The XC3S500E-4FT256I is a versatile field-programmable gate array (FPGA) from Xilinx’s Spartan-3E family, designed to deliver exceptional performance for cost-sensitive applications. This industrial-grade FPGA combines advanced features with reliable operation, making it an ideal choice for embedded systems, digital signal processing, and prototyping applications.
Product Specifications
The XC3S500E-4FT256I offers robust technical specifications that meet demanding industrial requirements:
Core Architecture:
- Logic Cells: 500,000 system gates
- Configurable Logic Blocks (CLBs): 1,164 slices
- Distributed RAM: 73 Kb
- Block RAM: 360 Kb (20 blocks ร 18 Kb)
- Dedicated Multipliers: 20 (18ร18 bit)
Performance Characteristics:
- Speed Grade: -4 (high performance)
- Maximum Operating Frequency: Up to 326 MHz
- Package Type: FT256 (Fine-pitch Ball Grid Array)
- Total I/O Pins: 190 user I/O pins
- Temperature Range: Industrial (-40ยฐC to +100ยฐC)
Power and Voltage:
- Core Voltage: 1.2V ยฑ 5%
- I/O Voltage: 1.2V to 3.3V
- Low power consumption with multiple power management modes
The XC3S500E-4FT256I features advanced clock management with up to 4 Digital Clock Managers (DCMs) and supports various I/O standards including LVTTL, LVCMOS, and differential signaling standards.
Price Information
Pricing for the XC3S500E-4FT256I varies based on quantity, supplier, and market conditions. For current pricing and availability:
- Contact authorized Xilinx distributors for volume pricing
- Evaluation quantities typically available through major electronics distributors
- OEM pricing available for high-volume applications
- Consider lead times for industrial-grade components
Pricing factors include package type, speed grade, and temperature range specifications. The industrial temperature range of the XC3S500E-4FT256I may command a premium over commercial-grade alternatives.
Documents & Media
Comprehensive documentation supports the XC3S500E-4FT256I implementation:
Technical Documentation:
- Spartan-3E FPGA Family Data Sheet (DS312)
- XC3S500E-4FT256I Package and Pinout Specifications
- Spartan-3E FPGA User Guide
- PCB Design Guidelines for FT256 Package
Development Resources:
- Xilinx ISE Design Suite compatibility information
- Reference designs and application notes
- Timing and power consumption analysis tools
- Constraint files and design examples
Package Information:
- Mechanical drawings and specifications
- Thermal characteristics and recommendations
- Assembly and soldering guidelines
- Land pattern recommendations for PCB layout
All documentation is available through Xilinx’s official website and authorized distributors, ensuring access to the latest revisions and updates.
Related Resources
The XC3S500E-4FT256I ecosystem includes various supporting components and tools:
Development Tools:
- Xilinx ISE Design Suite (legacy support)
- Vivado Design Suite (migration path)
- ChipScope Pro for debugging
- Third-party synthesis and simulation tools
Compatible Components:
- Configuration memory devices (SPI Flash, PROM)
- Power management ICs optimized for Spartan-3E
- Clock generation and distribution components
- Level shifters and interface circuits
Evaluation Platforms:
- Spartan-3E Starter Kit
- Third-party development boards
- Custom evaluation modules
- Prototyping accessories and expansion modules
Migration and Upgrade Paths:
- Spartan-6 FPGA family for enhanced performance
- Spartan-7 family for current-generation features
- Artix-7 family for advanced applications
Environmental & Export Classifications
The XC3S500E-4FT256I meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Industrial temperature range: -40ยฐC to +100ยฐC
- Moisture sensitivity level: MSL 3
- ESD protection: Human Body Model (HBM) Class 2
Quality and Reliability:
- Automotive qualification available (contact manufacturer)
- Military and aerospace screening options
- Extended temperature range variants available
- Long-term supply commitment for industrial applications
Export Classifications:
- Export Control Classification Number (ECCN): 3A001.a.7
- Subject to export administration regulations
- Consult current export control guidelines
- End-use restrictions may apply
Packaging and Handling:
- Moisture-sensitive device requiring proper storage
- Anti-static handling procedures required
- Tape and reel packaging for automated assembly
- Tray packaging available for prototyping
The XC3S500E-4FT256I combines proven Spartan-3E architecture with industrial-grade reliability, making it suitable for applications requiring long-term availability and robust performance across demanding environmental conditions.
