The XC3S500E-FGG320D is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3E family, designed to deliver exceptional performance for cost-sensitive applications. This versatile programmable logic device combines advanced features with economic efficiency, making the XC3S500E-FGG320D an ideal choice for digital signal processing, embedded processing, and general-purpose logic implementations.
Product Specifications
The XC3S500E-FGG320D features a robust architecture built on advanced silicon technology. This FPGA contains 500,000 system gates with 10,476 logic cells, providing substantial processing capability for complex digital designs. The device includes 360 Kbits of distributed RAM and 360 Kbits of block RAM, offering flexible memory solutions for various applications.
Key technical specifications of the XC3S500E-FGG320D include:
- Logic Cells: 10,476 logic cells for comprehensive digital processing
- System Gates: 500,000 gates supporting complex logic implementations
- I/O Pins: 232 user I/O pins in the FGG320 package
- Memory: 20 dedicated 18Kb block RAMs totaling 360 Kbits
- Multipliers: 20 dedicated 18×18 multipliers for DSP applications
- Clock Management: 4 Digital Clock Managers (DCMs) for precise timing control
- Package Type: Fine-pitch Ball Grid Array (FBGA) 320-pin package
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
The XC3S500E-FGG320D operates at voltages of 1.2V for the core and 3.3V/2.5V/1.8V for I/O, ensuring compatibility with various system requirements while maintaining power efficiency.
Price
Pricing for the XC3S500E-FGG320D varies based on quantity, distributor, and current market conditions. For the most accurate and competitive pricing information, we recommend contacting authorized Xilinx distributors or electronic component suppliers. Volume discounts are typically available for larger orders, making the XC3S500E-FGG320D cost-effective for both prototyping and production applications.
Documents & Media
Comprehensive technical documentation supports the XC3S500E-FGG320D implementation process:
Datasheets: Complete electrical specifications, timing parameters, and package information for the XC3S500E-FGG320D are available in the official Xilinx Spartan-3E datasheet. This document provides detailed pin assignments, electrical characteristics, and recommended operating conditions.
User Guides: Spartan-3E FPGA User Guide offers in-depth information about device architecture, configuration options, and design considerations specific to the XC3S500E-FGG320D.
Application Notes: Xilinx provides numerous application notes covering design best practices, power management, and specific implementation techniques for maximizing XC3S500E-FGG320D performance.
Development Tools: ISE Design Suite supports the XC3S500E-FGG320D with comprehensive synthesis, implementation, and debugging capabilities.
Related Resources
The XC3S500E-FGG320D ecosystem includes various development resources and compatible products:
Development Boards: Several evaluation and development boards feature the XC3S500E-FGG320D, enabling rapid prototyping and design validation. These boards typically include essential peripherals, connectors, and reference designs.
IP Cores: Xilinx offers an extensive library of intellectual property cores optimized for the XC3S500E-FGG320D, including processors, DSP functions, and communication interfaces.
Design Examples: Reference designs and example projects demonstrate optimal XC3S500E-FGG320D utilization across various application domains.
Community Support: Active user communities, forums, and technical support resources provide assistance for XC3S500E-FGG320D-based designs.
Environmental & Export Classifications
The XC3S500E-FGG320D complies with international environmental and regulatory standards:
RoHS Compliance: The device meets Restriction of Hazardous Substances (RoHS) requirements, ensuring environmental responsibility and regulatory compliance.
REACH Regulation: Full compliance with European REACH regulations regarding chemical substances.
Export Classification: The XC3S500E-FGG320D falls under specific export control classifications. Users should verify current export regulations and licensing requirements for their intended applications and destinations.
Operating Environment: Designed for commercial temperature ranges, the XC3S500E-FGG320D operates reliably in standard industrial environments while meeting electromagnetic compatibility (EMC) requirements.
Package Materials: The FGG320 package uses industry-standard materials compatible with standard PCB assembly processes and environmental conditions.
The XC3S500E-FGG320D represents an excellent balance of performance, features, and cost-effectiveness, making it a preferred choice for engineers developing next-generation embedded systems, digital signal processing applications, and custom logic implementations.
