Product Specification
The XC3S400AN-4FGG400C is a powerful field-programmable gate array (FPGA) from Xilinx’s Spartan-3AN family, designed to deliver exceptional performance for embedded applications. This advanced FPGA features 400,000 system gates with integrated Flash memory, making it an ideal choice for cost-sensitive applications requiring non-volatile configuration storage.
Key Technical Specifications:
- Logic Cells: 8,064 logic cells providing robust processing capability
- System Gates: 400,000 gates for complex digital designs
- Block RAM: 360 Kbits of embedded memory for data storage
- Package Type: 400-pin Fine-Pitch Ball Grid Array (FBGA)
- Speed Grade: -4 performance grade ensuring reliable operation
- Operating Temperature: Commercial grade (0°C to +85°C)
- Flash Memory: Integrated 4Mb In-System Flash for configuration storage
- I/O Pins: 264 user I/O pins for extensive connectivity options
The XC3S400AN-4FGG400C incorporates Xilinx’s proven FPGA architecture with dedicated multipliers, making it perfect for DSP applications, embedded processing, and system integration projects. Its non-volatile Flash memory eliminates the need for external configuration devices, reducing system cost and complexity.
Price
Pricing for the XC3S400AN-4FGG400C varies based on quantity, supplier, and market conditions. Typical pricing ranges from $45 to $85 per unit for standard quantities, with volume discounts available for larger orders. For current pricing and availability:
- Contact authorized Xilinx distributors for competitive quotes
- Check electronic component marketplaces for real-time pricing
- Consider lead times, as specialized FPGAs may have extended delivery schedules
- Evaluate total cost of ownership including development tools and support
Documents & Media
Essential Documentation:
- Datasheet: Complete electrical specifications, timing parameters, and package information
- User Guide: Comprehensive implementation guidelines and design recommendations
- Migration Guide: Information for upgrading from previous Spartan generations
- Application Notes: Specific use-case implementations and optimization techniques
- Design Files: Reference designs, constraint files, and example projects
Development Resources:
- Xilinx ISE Design Suite compatibility information
- Timing analysis reports and characterization data
- Package drawings and mechanical specifications
- Pin assignment guidelines and I/O planning resources
Related Resources
Development Tools:
- Xilinx ISE WebPACK (free development environment)
- ChipScope Pro for embedded logic analysis
- EDK (Embedded Development Kit) for processor integration
- Third-party synthesis and simulation tools compatibility
Evaluation Platforms:
- Spartan-3AN Starter Kit for rapid prototyping
- Custom evaluation boards from third-party vendors
- Reference designs for common applications
- University program resources for educational use
Technical Support:
- Xilinx Answer Database for troubleshooting
- Community forums and user groups
- Application engineering support
- Training courses and webinars
Environmental & Export Classifications
Environmental Compliance:
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- Lead-Free: Compatible with lead-free soldering processes
- REACH Compliant: Conforms to EU chemical safety regulations
- Operating Temperature: 0°C to +85°C commercial temperature range
- Storage Temperature: -65°C to +150°C for long-term storage
Export Classifications:
- ECCN: 3A991.a.2 (Export Control Classification Number)
- HTS Code: 8542.33.0001 for customs documentation
- Country of Origin: Varies by manufacturing location
- Export License: May require export licensing for certain destinations under EAR regulations
Quality Standards:
- ISO 9001 certified manufacturing processes
- Automotive-grade options available for harsh environments
- Military and aerospace screening available upon request
- Comprehensive quality assurance and reliability testing
The XC3S400AN-4FGG400C represents an excellent balance of performance, integration, and cost-effectiveness for demanding FPGA applications requiring non-volatile configuration storage and robust processing capabilities.
