The XC3S500E-5FT256C is a versatile and cost-effective FPGA (Field-Programmable Gate Array) from Xilinx’s Spartan-3E family, designed to deliver exceptional performance for a wide range of digital signal processing and embedded system applications. This programmable logic device combines advanced features with competitive pricing, making it an ideal choice for engineers seeking reliable FPGA solutions.
Product Specifications
The XC3S500E-5FT256C offers robust technical specifications that meet demanding application requirements:
Logic Resources:
- System gates: 500,000
- Logic cells: 10,476
- Configurable Logic Blocks (CLBs): 1,164
- Maximum distributed RAM: 73 Kbits
- Block RAM: 360 Kbits (20 blocks)
Memory and Processing:
- Dedicated multipliers: 20 (18×18 bit)
- Maximum user I/O pins: 190
- Digital Clock Manager (DCM) blocks: 4
- Global clock networks: 24
Package and Operating Conditions:
- Package type: FT256 (Fine-pitch Ball Grid Array)
- Operating temperature range: Commercial (0°C to +85°C)
- Speed grade: -5 (high performance)
- Supply voltage: 1.2V core, 3.3V I/O
The XC3S500E-5FT256C features advanced architecture optimized for power efficiency and signal integrity, making it suitable for battery-powered and noise-sensitive applications.
Pricing Information
Pricing for the XC3S500E-5FT256C varies based on quantity, distribution channel, and current market conditions. Contact authorized Xilinx distributors for current pricing and availability information. Volume discounts are typically available for production quantities, and engineering samples may be available for qualifying development projects.
For the most competitive XC3S500E-5FT256C pricing, consider purchasing from established electronic component distributors who maintain stock and offer flexible ordering options.
Documents & Media
Comprehensive technical documentation supports XC3S500E-5FT256C implementation:
Essential Documentation:
- Spartan-3E FPGA Family Data Sheet (DS312)
- XC3S500E-5FT256C Device-specific data sheet
- Spartan-3E FPGA User Guide
- Package and pinout specifications
- AC/DC characteristics and timing specifications
Development Resources:
- Reference designs and application notes
- Power estimation spreadsheets
- PCB layout guidelines for FT256 package
- Vivado Design Suite compatibility information
- Configuration and programming guides
Media Resources:
- High-resolution package drawings
- 3D mechanical models for PCB design
- Thermal simulation models
- IBIS models for signal integrity analysis
All documentation for the XC3S500E-5FT256C is available through Xilinx’s official website and technical support channels.
Related Resources
Maximize your XC3S500E-5FT256C development efficiency with these complementary resources:
Development Tools:
- Xilinx Vivado Design Suite (latest versions)
- ISE Design Suite (legacy support)
- ChipScope Pro for embedded debugging
- System Generator for DSP applications
Evaluation Platforms:
- Spartan-3E Starter Kit
- Compatible third-party development boards
- Custom evaluation modules from design partners
Technical Support:
- Xilinx Answer Database for XC3S500E-5FT256C specific solutions
- Community forums and user groups
- Application engineering support
- Training courses and webinars
Ecosystem Partners:
- Board-level product manufacturers
- IP core providers
- Design service companies
- Educational resources and university programs
The extensive ecosystem surrounding the XC3S500E-5FT256C ensures comprehensive support throughout your development lifecycle.
Environmental & Export Classifications
The XC3S500E-5FT256C meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliant
- Conflict minerals reporting available
- Green packaging standards adherent
Quality and Reliability:
- Automotive qualification available (selected grades)
- Industrial temperature range options
- Extended lifecycle support program
- ISO 9001 certified manufacturing facilities
Export Classifications:
- Export Control Classification Number (ECCN): Varies by configuration
- Country of origin: Multiple manufacturing locations
- Harmonized System (HS) code: 8542.31.0001
- Standard commercial export terms apply
Packaging and Handling:
- Moisture sensitivity level appropriate for package type
- Anti-static handling requirements
- Standard semiconductor packaging practices
- Traceability and lot code identification
The XC3S500E-5FT256C environmental specifications ensure compatibility with modern manufacturing processes and global distribution requirements, supporting your supply chain compliance needs while delivering consistent performance across diverse operating conditions.
Whether you’re developing communications infrastructure, industrial automation systems, or consumer electronics, the XC3S500E-5FT256C provides the flexibility, performance, and reliability needed for successful FPGA-based designs.