Product Specification
The XC3S500E-5FTG256C is a versatile field-programmable gate array (FPGA) from AMD/Xilinx’s proven Spartan-3E family, engineered for applications demanding high performance and cost-effectiveness. This powerful FPGA combines advanced 90nm CMOS technology with robust feature sets to deliver exceptional value for embedded systems, telecommunications, industrial control, and automotive electronics.
Core Specifications
- Logic Capacity: 500,000 system gates
- Logic Cells: 10,476 cells
- Configurable Logic Blocks (CLBs): 1,164 CLBs
- Maximum Operating Frequency: 657 MHz (up to 200 MHz for typical applications)
- Technology Node: 90nm CMOS
- Supply Voltage: 1.2V
Memory and I/O Features
- Block RAM: Embedded memory blocks for efficient data storage
- RAM Size: 45 kB
- Input/Output Pins: 190 I/O pins
- I/O Standards: Supports a variety of I/O standards for versatile interaction with peripherals
Package Details
- Package Type: 256-Pin FTBGA (Fine-pitch Ball Grid Array)
- Form Factor: 256-ball fine-pitch BGA package makes it ideal for compact designs where space is a concern
- Pin Configuration: Power supply pins (VCCINT, VCCAUX), ground pins (GND, GNDAUX), I/O pins, clock inputs, and configuration pins
Performance Characteristics
- Speed Grade: -5 (commercial temperature range)
- Power Consumption: Optimized for low power usage, making it suitable for battery-operated devices
- Reconfigurability: Can be reprogrammed to adapt to changing requirements or fix issues
Price
The XC3S500E-5FTG256C is competitively priced for the high-performance FPGA market. Price @ 1000 units: $123.33 (reference pricing for similar -4 speed grade variant). Actual pricing varies based on quantity, distributor, and current market conditions. For volume pricing and current availability, contact authorized distributors or request quotes through electronic component distributors.
Pricing Considerations
- Volume discounts available for bulk orders
- Price monitoring available through electronic component search engines
- Historical price trends accessible for purchasing decision support
- Lead times and availability vary by distributor
Documents & Media
Technical Documentation
- Primary Datasheet: Spartan-3E FPGA Family Data Sheet (DS312)
- Product Specification: Comprehensive technical specifications and electrical characteristics
- Application Notes: Design guidelines and best practices
- Reference Manuals: Programming and configuration guides
Development Resources
- Design Tools: Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools
- Programming Support: HDL synthesis and implementation tools
- Configuration Files: Bitstream generation and device programming utilities
Additional Resources
- Pinout diagrams and package drawings
- Application circuit examples
- Power supply design guidelines
- PCB layout recommendations
Related Resources
Development Platforms
Popular development boards compatible with the Spartan-3E family include:
- ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7
- Spartan-3E FPGA Starter Kits
- Evaluation boards for rapid prototyping
Compatible Devices
- XC3S200: A smaller capacity FPGA from the same Spartan-3E family, suitable for less complex applications
- XC3S1000-5FTG384C: Offers additional gates and performance capabilities for more demanding applications
- Alternative Solutions: ICE40LP1K: An alternative FPGA with comparable functionality for specific applications
Competitive Alternatives
- The Altera Cyclone series from Intel (formerly Altera) offers alternatives to Xilinx FPGAs
- Lattice Semiconductor ECP5 series and the Microchip PolarFire FPGAs
Software Tools
- Vivado Design Suite (recommended)
- ISE Design Tools (legacy support)
- ModelSim/QuestaSim for simulation
- ChipScope Pro for debugging
Environmental & Export Classifications
Environmental Specifications
- Operating Temperature Range: Commercial temperature grade (0ยฐC to +85ยฐC junction temperature)
- Storage Temperature: Extended range for storage and shipping
- Package Materials: Lead-free (Pb-free) options available for environmental compliance
- Moisture Sensitivity Level: Appropriate handling and storage requirements
Export Control Classifications
- ECCN (Export Control Classification Number): EAR99
- USHTS (US Harmonized Tariff Schedule): 8542390001
- CNHTS (China Harmonized Tariff Schedule): 8542399000
- TARIC (EU Tariff Classification): 8542399000
Quality and Compliance
- Production Status: Active production device
- Quality Standards: Manufactured to Xilinx/AMD quality standards
- RoHS Compliance: Available in lead-free packages
- Automotive Grade: Extended temperature versions available (XA series)
Applications
The XC3S500E-5FTG256C excels in:
- Embedded systems: Ideal for control systems and hardware accelerators in embedded applications
- Telecommunications, industrial control, and automotive electronics
- Digital signal processing
- Communication protocols implementation
- Custom logic acceleration
- Prototyping and development platforms
This FPGA represents an excellent balance of performance, power efficiency, and cost-effectiveness for mid-range applications requiring substantial logic capacity and high-speed operation.
