The XC3S50A-4FTG256I is a high-performance field-programmable gate array (FPGA) from Xilinx’s Spartan-3A family, designed to deliver exceptional value for cost-sensitive applications. This versatile FPGA combines advanced features with reliable performance, making it an ideal choice for digital signal processing, embedded processing, and general-purpose logic applications.
Product Specifications
The XC3S50A-4FTG256I offers robust specifications that meet demanding application requirements:
Core Architecture:
- Logic Cells: 50,000 system gates
- Configurable Logic Blocks (CLBs): 1,728
- Block RAM: 108 Kbits
- Distributed RAM: 72 Kbits
- Digital Clock Manager (DCM) blocks: 2
Package Details:
- Package Type: Fine-pitch Ball Grid Array (FTBGA)
- Pin Count: 256 pins
- Package Size: 17mm x 17mm
- Ball Pitch: 0.8mm
Performance Characteristics:
- Speed Grade: -4 (commercial temperature range)
- Operating Temperature: 0ยฐC to +85ยฐC
- Supply Voltage: 1.2V core, 3.3V I/O
- Maximum Frequency: Up to 200+ MHz
I/O Capabilities:
- User I/O Pins: 172
- Differential I/O Pairs: 68
- Single-ended I/O Standards: LVTTL, LVCMOS, PCI, GTL+
- Differential I/O Standards: LVDS, LVPECL, SSTL, HSTL
Price Information
The XC3S50A-4FTG256I pricing varies based on quantity and supplier. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for orders exceeding 100 units. Lead times may vary depending on market conditions and inventory levels.
Documents & Media
Essential documentation for the XC3S50A-4FTG256I includes:
Technical Documentation:
- Spartan-3A FPGA Family Data Sheet (DS529)
- XC3S50A-4FTG256I Device Pinout and Package Information
- Spartan-3A FPGA User Guide (UG331)
- Configuration User Guide (UG332)
Development Resources:
- Vivado Design Suite compatibility information
- ISE Design Suite project files and examples
- Reference designs and application notes
- PCB layout guidelines and footprint files
Quality Documentation:
- Product Quality and Reliability Reports
- MSL (Moisture Sensitivity Level) ratings
- Component qualification test results
Related Resources
Development Tools:
- Xilinx Vivado Design Suite (recommended)
- ISE Design Suite (legacy support)
- ChipScope Pro Analyzer for debugging
- ModelSim simulation software compatibility
Evaluation Boards:
- Spartan-3A Starter Kit
- Custom evaluation boards from third-party vendors
- Development board schematics and layouts
Software Support:
- Xilinx Software Development Kit (SDK)
- Embedded Development Kit (EDK)
- Platform Studio integration
- Third-party IP core libraries
Application Areas: The XC3S50A-4FTG256I excels in communications infrastructure, industrial automation, medical devices, automotive electronics, and consumer applications requiring moderate logic density with cost optimization.
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant (lead-free package options available)
- REACH regulation compliant
- Conflict minerals compliant
- Green packaging standards met
Operating Conditions:
- Commercial temperature grade: 0ยฐC to +85ยฐC
- Industrial temperature grade options available
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2,000 meters
Export Classifications:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Various (check specific part marking)
- Export license requirements may apply for certain destinations
Quality Standards:
- ISO 9001:2015 certified manufacturing
- JEDEC standard compliance
- Automotive AEC-Q100 qualified versions available
- Military/aerospace screening options available
Package Materials:
- Lead-free solder ball composition
- Moisture sensitivity level (MSL): Level 3
- Storage conditions: -40ยฐC to +125ยฐC
- Baking requirements: 125ยฐC for 24 hours if MSL exposure exceeded
The XC3S50A-4FTG256I represents an excellent balance of performance, features, and cost-effectiveness for mid-range FPGA applications. Its comprehensive feature set and reliable operation make it suitable for both prototyping and production environments across various industries.
