The XC3S500E-FTG256DG is a powerful Field-Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-3E family, specifically engineered for high-volume, cost-sensitive consumer electronics applications. This advanced programmable logic device delivers exceptional functionality and bandwidth per dollar, setting new industry standards for programmable logic solutions.
1. Product Specifications
Core Features
- FPGA Family: Spartan-3E
- Logic Capacity: 500K system gates
- Logic Cells: 10,476 cells with shift register capability
- Maximum Frequency: 572MHz
- Process Technology: 90nm CMOS technology
- Supply Voltage: 1.2V core voltage
- Package Type: 256-pin Fine-pitch Ball Grid Array (FTBGA)
- Package Code: FTG256DG
- Temperature Grade: Commercial (0ยฐC to +85ยฐC)
- Speed Grade: -4 (572MHz)
Memory Resources
- Block RAM: Up to 1,728 Kbits total capacity
- Distributed RAM: Up to 432 Kbits total capacity
- SelectRAM: Hierarchical memory architecture
I/O Capabilities
- Total I/Os: 190 user I/O pins
- SelectIO Technology: Advanced signaling standards
- Single-ended Standards: 18 different standards supported
- Differential Standards: 8 standards including LVDS and RSDS
- DDR Support: Double Data Rate (DDR) capability
Advanced Features
- Dedicated Multipliers: 18 x 18 multiplier blocks
- Digital Clock Managers (DCMs): 4 DCMs for clock management
- Clock skew elimination
- Frequency synthesis
- High-resolution phase shifting
- Fast Carry Logic: Look-ahead carry chain for arithmetic operations
- Wide Multiplexers: Efficient data routing
- JTAG Support: IEEE 1149.1/1532 compatible boundary scan
Performance Specifications
- System Performance: Up to 572MHz operation
- Logic Resources: Enhanced from Virtex-II platform technology
- Power Efficiency: Optimized 90nm CMOS process
- Signal Integrity: Advanced I/O standards support
2. Pricing Information
The XC3S500E-FTG256DG offers competitive pricing for volume applications:
Quantity-Based Pricing Tiers
- 360+ units: $115.40 per unit
- 720+ units: $107.04 per unit
- 1,440+ units: $90.31 per unit
- 2,160+ units: $81.95 per unit
- 2,880+ units: $74.26 per unit
- 3,600+ units: $65.22 per unit
- 36,000+ units: $61.21 per unit
Pricing subject to change based on market conditions and availability. Contact authorized distributors for current pricing and volume discounts.
Availability
The XC3S500E-FTG256DG is available through authorized electronic component distributors worldwide, including:
- Digi-Key Electronics
- FPGAkey
- IC-Components
- WIN SOURCE
- LCSC Electronics
3. Documents & Media
Technical Documentation
- Datasheet: Spartan-3E FPGA Family Data Sheet (DS312)
- User Guide: Spartan-3E FPGA User Guide
- Configuration Guide: Spartan-3E Configuration User Guide
- PCB Design Guidelines: Package and PCB design recommendations
- Application Notes: Design implementation guides
Software Resources
- Design Tools: Xilinx ISE Design Suite (legacy)
- Modern Tools: Vivado Design Suite (for new designs)
- Programming: JTAG configuration support
- Simulation: ModelSim, ISim compatibility
Development Resources
- Reference Designs: Available through Xilinx Developer Zone
- IP Cores: Compatible with Xilinx IP catalog
- Example Projects: Starter kit demonstrations
- Community Support: Xilinx Forums and technical resources
4. Related Resources
Compatible Development Boards
- Spartan-3E Starter Kit: Official development platform
- Digilent Basys 3: Educational FPGA board
- Custom PCB Designs: Third-party development solutions
Design Tools & Software
- Xilinx Vivado: Modern synthesis and implementation
- ISE Design Suite: Legacy development environment
- Hardware Description Languages: VHDL, Verilog support
- System-level Design: Embedded development tools
Application Areas
The XC3S500E-FTG256DG excels in diverse applications:
- Broadband Access Equipment: DSL, cable modems
- Home Networking: Routers, switches, wireless access points
- Display Technology: LCD controllers, video processing
- Digital Television: Set-top boxes, video encoders
- Industrial Control: Automation systems, motor control
- Communication Systems: Protocol processing, data encryption
Technical Support
- Application Engineering: Design consultation services
- Documentation Portal: Comprehensive technical library
- Training Resources: Online courses and webinars
- Community Forums: Peer-to-peer technical discussions
5. Environmental & Export Classifications
RoHS Compliance
- Status: RoHS Compliant (Lead-free)
- Package: Halogen-free option available
- Environmental Standards: WEEE directive compliant
Operating Conditions
- Commercial Temperature: 0ยฐC to +85ยฐC junction temperature
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 85% relative humidity (non-condensing)
Export Classifications
- ECCN: Export Control Classification Number available
- Country of Origin: Manufactured in Xilinx/AMD authorized facilities
- Trade Compliance: Complies with international trade regulations
Quality Standards
- Reliability: Automotive-grade quality processes
- Testing: Comprehensive production testing
- Qualification: JEDEC standard qualification
- Traceability: Full supply chain traceability
Package Information
- Moisture Sensitivity: Level 3 (MSL3)
- Peak Reflow Temperature: 260ยฐC
- Package Marking: Clear device identification
- Handling: ESD sensitive device (Class 1C)
Why Choose XC3S500E-FTG256DG?
The XC3S500E-FTG256DG represents the perfect balance of performance, features, and cost-effectiveness for modern FPGA applications. With its proven Spartan-3E architecture, comprehensive I/O capabilities, and robust development ecosystem, this FPGA enables rapid time-to-market for innovative products across multiple industries.
For technical specifications, pricing quotes, or application support, contact your local authorized Xilinx distributor or visit the AMD Xilinx website for the latest resources and documentation.
