The XC3S400AN-5FTG256C is a versatile and powerful field-programmable gate array (FPGA) from Xilinx’s Spartan-3AN family, designed to deliver exceptional performance for embedded system applications. This advanced programmable logic device combines high-density architecture with integrated flash memory, making it an ideal solution for cost-sensitive applications requiring reliable, non-volatile configuration storage.
Product Specifications
Core Architecture
The XC3S400AN-5FTG256C features a robust architecture built on proven Spartan-3 technology with significant enhancements. This FPGA incorporates 400,000 system gates with 8,064 logic cells, providing substantial processing capability for complex digital designs. The device includes 360 configurable logic blocks (CLBs) arranged in an 18×20 array, each containing four slices for maximum flexibility in logic implementation.
Memory Resources
Memory capabilities of the XC3S400AN-5FTG256C include 16 dedicated 18Kb block RAM modules, totaling 288 Kb of embedded memory. Additionally, the device features distributed RAM resources within the logic fabric, offering designers multiple memory implementation options. The integrated 4-Mbit SPI serial flash provides non-volatile configuration storage, eliminating the need for external configuration devices.
I/O and Package Details
The XC3S400AN-5FTG256C comes in a 256-ball Fine-Pitch Ball Grid Array (FTBGA) package, offering 195 user I/O pins. This compact form factor measures 17mm x 17mm with a 1.0mm ball pitch, making it suitable for space-constrained applications. The device supports various I/O standards including LVTTL, LVCMOS, SSTL, and differential signaling standards.
Performance Characteristics
Operating at a -5 speed grade, the XC3S400AN-5FTG256C delivers high-performance operation with maximum internal clock frequencies exceeding 200 MHz for typical designs. The device operates across commercial temperature ranges (0°C to +85°C) with core voltage requirements of 1.2V and I/O voltages ranging from 1.2V to 3.3V.
Pricing Information
The XC3S400AN-5FTG256C is competitively priced within the mid-range FPGA market segment. Pricing varies based on order quantities, with volume discounts available for production quantities. For current pricing information and quantity breaks, contact authorized Xilinx distributors or visit the official Xilinx website. Educational institutions and development teams may qualify for special pricing programs.
Typical pricing ranges from $25-45 per unit in moderate quantities, making the XC3S400AN-5FTG256C an cost-effective solution for applications requiring integrated flash configuration and moderate logic density.
Documents & Media
Technical Documentation
Comprehensive documentation for the XC3S400AN-5FTG256C includes detailed datasheets specifying electrical characteristics, timing parameters, and packaging information. The complete data sheet provides DC and AC specifications, power consumption data, and recommended operating conditions.
Design Resources
Development support includes reference designs, application notes, and implementation guides specifically targeting the XC3S400AN-5FTG256C. Xilinx provides comprehensive design methodologies documentation covering synthesis, place-and-route optimization, and timing closure techniques.
Software Tools
The XC3S400AN-5FTG256C is fully supported by Xilinx ISE Design Suite, including synthesis, implementation, and debugging tools. WebPACK versions provide cost-free development environments for smaller designs, while full ISE licenses support advanced optimization features.
Related Resources
Development Boards
Several development platforms feature the XC3S400AN-5FTG256C, including Xilinx Spartan-3AN starter kits and third-party evaluation boards. These platforms provide immediate access to device capabilities with pre-built examples and peripheral interfaces.
Application Examples
Common applications for the XC3S400AN-5FTG256C include digital signal processing, embedded control systems, communications interfaces, and industrial automation. The integrated flash memory makes it particularly suitable for applications requiring instant-on capability and secure configuration storage.
Migration Paths
The XC3S400AN-5FTG256C offers clear migration paths within the Spartan family and to higher-performance Xilinx device families. Pin-compatible options and software compatibility ensure smooth design evolution as requirements change.
Environmental & Export Classifications
Environmental Compliance
The XC3S400AN-5FTG256C meets stringent environmental standards including RoHS compliance for lead-free manufacturing. The device undergoes comprehensive qualification testing including temperature cycling, thermal shock, and moisture sensitivity level (MSL) classification.
Operating Conditions
Environmental operating specifications include commercial temperature grades (0°C to +85°C) with extended temperature variants available. The device demonstrates robust performance across specified voltage and temperature ranges with comprehensive characterization data available.
Export Classification
Export control classifications for the XC3S400AN-5FTG256C comply with current international trade regulations. The device carries appropriate Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) codes for global distribution. Standard commercial distribution channels handle most applications without special licensing requirements.
Quality Standards
Manufacturing quality systems for the XC3S400AN-5FTG256C meet ISO 9001 standards with comprehensive statistical process control and reliability testing. The device undergoes extensive qualification testing following JEDEC standards for semiconductor reliability assurance.
The XC3S400AN-5FTG256C represents an excellent balance of performance, integration, and cost-effectiveness for applications requiring reliable FPGA solutions with integrated non-volatile configuration storage.