The XC3S700A-4FT256I is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3A family, designed to deliver exceptional performance and flexibility for demanding digital signal processing and embedded system applications. This advanced FPGA combines high logic density with cost-effective implementation, making it an ideal choice for engineers developing complex digital circuits.
Product Specifications
The XC3S700A-4FT256I features robust technical specifications that meet the requirements of modern electronic designs:
Core Architecture:
- Logic Cells: 13,248 equivalent logic cells
- System Gates: 700,000 gates
- Distributed RAM: 184 Kbits
- Block RAM: 360 Kbits total (20 blocks of 18 Kbits each)
- Digital Clock Manager (DCM): 4 DCMs for advanced clock management
I/O and Connectivity:
- User I/O Pins: 190 available I/O pins
- Package Type: FT256 (Fine-Pitch Ball Grid Array)
- Pin Count: 256 total pins
- Voltage Standards: Multiple I/O voltage support (1.2V to 3.3V)
Performance Characteristics:
- Speed Grade: -4 (high-performance grade)
- Operating Temperature Range: Industrial grade (-40ยฐC to +100ยฐC)
- Power Supply: Core voltage 1.2V, I/O voltage 1.2V-3.3V
- Maximum Operating Frequency: Up to 326 MHz
Memory and Processing Features:
- 18×18 Multipliers: 20 dedicated multiplier blocks
- JTAG Boundary Scan: IEEE 1149.1 compliant
- Configuration Options: Multiple configuration modes including JTAG, SPI, and parallel
Pricing Information
The XC3S700A-4FT256I is competitively priced to offer exceptional value for high-performance FPGA applications. Pricing varies based on order quantity, with volume discounts available for large-scale production runs. Contact authorized Xilinx distributors for current pricing and availability, as costs may fluctuate based on market conditions and semiconductor supply chain factors.
Pricing Factors:
- Quantity breaks typically available at 25, 100, 500, and 1000+ units
- Lead times vary from stock availability to 12-16 weeks for special orders
- Extended temperature range options may affect pricing
- Long-term supply agreements available for production commitments
Documents & Media
Comprehensive technical documentation supports the XC3S700A-4FT256I implementation and development process:
Essential Documentation:
- Datasheet: Complete electrical specifications, timing parameters, and package information
- User Guide: Detailed implementation guidelines and design recommendations
- Package Information: Mechanical drawings, pin assignments, and thermal characteristics
- Migration Guide: Transition information from other FPGA families
Development Resources:
- Reference Designs: Pre-validated design examples and application notes
- Constraint Files: UCF and timing constraint templates
- Simulation Models: VHDL and Verilog behavioral models
- CAD Library Files: Footprint and symbol libraries for major EDA tools
Software Support:
- Compatible with Xilinx ISE Design Suite
- ChipScope Pro analyzer support for embedded debugging
- Impact configuration tool compatibility
- Third-party synthesis tool support
Related Resources
The XC3S700A-4FT256I integrates seamlessly with Xilinx’s comprehensive ecosystem of development tools and supporting products:
Development Platforms:
- Spartan-3A Starter Kit for rapid prototyping
- Custom evaluation boards from third-party vendors
- Socket adapter boards for prototyping and testing
Compatible Products:
- Other Spartan-3A family members for design scalability
- Xilinx soft-core processors (MicroBlaze)
- IP core library including DSP, connectivity, and interface cores
Design Tools and Software:
- Xilinx ISE WebPACK (free version) and ISE Foundation
- ModelSim simulation environment compatibility
- Synopsys, Cadence, and Mentor Graphics tool support
Technical Support:
- Xilinx technical support portal and knowledge base
- Community forums and user groups
- Application engineering support for complex designs
- Training courses and certification programs
Environmental & Export Classifications
The XC3S700A-4FT256I meets stringent environmental and regulatory standards required for commercial and industrial applications:
Environmental Compliance:
- RoHS Compliant: Lead-free package construction meeting EU RoHS directives
- REACH Regulation: Compliant with European chemical safety standards
- Conflict Minerals: Sourced in compliance with conflict minerals regulations
- Green Package: Halogen-free package options available
Quality and Reliability:
- Automotive Grade: AEC-Q100 qualified versions available for automotive applications
- Industrial Temperature Range: -40ยฐC to +100ยฐC operation guaranteed
- Moisture Sensitivity Level: MSL-3 classification for safe handling and storage
- Qualification Standards: Meets JEDEC and military specifications where applicable
Export Classifications:
- ECCN (Export Control Classification Number): Subject to US export administration regulations
- Country of Origin: Manufactured in ISO-certified facilities
- Customs Classification: HS code classification for international shipping
- Dual-Use Technology: May require export licenses for certain destinations
Packaging and Handling:
- Anti-Static Packaging: ESD-safe packaging and handling procedures
- Traceability: Full lot traceability and date code marking
- Storage Requirements: Specified humidity and temperature storage conditions
- Shelf Life: Defined storage life with proper environmental controls
The XC3S700A-4FT256I represents an excellent balance of performance, features, and cost-effectiveness for engineers seeking a reliable FPGA solution. Its comprehensive feature set, robust documentation, and extensive ecosystem support make it an ideal choice for applications ranging from digital signal processing to embedded control systems, ensuring successful project implementation and long-term product reliability.
