The XC3S700A-5FTG256C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3 family, designed to deliver exceptional performance for demanding digital signal processing and embedded system applications. This versatile FPGA combines advanced architecture with cost-effective pricing, making it an ideal choice for engineers developing complex digital systems.
Product Specifications
The XC3S700A-5FTG256C features robust specifications that enable sophisticated digital designs:
Core Architecture:
- Logic Cells: 13,824 equivalent gates providing substantial processing capability
- System Gates: 700,000 gates for complex digital implementations
- CLB Array: 46 x 34 Configurable Logic Blocks for flexible design architecture
- Total CLBs: 1,472 blocks offering extensive logic resources
Memory Configuration:
- Block RAM: 360 Kbits distributed across 20 blocks
- Distributed RAM: 92 Kbits for high-speed data access
- Memory flexibility supports various data width configurations
I/O and Connectivity:
- User I/O Pins: 190 pins for extensive external connectivity
- Package Type: FTBGA256 (Fine-Pitch Ball Grid Array)
- Pin Count: 256 total pins in compact 17mm x 17mm package
- Speed Grade: -5 for high-performance applications
Digital Signal Processing:
- Dedicated Multipliers: 20 embedded 18×18 multipliers
- DSP optimization for signal processing applications
- Enhanced arithmetic capabilities for complex calculations
Price Information
The XC3S700A-5FTG256C offers competitive pricing within the FPGA market segment. Pricing varies based on:
- Order quantity (volume discounts available)
- Distribution channel selection
- Regional market conditions
- Package and speed grade specifications
Contact authorized Xilinx distributors for current XC3S700A-5FTG256C pricing and availability. Educational discounts may be available for qualifying institutions.
Documents & Media
Essential documentation for the XC3S700A-5FTG256C includes:
Technical Documentation:
- Complete datasheet with electrical specifications
- Pin configuration and package drawings
- Timing characteristics and performance data
- Power consumption analysis and thermal guidelines
Design Resources:
- Reference designs and application notes
- PCB layout guidelines for FTBGA256 package
- Signal integrity considerations
- Power supply design recommendations
Software Tools:
- Xilinx ISE Design Suite compatibility information
- Constraint files and UCF templates
- Programming and configuration guides
- Debugging and verification methodologies
Related Resources
The XC3S700A-5FTG256C ecosystem includes comprehensive supporting resources:
Development Tools:
- Xilinx ISE WebPACK (free development environment)
- ChipScope Pro for embedded debugging
- ModelSim simulation software integration
- Third-party EDA tool compatibility
Evaluation Platforms:
- Spartan-3A evaluation boards featuring the XC3S700A
- Demonstration designs and tutorials
- Getting started guides for new users
- Community forums and technical support
Complementary Products:
- Configuration devices and programming cables
- Power management solutions
- Clock generation and distribution components
- Interface and connectivity solutions
Environmental & Export Classifications
The XC3S700A-5FTG256C meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant construction (lead-free)
- Operating temperature range: 0ยฐC to +85ยฐC (commercial grade)
- Storage temperature: -65ยฐC to +150ยฐC
- Humidity tolerance: 5% to 95% non-condensing
Quality Standards:
- Automotive-qualified versions available (AEC-Q100)
- Industrial temperature grades (-40ยฐC to +100ยฐC) offered
- Extended temperature options for harsh environments
- Comprehensive reliability testing and qualification
Export Classifications:
- ECCN (Export Control Classification Number) compliance
- International shipping regulations adherence
- Country-specific import/export requirements
- Documentation for regulatory approval processes
The XC3S700A-5FTG256C represents an excellent balance of performance, features, and cost-effectiveness for engineers requiring reliable FPGA solutions. Its comprehensive feature set, extensive documentation, and robust environmental specifications make it suitable for diverse applications ranging from communications infrastructure to industrial automation systems.
