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XC3S500E-FT256: High-Performance Spartan-3E FPGA Solution

Original price was: $20.00.Current price is: $19.00.

The XC3S500E-FT256 is a versatile field-programmable gate array (FPGA) from Xilinx’s proven Spartan-3E family, designed to deliver exceptional performance for cost-sensitive applications. This advanced programmable logic device combines robust functionality with energy efficiency, making it an ideal choice for embedded systems, digital signal processing, and prototype development.

Product Specifications

The XC3S500E-FT256 offers impressive technical capabilities that set it apart in the FPGA market:

Core Architecture:

  • Logic Cells: 500,000 system gates equivalent
  • CLB Array: 46 x 34 Configurable Logic Blocks
  • Total CLBs: 1,164 CLBs providing 4,656 logic cells
  • Distributed RAM: 73 Kbits
  • Block RAM: 360 Kbits (20 blocks of 18 Kbits each)

I/O and Connectivity:

  • Package Type: FT256 (Fine-Pitch Ball Grid Array)
  • User I/O Pins: 190 single-ended I/O pins
  • Differential I/O Pairs: 95 pairs
  • Voltage Standards: Support for multiple I/O standards including LVTTL, LVCMOS, SSTL, HSTL

Performance Characteristics:

  • Operating Voltage: 1.2V core, 1.8V/2.5V/3.3V I/O
  • Maximum Frequency: Up to 300+ MHz internal clock
  • Power Consumption: Optimized for low-power applications
  • Temperature Range: Commercial (0°C to +85°C) and Industrial (-40°C to +100°C) options

Digital Signal Processing:

  • Dedicated Multipliers: 20 embedded 18×18 multipliers
  • DSP Slices: Hardware-optimized for signal processing applications
  • MAC Operations: High-speed multiply-accumulate functions

Price

The XC3S500E-FT256 is competitively priced to provide excellent value for mid-range FPGA applications. Pricing varies based on:

  • Order Quantity: Volume discounts available for large orders
  • Package Grade: Commercial vs. Industrial temperature ratings
  • Speed Grade: Different performance tiers available
  • Lead Time: Standard vs. expedited delivery options

Contact authorized Xilinx distributors for current pricing and availability. Educational discounts may be available for academic institutions and research projects.

Documents & Media

Essential Documentation:

  • Datasheet: Complete electrical and timing specifications
  • User Guide: Comprehensive implementation and design guidelines
  • Package Information: Pin assignments, thermal characteristics, and mechanical drawings
  • Migration Guide: Upgrade paths from older Spartan families
  • Application Notes: Design best practices and optimization techniques

Development Resources:

  • Reference Designs: Pre-built implementations for common applications
  • Evaluation Boards: Hardware platforms for prototyping and testing
  • Design Examples: Sample code and HDL implementations
  • Video Tutorials: Step-by-step design flow demonstrations

Software Tools:

  • ISE Design Suite: Complete development environment
  • ChipScope Pro: On-chip debugging and analysis
  • CORE Generator: IP core integration tools

Related Resources

Compatible Development Tools:

  • Xilinx ISE WebPACK: Free development software for smaller designs
  • ModelSim: Industry-standard simulation environment
  • Synplify Pro: Advanced synthesis tools for optimal results

Evaluation Platforms:

  • Spartan-3E Starter Kit: Complete development board with XC3S500E
  • Custom Carrier Boards: Third-party solutions for specific applications
  • Breadboard-Compatible Modules: Prototyping-friendly form factors

IP Cores and Libraries:

  • MicroBlaze Processor: Soft-core processor implementation
  • Ethernet MAC: Network connectivity solutions
  • Memory Controllers: DDR, DDR2, and SRAM interfaces
  • Communication Protocols: UART, SPI, I2C implementations

Community and Support:

  • Xilinx Forums: Active community for troubleshooting and design tips
  • Application Engineers: Technical support for complex implementations
  • Training Courses: FPGA design methodology and advanced techniques

Environmental & Export Classifications

Environmental Compliance:

  • RoHS Compliant: Meets European restrictions on hazardous substances
  • Lead-Free: Compatible with lead-free soldering processes
  • Halogen-Free: Environmentally conscious packaging materials
  • REACH Compliant: Adheres to European chemical safety regulations

Quality Standards:

  • Automotive Grade: AEC-Q100 qualified versions available
  • Military Standards: Extended temperature and reliability options
  • ISO Certification: Manufacturing under quality management systems

Export Classifications:

  • ECCN: Export Control Classification Number for international shipping
  • Country of Origin: Manufacturing location information for customs
  • Trade Compliance: Adherence to international export regulations
  • Licensing Requirements: Documentation for restricted destinations

Reliability and Testing:

  • MTBF Rating: Mean time between failure specifications
  • Qualification Testing: Extensive environmental and electrical validation
  • Production Testing: 100% functional testing before shipment
  • Traceability: Complete supply chain documentation

The XC3S500E-FT256 represents an excellent balance of performance, cost-effectiveness, and design flexibility, making it suitable for a wide range of applications from industrial automation to communications infrastructure. Its comprehensive ecosystem of tools, documentation, and support resources ensures successful project implementation across various industries and applications.