The XC3S50A-4FTG256C is a versatile Spartan-3A FPGA (Field-Programmable Gate Array) from AMD Xilinx, designed for cost-effective digital logic applications. This comprehensive guide covers everything you need to know about the XC3S50A-4FTG256C, including detailed specifications, pricing information, and technical resources.
1. Product Specifications
Core Features of XC3S50A-4FTG256C
The XC3S50A-4FTG256C belongs to the Spartan-3A family and offers exceptional performance for embedded processing applications. Key specifications include:
Logic Capacity:
- 50,000 system gates
- 1,408 logic cells
- 1,728 CLB slices
- 56 user I/O pins
Memory Resources:
- 108 Kbits total block RAM
- 12 dedicated 18Kb block RAMs
- Distributed RAM capability
Package Details:
- Package Type: FTBGA (Fine-pitch Ball Grid Array)
- Pin Count: 256 pins
- Package Size: 17mm x 17mm
- Ball Pitch: 1.0mm
Performance Characteristics:
- Speed Grade: -4 (commercial grade)
- Operating Temperature: 0°C to +85°C
- Supply Voltage: 1.2V core, 3.3V I/O
- Maximum System Clock: Up to 200+ MHz
I/O Features:
- 56 user I/O pins available
- Multiple I/O standards supported (LVTTL, LVCMOS, SSTL, HSTL)
- Differential signaling capability
- Hot-swappable I/O support
The XC3S50A-4FTG256C integrates advanced features including dedicated multipliers, digital signal processing capabilities, and flexible clocking resources, making it ideal for applications requiring moderate logic density with cost optimization.
2. Price Information
XC3S50A-4FTG256C Pricing Structure
Pricing for the XC3S50A-4FTG256C varies based on order quantity and supplier:
Typical Price Ranges:
- Single Unit: $15-25 USD
- Small Quantity (10-99 units): $12-18 USD
- Medium Volume (100-999 units): $8-14 USD
- Large Volume (1000+ units): Contact for quote
Price Factors:
- Order quantity significantly impacts unit cost
- Lead times may affect pricing
- Market conditions and availability
- Distributor margins and regional variations
Cost Optimization Tips:
- Consider volume purchasing for better pricing
- Compare multiple authorized distributors
- Factor in lead times for project planning
- Evaluate alternative package options if suitable
For current XC3S50A-4FTG256C pricing and availability, consult authorized Xilinx distributors such as Digi-Key, Mouser Electronics, Arrow Electronics, or Avnet.
3. Documents & Media
Technical Documentation for XC3S50A-4FTG256C
Comprehensive documentation is available to support XC3S50A-4FTG256C implementation:
Primary Documentation:
- Spartan-3A FPGA Family Data Sheet
- XC3S50A-4FTG256C Product Brief
- Spartan-3A FPGA User Guide
- Package and Pinout Specifications
Design Resources:
- Vivado Design Suite compatibility guide
- ISE Design Suite legacy support documentation
- Reference designs and application notes
- IBIS models for signal integrity analysis
Development Tools:
- Xilinx Vivado Design Suite (recommended)
- ISE Design Suite (legacy support)
- ChipScope Pro debugging tools
- ModelSim simulation support
Application Notes:
- Power management and optimization
- High-speed design considerations
- PCB layout guidelines for FTBGA packages
- Clock management and distribution
Video Resources:
- Spartan-3A overview presentations
- Design methodology webinars
- Troubleshooting guides and tutorials
All documentation is available through the official AMD Xilinx website and authorized distributor portals.
4. Related Resources
XC3S50A-4FTG256C Development Ecosystem
Development Boards:
- Spartan-3A Starter Kit
- Third-party evaluation boards
- Custom development platforms
- Educational training boards
Compatible Components:
- Configuration memory devices (SPI Flash, EEPROM)
- Power management ICs
- Clock generation circuits
- Interface transceivers
Software Tools:
- Vivado Design Suite (current)
- ISE Design Suite (legacy)
- Software Development Kit (SDK)
- Embedded development tools
Technical Support:
- AMD Xilinx Community Forums
- Application engineering support
- Training courses and workshops
- Partner ecosystem resources
Alternative Devices:
- XC3S50A-4FT256C (different package)
- XC3S50A-4TQ144C (smaller package option)
- XC3S200A-4FTG256C (higher logic density)
- Modern equivalents in 7-series FPGAs
5. Environmental & Export Classifications
Compliance and Environmental Data
Environmental Classifications:
- RoHS Compliant: Yes
- Lead-free package available
- Halogen-free options
- MSL (Moisture Sensitivity Level): Level 3
Operating Conditions:
- Commercial Temperature Range: 0°C to +85°C
- Storage Temperature: -65°C to +150°C
- Humidity: 5% to 95% non-condensing
- ESD Classification: Class 1C
Reliability Standards:
- JEDEC standards compliance
- Automotive qualification available (select variants)
- Industrial temperature grades available
- Quality management system certified
Export Control Information:
- Export Control Classification Number (ECCN): 3A991.a.2
- Country of Origin: Varies by manufacturing location
- License requirements depend on end-use application
- Consult export control regulations for specific applications
Safety Certifications:
- UL recognition where applicable
- CE marking compliance
- International safety standards adherence
Environmental Impact:
- Conflict minerals compliance
- Sustainable packaging initiatives
- End-of-life recycling programs
- Carbon footprint reduction efforts
The XC3S50A-4FTG256C meets stringent environmental and regulatory requirements, ensuring reliable operation across diverse applications while maintaining compliance with international standards.
The XC3S50A-4FTG256C represents an excellent balance of performance, cost, and flexibility for FPGA-based designs. Whether you’re developing prototypes, educational projects, or production systems, this device offers the resources and support needed for successful implementation. Contact authorized distributors for current availability and pricing of the XC3S50A-4FTG256C.
