Product Specification
The XC3S400AN-5FT256C is a powerful field-programmable gate array (FPGA) from Xilinx’s acclaimed Spartan-3AN family, designed to deliver exceptional performance for embedded applications. This advanced FPGA combines high-density programmable logic with integrated flash memory, making it an ideal solution for space-constrained designs requiring non-volatile configuration storage.
Key Technical Specifications:
- Logic Cells: 400,000 system gates equivalent
- Package Type: FT256 (Fine-Pitch Ball Grid Array)
- Speed Grade: -5 (high-performance variant)
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- Configuration Memory: Integrated In-System Flash
- I/O Standards: Support for multiple voltage levels including LVTTL, LVCMOS, and differential signaling
- CLB (Configurable Logic Block) Count: Optimized for complex digital signal processing applications
- Block RAM: Dedicated memory blocks for efficient data storage and buffering
The XC3S400AN-5FT256C features Xilinx’s innovative Spartan-3AN architecture, which integrates configuration flash memory directly onto the FPGA die. This integration eliminates the need for external configuration devices, reducing board space, component count, and overall system cost while improving reliability.
Price
The XC3S400AN-5FT256C offers exceptional value for high-performance FPGA applications. Pricing varies based on quantity, distribution channel, and current market conditions. For the most current pricing information and volume discounts, contact authorized Xilinx distributors or check with major electronic component suppliers. The integrated flash memory and high logic density provide significant cost savings compared to traditional FPGA plus external flash solutions.
Documents & Media
Technical Documentation:
- Product Data Sheet: Comprehensive specifications and electrical characteristics
- User Guide: Detailed implementation guidelines and design considerations
- Application Notes: Best practices for power management, signal integrity, and thermal design
- Reference Designs: Example implementations demonstrating key features
- Migration Guides: Transition information from other FPGA families
Development Tools:
- ISE Design Suite compatibility for design entry, synthesis, and implementation
- ChipScope Pro support for integrated logic analysis
- Timing analysis tools and constraint guides
- Programming and configuration utilities
Package Information:
- Mechanical drawings and footprint recommendations
- Thermal characteristics and cooling guidelines
- Assembly and soldering specifications for FT256 package
Related Resources
Development Platforms:
- Spartan-3AN Starter Kit for rapid prototyping
- Evaluation boards featuring the XC3S400AN-5FT256C
- Third-party development modules and carrier boards
Software Tools:
- Xilinx ISE WebPACK (free) and ISE Foundation design software
- ModelSim simulation environment integration
- Synthesis tools from Synopsys and other EDA vendors
Support Resources:
- Xilinx Answer Database for troubleshooting
- Community forums and user groups
- Technical support and field application engineer assistance
- Training courses and webinars
Compatible IP Cores:
- MicroBlaze soft processor system
- Digital signal processing (DSP) libraries
- Communication protocol stacks
- Memory controllers and interfaces
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant lead-free package
- REACH regulation compliance
- Conflict minerals reporting available
- Environmental product declarations (EPD) provided
Export Control Information:
- ECCN (Export Control Classification Number): Classified under U.S. export regulations
- Suitable for commercial applications worldwide
- Military and aerospace applications may require additional licensing
- Consult with trade compliance for specific export requirements
Quality Standards:
- Manufactured in ISO 9001 certified facilities
- Automotive qualification available for select variants
- Industrial temperature grade options
- Extended reliability testing and qualification data
The XC3S400AN-5FT256C represents an excellent choice for designers seeking a balance of performance, integration, and cost-effectiveness in their FPGA-based systems. Its combination of high logic density, integrated flash memory, and robust package options makes it suitable for applications ranging from industrial automation to communications infrastructure.
