The XC3S700A-4FGG400C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3A family, designed to deliver exceptional performance for complex digital applications. This versatile programmable logic device combines high gate density with cost-effective implementation, making it an ideal choice for engineers developing sophisticated embedded systems, communications equipment, and industrial control solutions.
Product Specifications
The XC3S700A-4FGG400C features robust technical specifications that support demanding applications:
Core Architecture:
- Logic Cells: 13,248 system gates providing extensive programmable logic capacity
- Equivalent Gate Count: 700,000 gates for complex digital designs
- Block RAM: 360 Kb of dedicated block RAM for efficient data storage
- Distributed RAM: 124 Kb for flexible memory implementation
- Multipliers: 20 dedicated 18×18 multipliers for high-speed arithmetic operations
I/O and Package Details:
- Package Type: FGG400 (Fine-pitch Ball Grid Array)
- Total I/O Pins: 280 user I/O pins for extensive connectivity
- Operating Voltage: 1.2V core, 3.3V I/O standard
- Speed Grade: -4 (commercial temperature range)
- Temperature Range: 0ยฐC to +85ยฐC commercial operation
Performance Characteristics:
- Maximum Operating Frequency: Up to 326 MHz internal clock
- Power Consumption: Optimized low-power design
- Configuration Memory: External configuration support via PROM, Flash, or JTAG
Pricing Information
The XC3S700A-4FGG400C offers competitive pricing for its feature set and performance capabilities. Pricing varies based on order quantity, with volume discounts available for production quantities. For current pricing and availability, contact authorized Xilinx distributors or visit the official Xilinx website. Educational discounts may be available for academic institutions and student projects.
Documents & Media
Essential Documentation:
- Datasheet: Complete electrical and timing specifications for the XC3S700A-4FGG400C
- User Guide: Comprehensive implementation guidelines and design recommendations
- Package Information: Detailed FGG400 package dimensions and pin assignments
- Migration Guide: Instructions for upgrading from previous Spartan generations
Design Resources:
- Reference Designs: Sample implementations and application notes
- Simulation Models: SPICE and behavioral models for system simulation
- PCB Layout Guidelines: Board design recommendations for optimal performance
- Constraint Files: UCF and timing constraint templates
Related Resources
Development Tools:
- Xilinx ISE Design Suite: Complete development environment for the XC3S700A-4FGG400C
- ChipScope Pro: Integrated logic analyzer for real-time debugging
- ModelSim: Advanced simulation environment for design verification
- Impact: Configuration and programming utility
Compatible Products:
- Configuration Devices: Platform Flash PROMs and SPI Flash memory
- Development Boards: Spartan-3A evaluation and starter kits
- IP Cores: Xilinx LogiCORE IP library for rapid development
- Third-Party Tools: Compatible with various EDA tools and IP providers
Technical Support:
- Answer Database: Searchable knowledge base for common design questions
- Application Notes: Detailed implementation guides for specific applications
- Community Forums: Peer-to-peer support and design discussions
- Training Materials: Online courses and tutorials for FPGA design
Environmental & Export Classifications
Environmental Compliance: The XC3S700A-4FGG400C meets stringent environmental standards:
- RoHS Compliant: Lead-free and environmentally friendly manufacturing
- REACH Regulation: Compliant with European chemical safety requirements
- Halogen-Free: Environmentally conscious packaging materials
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- Storage Temperature: -65ยฐC to +150ยฐC for long-term reliability
Export Classifications:
- ECCN (Export Control Classification Number): 5A002 under U.S. Export Administration Regulations
- HTS (Harmonized Tariff Schedule): 8542.31.0001 for customs classification
- Country of Origin: Manufactured in ISO-certified facilities
- Export Restrictions: Subject to standard semiconductor export regulations
Quality Certifications:
- ISO 9001: Quality management system certification
- ISO 14001: Environmental management system compliance
- Automotive Grade: AEC-Q100 qualified versions available
- Industrial Standards: Meets IEC and JEDEC specifications
The XC3S700A-4FGG400C represents an excellent balance of performance, features, and cost-effectiveness for modern FPGA applications. Its comprehensive feature set, robust documentation, and extensive support resources make it an ideal choice for both prototyping and production implementations across diverse industries including telecommunications, automotive, industrial automation, and consumer electronics.
