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XC3S500E-4CP132C: High-Performance Spartan-3E FPGA for Embedded Applications

Original price was: $20.00.Current price is: $19.00.

The XC3S500E-4CP132C is a versatile and cost-effective FPGA (Field-Programmable Gate Array) from Xilinx’s Spartan-3E family, designed to deliver exceptional performance for a wide range of embedded and digital signal processing applications. This programmable logic device combines advanced features with an affordable price point, making it an ideal choice for both prototyping and production environments.

Product Specifications

The XC3S500E-4CP132C offers robust specifications that make it suitable for demanding applications:

Core Architecture:

  • Logic Cells: 500,000 system gates
  • Configurable Logic Blocks (CLBs): 1,164
  • Slices: 4,656 (each slice contains two 4-input LUTs and two flip-flops)
  • Block RAM: 360 Kbits total memory
  • Dedicated Multipliers: 20 embedded 18×18 multipliers
  • Maximum User I/O: 92 pins

Package Details:

  • Package Type: CP132 (Chip-Scale Package)
  • Pin Count: 132 pins
  • Speed Grade: -4 (industrial temperature range)
  • Operating Temperature: -40ยฐC to +100ยฐC
  • Package Dimensions: Compact 8mm x 8mm footprint

Performance Characteristics:

  • Maximum Clock Frequency: Up to 326 MHz
  • Power Consumption: Optimized for low-power applications
  • Configuration Memory: External configuration required
  • Programming: In-System Programmable (ISP) capability

The XC3S500E-4CP132C supports various I/O standards including LVTTL, LVCMOS, SSTL, and differential signaling standards, providing flexibility for interfacing with different system components.

Price

The XC3S500E-4CP132C offers excellent value proposition in the mid-range FPGA market. Pricing varies based on quantity and supplier, with typical costs ranging from $15-25 per unit in moderate volumes. For current pricing information and volume discounts, contact authorized Xilinx distributors or check with major electronic component suppliers. Educational institutions and development teams may qualify for special pricing programs.

Documents & Media

Essential documentation for the XC3S500E-4CP132C includes:

Technical Documentation:

  • Spartan-3E Family Datasheet (DS312)
  • XC3S500E-4CP132C Product Brief
  • Spartan-3E FPGA User Guide
  • Package and Pinout Specifications
  • DC and AC Switching Characteristics

Design Resources:

  • ISE Design Suite compatibility documentation
  • Constraint files (.ucf) for CP132 package
  • Reference designs and application notes
  • Power estimation spreadsheets
  • Thermal analysis guidelines

Development Tools:

  • Xilinx ISE WebPACK (free development environment)
  • ChipScope Pro for debugging
  • EDK (Embedded Development Kit) support
  • Third-party synthesis tool compatibility guides

All documentation is available through Xilinx’s official website and authorized distributors, ensuring designers have access to the most current technical information for successful implementation.

Related Resources

The XC3S500E-4CP132C ecosystem includes comprehensive development resources:

Development Boards:

  • Spartan-3E Starter Kit featuring the XC3S500E
  • Third-party evaluation boards optimized for CP132 package
  • Custom carrier boards for specific application requirements

IP Cores and Libraries:

  • Xilinx LogiCORE IP portfolio compatibility
  • DSP and communication protocol IP cores
  • Memory controllers and interface IP
  • Open-source FPGA cores and reference designs

Community Resources:

  • Xilinx Developer Forums and Community Support
  • Application notes covering common implementation scenarios
  • Video tutorials and webinar series
  • University program resources for educational applications

Compatible Components:

  • Configuration memory devices (PROM, Flash)
  • Clock generation and distribution ICs
  • Power management solutions optimized for Spartan-3E
  • Interface transceivers and level shifters

Environmental & Export Classifications

The XC3S500E-4CP132C meets stringent environmental and regulatory standards:

Environmental Compliance:

  • RoHS Compliant (Lead-free manufacturing)
  • WEEE Directive compliance
  • REACH Regulation conformity
  • Conflict Minerals Reporting Template (CMRT) available

Quality Standards:

  • ISO 9001:2015 certified manufacturing
  • Automotive-grade versions available (AEC-Q100 qualified)
  • Industrial temperature range operation (-40ยฐC to +100ยฐC)
  • Humidity and vibration resistance per JEDEC standards

Export Classifications:

  • ECCN (Export Control Classification Number): 3A001.a.7
  • HTS (Harmonized Tariff Schedule): 8542.39.0001
  • Country of Origin: Manufactured in ISO-certified facilities
  • Export licensing requirements vary by destination country

Reliability Specifications:

  • MTBF (Mean Time Between Failures): >1,000,000 hours at 25ยฐC
  • ESD protection: Human Body Model (HBM) Class 2
  • Latch-up immunity: >200mA at 125ยฐC
  • Electrostatic discharge protection built-in

The XC3S500E-4CP132C represents an excellent balance of performance, features, and cost-effectiveness for embedded system designers seeking a reliable FPGA solution. Its comprehensive ecosystem support and proven track record make it a trusted choice for both prototype development and volume production applications.