Product Overview
The XC3S50AN-4TQG44I is a high-performance, cost-effective Field Programmable Gate Array (FPGA) from AMD Xilinx’s Spartan-3AN family. This compact 44-pin TQFP package device delivers excellent performance for space-constrained applications requiring programmable logic capabilities.
1. Product Specifications
Core Specifications
- Part Number: XC3S50AN-4TQG44I
- Family: Spartan-3AN FPGA
- Logic Capacity: 50,000 system gates
- Logic Cells: 1,584 cells
- Configurable Logic Blocks (CLBs): 176 CLBs
- Technology: 90nm CMOS process
- Operating Voltage: 1.2V core, 3.3V I/O
Performance Characteristics
- Speed Grade: -4 (commercial grade)
- Maximum Frequency: Up to 667 MHz
- Configuration Memory: Integrated Flash memory
- Total RAM Bits: 54 Kbit distributed RAM
- Block RAM: 11,264 bits
Package Details
- Package Type: TQFP (Thin Quad Flat Pack)
- Pin Count: 44 pins
- Package Code: TQG44I
- Operating Temperature: Commercial (0ยฐC to +85ยฐC)
Key Features
- Very low cost, high-performance logic solution
- Dual-range VCCAUX supply for simplified 3.3V-only designs
- Integrated Flash configuration memory eliminates external configuration devices
- Pin-compatible with Spartan-3A family
- ISE and Vivado Design Suite compatible
- Automotive and medical application qualified variants available
2. Price Information
Current Market Pricing (2025)
- Small Quantities (1-99 units): Contact for quote
- Medium Volume (100-499 units): Approximately $25-35 USD per unit
- High Volume (1000+ units): $18-25 USD per unit
- Enterprise Volume (10,000+ units): $15-20 USD per unit
Note: Pricing varies by distributor, quantity, and market conditions. Contact authorized distributors for current pricing and availability.
Authorized Distributors
- DigiKey Electronics
- Mouser Electronics
- Arrow Electronics
- Avnet
- Future Electronics
3. Documents & Media
Technical Documentation
- Datasheet: DS557 – Spartan-3AN FPGA Family Data Sheet
- User Guide: UG331 – Spartan-3 Generation FPGA User Guide
- Configuration Guide: UG332 – Spartan-3AN Configuration User Guide
- PCB Design Guidelines: UG112 – Spartan-3 FPGA PCB Design and Pin Planning Guide
Design Resources
- Reference Designs: Available through AMD Xilinx Design Hub
- Application Notes: Multiple AN documents covering implementation best practices
- Development Boards: Compatible with Spartan-3A starter kits and evaluation boards
- IP Cores: Access to extensive library through Vivado IP Catalog
Software Support
- Primary Tool: AMD Xilinx Vivado Design Suite
- Legacy Support: ISE Design Suite (up to version 14.7)
- Programming: iMPACT, Vivado Hardware Manager
- Simulation: ModelSim, Vivado Simulator
4. Related Resources
Development Tools
- Vivado Design Suite: Complete design environment for synthesis, implementation, and debugging
- Hardware Development Platforms: Spartan-3A evaluation boards
- Programming Cables: Platform Cable USB II, Vivado Programming Cable
- Third-Party Tools: Compatible with major EDA tool suites
Design Support
- AMD Xilinx Forums: Community support and discussions
- Technical Support: Direct engineering support through AMD Xilinx
- Training Resources: Online courses and certification programs
- Design Services: Partner ecosystem for custom development
Compatible Products
- Higher Density: XC3S200AN, XC3S400AN, XC3S700AN, XC3S1400AN
- Alternative Packages: FT256, TQ144 variants
- Next Generation: Spartan-6, Spartan-7 migration paths
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Yes (Lead-free)
- REACH Regulation: Compliant
- Conflict Minerals: Compliant with SEC regulations
- Green Classification: Pb-free package available
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.39.0001
- Country of Origin: Varies by assembly location
- Export License: May require export license for certain destinations
Quality Standards
- Automotive Grade: AEC-Q100 qualified versions available (-C suffix)
- Medical Applications: Suitable for medical device applications
- Industrial Temperature: Extended temperature ranges available
- Qualification Standards: JEDEC, IPC standards compliance
Packaging & Handling
- Moisture Sensitivity Level: MSL 3
- Storage Requirements: <30ยฐC, <60% RH in sealed bag
- Handling Precautions: ESD sensitive device – proper handling required
- Packaging Options: Tape and reel, tube packaging available
The XC3S50AN-4TQG44I provides an ideal balance of performance, cost, and features for applications requiring moderate logic capacity in a compact form factor. Its integrated Flash configuration and comprehensive tool support make it an excellent choice for both prototyping and production deployment.
