Product Specification
The XC3S500E-4FTG256I is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3E family, engineered to deliver exceptional performance for complex digital applications. This advanced FPGA features 500,000 system gates with 10,476 logic cells, providing substantial processing capability for demanding embedded systems and digital signal processing applications.
Key specifications of the XC3S500E-4FTG256I include:
Core Architecture:
- 500K system gates with advanced 90nm process technology
- 10,476 logic cells for complex digital implementations
- 20 dedicated 18×18 multipliers for high-speed arithmetic operations
- 360 Kb of distributed RAM for flexible memory solutions
- 4 Digital Clock Manager (DCM) blocks for precise clock management
I/O and Package:
- 232 user I/O pins in FTG256 Fine-Pitch Ball Grid Array package
- Industrial temperature range (-40°C to +100°C) for harsh environments
- Speed grade -4 for optimized performance characteristics
- 3.3V, 2.5V, 1.8V, and 1.5V I/O voltage support
Memory and Processing:
- 36 dedicated block RAM modules totaling 648 Kb
- Support for various memory configurations and protocols
- Advanced routing architecture for high-speed signal integrity
- Integrated PowerPC processor interface capability
The XC3S500E-4FTG256I excels in applications requiring high logic density, including telecommunications equipment, industrial automation systems, medical devices, and automotive electronics. Its robust industrial-grade specifications make it ideal for mission-critical applications operating in challenging environmental conditions.
Price
The XC3S500E-4FTG256I is competitively priced within the mid-range FPGA market segment. Pricing varies based on quantity, distributor, and current market conditions. For the most current pricing information and volume discounts on the XC3S500E-4FTG256I, contact authorized Xilinx distributors or electronic component suppliers.
Factors affecting XC3S500E-4FTG256I pricing include:
- Order quantity and volume pricing tiers
- Lead times and availability
- Geographic region and local distributor relationships
- Special packaging or testing requirements
Documents & Media
Comprehensive technical documentation supports the XC3S500E-4FTG256I implementation and design process:
Essential Documentation:
- Spartan-3E FPGA Family Complete Data Sheet
- XC3S500E-4FTG256I Product Brief and Specifications
- Spartan-3E FPGA User Guide with detailed architectural information
- Package and Pinout Specifications for FTG256 configuration
- DC and AC Switching Characteristics documentation
Design Resources:
- Xilinx ISE Design Suite compatibility guides
- PCB layout guidelines and reference designs
- Power consumption analysis and thermal management guides
- Configuration and programming documentation
- Application notes for specific implementation scenarios
Development Tools:
- Xilinx Vivado Design Suite support information
- IP core integration guides and libraries
- Simulation models and timing analysis tools
- Hardware debugging and verification resources
Related Resources
The XC3S500E-4FTG256I integrates seamlessly with Xilinx’s comprehensive ecosystem of development tools and support resources:
Development Platforms:
- Spartan-3E Starter Kit for rapid prototyping
- Compatible evaluation boards and reference designs
- Third-party development modules and carrier boards
Software Tools:
- Xilinx Vivado Design Suite for advanced design implementation
- Legacy ISE Design Suite support for existing projects
- ChipScope Pro for real-time hardware debugging
- ModelSim simulation environment compatibility
Technical Support:
- Xilinx Answer Database with searchable solutions
- Community forums and user groups
- Application engineering support for complex implementations
- Training resources and certification programs
Complementary Products:
- Configuration memory devices and programming solutions
- Power management ICs optimized for FPGA applications
- High-speed connectors and interface components
- Clock generation and distribution solutions
Environmental & Export Classifications
The XC3S500E-4FTG256I meets stringent environmental and regulatory standards for global deployment:
Environmental Compliance:
- RoHS compliant lead-free package construction
- REACH regulation compliance for European markets
- Conflict minerals reporting program participation
- ISO 14001 environmental management system certified manufacturing
Operating Specifications:
- Industrial temperature range: -40°C to +100°C junction temperature
- Extended humidity tolerance for diverse environmental conditions
- Vibration and shock resistance meeting industry standards
- Electrostatic discharge (ESD) protection exceeding 2kV HBM
Export and Trade Compliance:
- ECCN (Export Control Classification Number) classification available
- Country-specific import/export documentation support
- Trade compliance screening and restricted party list verification
- Anti-counterfeiting measures and authorized distribution channels
Quality and Reliability:
- Automotive-grade quality standards where applicable
- Extended product lifecycle support and obsolescence management
- Comprehensive reliability testing and qualification data
- Supply chain transparency and traceability programs
The XC3S500E-4FTG256I represents an optimal balance of performance, reliability, and cost-effectiveness for demanding FPGA applications across industrial, communications, and embedded computing markets.
