The XC3S400AN-4FT256I is a powerful Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-3AN family, designed to deliver exceptional performance for embedded applications requiring non-volatile configuration storage and advanced processing capabilities.
Product Specifications
The XC3S400AN-4FT256I features a robust architecture with 400,000 system gates, making it ideal for medium-complexity digital designs. This FPGA incorporates 8,064 logic cells and 360 Kbits of block RAM, providing ample resources for data-intensive applications. The device operates at a -4 speed grade, ensuring reliable performance across demanding operational conditions.
Key technical specifications include a 256-pin Fine-Pitch Ball Grid Array (FTBGA) package measuring 17x17mm, offering excellent thermal characteristics and signal integrity. The XC3S400AN-4FT256I supports 172 user I/O pins with multiple I/O standards including LVTTL, LVCMOS, and differential signaling options. The integrated configuration flash memory eliminates the need for external configuration devices, streamlining board design and reducing system cost.
The XC3S400AN-4FT256I operates across an industrial temperature range of -40°C to +100°C, making it suitable for harsh environmental applications. Power consumption is optimized through advanced process technology, with core voltage requirements of 1.2V and I/O voltages supporting 1.2V to 3.3V levels.
Pricing Information
The XC3S400AN-4FT256I is competitively priced for volume applications, with pricing varying based on order quantities and specific packaging requirements. Contact authorized Xilinx distributors for current pricing information and volume discounts. Educational institutions and qualifying organizations may be eligible for special pricing programs.
Documents & Media
Comprehensive technical documentation is available for the XC3S400AN-4FT256I, including the complete datasheet with electrical specifications, timing parameters, and package information. The Spartan-3AN FPGA Family Data Sheet provides detailed architectural overview and performance characteristics.
Design resources include reference designs, application notes covering configuration methods, power management techniques, and PCB layout guidelines. The Xilinx ISE Design Suite provides complete development tools support for the XC3S400AN-4FT256I, including synthesis, implementation, and debugging capabilities.
Additional resources include IBIS models for signal integrity analysis, thermal models for thermal simulation, and 3D package models for mechanical design verification. These materials ensure designers can effectively implement the XC3S400AN-4FT256I in their applications.
Related Resources
The XC3S400AN-4FT256I is supported by a comprehensive ecosystem of development tools and evaluation platforms. The Spartan-3AN Starter Kit provides an excellent development platform featuring the XC3S400AN-4FT256I along with essential peripherals and interfaces for rapid prototyping.
Compatible IP cores include soft-core processors, DSP functions, communication interfaces, and memory controllers optimized for the Spartan-3AN architecture. Third-party IP vendors offer additional specialized functions extending the capabilities of XC3S400AN-4FT256I-based designs.
Design services and consulting support are available through Xilinx Alliance Program partners, providing expertise in FPGA implementation, verification, and optimization for applications utilizing the XC3S400AN-4FT256I.
Environmental & Export Classifications
The XC3S400AN-4FT256I meets stringent environmental compliance standards including RoHS (Restriction of Hazardous Substances) directive compliance, ensuring lead-free and environmentally responsible manufacturing. The device is manufactured using halogen-free materials and processes.
Export classification for the XC3S400AN-4FT256I follows applicable trade regulations and export control requirements. The device is classified under appropriate Harmonized Tariff Schedule codes and Export Control Classification Numbers (ECCN) as determined by relevant regulatory authorities.
Quality and reliability certifications include automotive-grade options for applications requiring AEC-Q100 qualification. The XC3S400AN-4FT256I undergoes comprehensive testing including temperature cycling, thermal shock, and accelerated aging to ensure long-term reliability in demanding applications.
Manufacturing facilities maintain ISO 9001 quality management certification and follow strict quality control procedures throughout the production process. Traceability systems ensure complete product history documentation for applications requiring detailed quality records.
The XC3S400AN-4FT256I represents an optimal balance of performance, integration, and cost-effectiveness for applications requiring reliable FPGA solutions with non-volatile configuration capabilities.
