The XC3S400A-5FGG400C is a versatile Field-Programmable Gate Array (FPGA) from Xilinx’s proven Spartan-3A family, designed to deliver exceptional performance and flexibility for a wide range of digital signal processing and embedded system applications. This FPGA combines advanced programmable logic capabilities with cost-effective implementation, making the XC3S400A-5FGG400C an ideal choice for both prototyping and production environments.
Product Specifications
Core Architecture Features
The XC3S400A-5FGG400C incorporates cutting-edge FPGA technology with the following key specifications:
Logic Capacity & Performance:
- System Gates: 400,000 equivalent gates
- Logic Cells: 8,064 configurable logic cells
- Speed Grade: -5 (high-performance variant)
- Operating Frequency: Up to 326 MHz internal clock frequency
- Package Type: FGG400 – Fine-pitch Ball Grid Array
Memory Resources:
- Block RAM: 360 Kbits total block RAM
- Distributed RAM: Integrated within CLBs for flexible memory implementation
- Memory Blocks: 20 dedicated 18K-bit block RAMs
I/O Capabilities:
- User I/O Pins: 264 user-configurable I/O pins
- Differential Pairs: Support for high-speed differential signaling
- I/O Standards: Compatible with multiple voltage standards including LVTTL, LVCMOS, SSTL, HSTL
Advanced Features:
- Multipliers: 16 dedicated 18×18 multipliers for DSP operations
- Clock Management: Digital Clock Manager (DCM) for precise clock control
- Configuration: Multiple configuration options including JTAG, SPI, and parallel modes
Physical Characteristics
The XC3S400A-5FGG400C features a compact and robust physical design:
- Package: 400-pin Fine-pitch Ball Grid Array (FBGA)
- Package Dimensions: 17mm x 17mm footprint
- Operating Temperature Range: Commercial grade (0ยฐC to +85ยฐC)
- Power Supply: Core voltage 1.2V, I/O voltage 1.2V to 3.3V
Pricing Information
XC3S400A-5FGG400C pricing varies based on quantity and supplier. Current market pricing typically ranges:
- Single Unit: $45-65 USD
- Volume Pricing (100+ units): Contact authorized distributors for competitive volume pricing
- Development Kits: Available through Xilinx partners starting at $199
Pricing subject to change based on market conditions and availability. Contact authorized Xilinx distributors for current pricing and stock availability.
Documents & Media
Technical Documentation
Access comprehensive technical resources for the XC3S400A-5FGG400C:
Datasheets & Specifications:
- XC3S400A-5FGG400C Complete Datasheet (PDF)
- Spartan-3A Family Data Sheet with electrical characteristics
- Package and pinout documentation
- DC and switching characteristics specifications
Design Resources:
- PCB layout guidelines and reference designs
- Schematic symbols and PCB footprints
- Signal integrity guidelines for high-speed designs
- Power supply design recommendations
Software Tools:
- Xilinx ISE Design Suite compatibility information
- Vivado Design Suite migration guides
- IP core integration documentation
- Programming and configuration guides
Application Notes & Tutorials
- Getting started guide for XC3S400A-5FGG400C development
- Digital signal processing implementation examples
- Clock domain crossing best practices
- Power optimization techniques
Related Resources
Development Tools & Kits
Accelerate your XC3S400A-5FGG400C development with these recommended resources:
Development Boards:
- Spartan-3A Starter Kit featuring XC3S400A
- Custom evaluation boards from third-party vendors
- Prototyping boards with XC3S400A-5FGG400C integration
Software & IP:
- Xilinx ISE WebPACK (free development environment)
- Pre-verified IP cores for common functions
- Reference designs for communications and DSP applications
Compatible Components
- Configuration Memory: SPI Flash memory devices
- Power Management: Switching regulators optimized for FPGA applications
- Oscillators: Low-jitter clock sources compatible with DCM requirements
- Connectors: High-speed connectors for I/O expansion
Technical Support
- Xilinx Answer Database with XC3S400A-5FGG400C specific solutions
- Community forums and user groups
- Application engineering support through authorized distributors
- Training courses and webinars
Environmental & Export Classifications
Environmental Compliance
The XC3S400A-5FGG400C meets stringent environmental and quality standards:
RoHS Compliance:
- Fully compliant with RoHS (Restriction of Hazardous Substances) directive
- Lead-free solder ball construction
- Halogen-free package materials available
Quality Standards:
- ISO 9001:2015 certified manufacturing
- Automotive grade versions available (AEC-Q100 qualified)
- Industrial temperature range options
Export Control Classification
Export Control Information:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Varies by manufacturing location
Shipping & Handling:
- Standard anti-static packaging for semiconductor protection
- Moisture sensitivity level (MSL) classification
- Proper handling procedures documented in packaging specifications
Reliability & Testing
The XC3S400A-5FGG400C undergoes comprehensive testing to ensure reliable operation:
- 100% functional testing at final test
- Temperature cycling and thermal shock testing
- Electrostatic discharge (ESD) protection built-in
- Expected MTBF (Mean Time Between Failures) data available
The XC3S400A-5FGG400C represents proven FPGA technology suitable for demanding applications requiring high performance, flexibility, and reliability. Contact authorized Xilinx distributors for technical support, pricing, and availability information.
