The XC3S700A-5FGG484I is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3A family, designed to deliver exceptional performance for demanding digital signal processing and embedded system applications. This versatile FPGA combines advanced architecture with cost-effective implementation, making it an ideal choice for engineers developing complex digital solutions.
Product Specifications
The XC3S700A-5FGG484I features a robust architecture built on proven Spartan-3A technology. This FPGA incorporates 700,000 system gates with 13,824 logic cells, providing substantial processing capability for complex applications. The device includes 360 Kbits of block RAM, offering flexible memory configurations for data buffering and storage requirements.
Key technical specifications of the XC3S700A-5FGG484I include a -5 speed grade designation, ensuring reliable operation at higher frequencies while maintaining signal integrity. The device utilizes a fine-pitch ball grid array (FBGA) package with 484 pins, optimizing board space utilization while providing extensive I/O connectivity options. Operating voltage requirements are 1.2V for the core and 3.3V for I/O operations, following industry-standard power specifications.
The XC3S700A-5FGG484I supports various I/O standards including LVTTL, LVCMOS, and differential signaling options, enabling seamless integration with diverse system architectures. Clock management resources include digital clock managers (DCMs) for precise timing control and frequency synthesis capabilities.
Price Information
Pricing for the XC3S700A-5FGG484I varies based on quantity, distribution channel, and current market conditions. Contact authorized Xilinx distributors for current pricing and availability information. Volume pricing tiers are typically available for production quantities, with engineering sample programs supporting development phases.
The XC3S700A-5FGG484I represents excellent value proposition considering its comprehensive feature set and proven reliability in demanding applications. Cost-effective alternative configurations within the Spartan-3A family are available for applications requiring different resource allocations.
Documents & Media
Comprehensive technical documentation supports XC3S700A-5FGG484I implementation and development. The official datasheet provides detailed electrical characteristics, timing specifications, and package information essential for design integration. Pin assignment documentation facilitates PCB layout planning and signal routing optimization.
Application notes demonstrate practical implementation techniques for common design challenges, including configuration methods, power management strategies, and thermal considerations. Design tools documentation covers ISE Design Suite compatibility and optimization recommendations specific to the XC3S700A-5FGG484I architecture.
Reference designs showcase typical applications including digital signal processing implementations, communication protocol handling, and embedded processor interfaces. These resources accelerate development timelines while ensuring design best practices.
Related Resources
The Spartan-3A family offers complementary devices for applications requiring different resource configurations. Higher-density options include XC3S1000A and XC3S1400A variants, while XC3S200A and XC3S400A provide cost-optimized solutions for less complex applications.
Development boards featuring the XC3S700A-5FGG484I enable rapid prototyping and design verification. These platforms include essential peripherals, power supplies, and programming interfaces necessary for comprehensive evaluation.
Software tools supporting XC3S700A-5FGG484I development include ISE Design Suite with synthesis, implementation, and debugging capabilities. IP core libraries provide pre-verified functional blocks including processors, memory controllers, and communication interfaces compatible with this FPGA architecture.
Third-party design services and consulting resources specialize in Spartan-3A implementations, offering expertise for complex projects requiring specialized knowledge or accelerated development schedules.
Environmental & Export Classifications
The XC3S700A-5FGG484I meets stringent environmental compliance standards including RoHS directive requirements for hazardous substance restrictions. Lead-free package construction supports environmentally conscious manufacturing processes while maintaining reliability standards.
Operating temperature range spans commercial (-40ยฐC to +85ยฐC) conditions, ensuring reliable operation across diverse environmental conditions. The device incorporates robust ESD protection and latch-up immunity meeting JEDEC standards for industrial applications.
Export classification follows US Department of Commerce regulations, with standard commercial availability for most international markets. Specific export licensing requirements may apply for certain geographical regions or end-use applications involving sensitive technologies.
Quality certifications include ISO 9001 manufacturing standards and automotive-grade options for applications requiring enhanced reliability specifications. Qualification testing encompasses temperature cycling, mechanical stress, and accelerated aging protocols ensuring long-term reliability.
The XC3S700A-5FGG484I represents a proven solution combining performance, flexibility, and reliability for demanding FPGA applications requiring substantial processing resources and comprehensive I/O capabilities.
