Tray packaging for production volumes with surface mount technology compatibility
- Recyclable packaging materials supporting environmental sustainability
The XC3S700A-FGG484AGQ represents an excellent choice for developers seeking a cost-effective, high-performance FPGA solution. With its robust feature set, comprehensive documentation, and strong ecosystem support, this device enables efficient development of sophisticated digital systems across a wide range of applications. Whether for consumer electronics, industrial control, or emerging technology applications, the XC3S700A-FGG484AGQ delivers the performance, reliability, and value that modern designs demand.
