The XC3S500E-4FGG320CS1 is a powerful field-programmable gate array (FPGA) from Xilinx’s acclaimed Spartan-3E family, designed to deliver exceptional performance for a wide range of digital signal processing and embedded system applications. This commercial-grade FPGA combines advanced features with cost-effective pricing, making it an ideal choice for engineers and developers seeking reliable programmable logic solutions.
Product Specifications
The XC3S500E-4FGG320CS1 offers robust specifications that meet demanding application requirements:
Core Architecture:
- Logic Cells: 500,000 system gates equivalent
- Configurable Logic Blocks (CLBs): 1,164 blocks
- Distributed RAM: 73 Kbits
- Block RAM: 360 Kbits (20 blocks of 18 Kbits each)
- Digital Clock Manager (DCM): 4 units for advanced clock management
I/O and Connectivity:
- Package Type: Fine-pitch Ball Grid Array (FBGA)
- Pin Count: 320 pins in FGG320 package
- User I/O Pins: 232 differential pairs
- Maximum I/O Standards: LVDS, SSTL, HSTL support
- Speed Grade: -4 (high performance)
Processing Capabilities:
- Dedicated Multipliers: 20 embedded 18×18 multipliers
- Maximum Operating Frequency: Up to 326 MHz
- Power Supply: Single 1.2V core, 2.5V/3.3V I/O
- Temperature Range: Commercial grade (0°C to +85°C)
Price
The XC3S500E-4FGG320CS1 is competitively priced in the mid-range FPGA market segment. Pricing varies based on quantity, distribution channel, and current market conditions. For the most current pricing information and volume discounts, we recommend contacting authorized Xilinx distributors or checking official pricing databases. The XC3S500E-4FGG320CS1 typically offers excellent value proposition for applications requiring substantial logic capacity with integrated DSP capabilities.
Documents & Media
Comprehensive technical documentation is available for the XC3S500E-4FGG320CS1:
Primary Documentation:
- Spartan-3E FPGA Family Data Sheet (DS312)
- XC3S500E-4FGG320CS1 Device Specifications
- Spartan-3E FPGA User Guide
- Package and Pinout Information (FGG320 package details)
Development Resources:
- Xilinx ISE Design Suite compatibility information
- Vivado Design Suite migration guidelines
- Reference designs and application notes
- PCB layout guidelines for FGG320 package
Additional Media:
- Product selection guides
- Migration and upgrade documentation
- Power estimation spreadsheets
- Thermal management guidelines
Related Resources
The XC3S500E-4FGG320CS1 ecosystem includes extensive development support:
Development Tools:
- Xilinx ISE WebPACK (free development environment)
- ChipScope Pro for embedded logic analysis
- EDK (Embedded Development Kit) support
- Third-party synthesis tool compatibility
Evaluation Platforms:
- Spartan-3E Starter Kit
- Compatible development boards
- Reference design platforms
- Educational development kits
IP Cores and Libraries:
- LogiCORE IP portfolio compatibility
- DSP and communication IP cores
- Memory controller IP
- Processor cores (MicroBlaze soft processor)
Support Resources:
- Xilinx Answer Database
- Community forums and user groups
- Technical support services
- Training and certification programs
Environmental & Export Classifications
The XC3S500E-4FGG320CS1 meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Commercial temperature range: 0°C to +85°C
- Moisture Sensitivity Level (MSL): Level 3
- Package material: Lead-free solder ball attachment
Export Classifications:
- Export Control Classification Number (ECCN): Consult current export regulations
- Country of Origin: Manufactured in Xilinx-approved facilities
- Compliance with international trade regulations
- Standard commercial export classification
Quality and Reliability:
- Automotive quality standards where applicable
- Extended temperature variants available
- Comprehensive reliability testing
- Long-term product availability commitment
The XC3S500E-4FGG320CS1 represents a mature, well-supported FPGA solution that continues to serve critical applications across telecommunications, industrial automation, automotive, and consumer electronics markets. Its combination of proven architecture, comprehensive tool support, and cost-effective pricing makes it an enduring choice for engineers developing next-generation embedded systems and digital signal processing applications.
