Product Specification
The XC3S400A-5FGG320C is a powerful Field-Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-3A family, designed to deliver exceptional performance for cost-sensitive applications. This versatile programmable logic device features 400,000 system gates and operates at a speed grade of -5, making it ideal for digital signal processing, embedded control, and communication systems.
Key Technical Specifications:
- Logic Cells: 8,064 equivalent logic cells
- System Gates: 400,000 gates
- Block RAM: 360 Kbits total memory
- Distributed RAM: 126 Kbits
- Multipliers: 16 dedicated 18×18 multipliers
- Maximum User I/O: 264 pins
- Package Type: 320-pin Fine-Pitch Ball Grid Array (FBGA)
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- Supply Voltage: 1.2V core, 3.3V I/O
The XC3S400A-5FGG320C incorporates advanced architectural features including Digital Clock Managers (DCMs) for precise clock management and dedicated carry logic for high-speed arithmetic operations. Its abundant I/O resources and flexible routing architecture make it suitable for complex digital designs requiring high pin counts and sophisticated interconnectivity.
Price
Pricing for the XC3S400A-5FGG320C varies based on quantity, distribution channel, and current market conditions. Typically, unit prices range from $15 to $35 for standard commercial quantities, with volume discounts available for orders exceeding 1,000 pieces. Educational institutions and development projects may qualify for special pricing programs.
For current pricing and availability, contact authorized Xilinx distributors such as Digi-Key, Mouser Electronics, or Arrow Electronics. Lead times generally range from 2-12 weeks depending on inventory levels and manufacturing schedules.
Documents & Media
Technical Documentation:
- Datasheet: Complete electrical specifications, timing parameters, and package information
- User Guide: Comprehensive design guidelines and implementation recommendations
- Programming Guide: Configuration options and bitstream generation procedures
- Application Notes: Design optimization techniques and reference implementations
- Errata Sheet: Known device limitations and recommended workarounds
Development Resources:
- ISE Design Suite: Integrated development environment for FPGA design
- Reference Designs: Pre-verified IP cores and example projects
- Simulation Models: VHDL and Verilog behavioral models
- Package Files: CAD footprints and 3D models for PCB design
- Programming Files: Configuration utilities and drivers
All documentation is available through the Xilinx Support Portal and product-specific download pages, ensuring designers have access to the latest revisions and updates.
Related Resources
Compatible Development Boards:
- Spartan-3A Starter Kit for rapid prototyping
- Custom evaluation boards from third-party vendors
- Educational development platforms for academic applications
Software Tools:
- Xilinx ISE: Complete design flow from HDL synthesis to bitstream generation
- ChipScope Pro: Integrated logic analyzer for real-time debugging
- CORE Generator: IP core customization and integration tool
- iMPACT: Device programming and configuration software
IP Cores and Libraries:
- Digital signal processing functions
- Communication protocol stacks
- Memory controllers and interfaces
- Soft-core processors (MicroBlaze, PicoBlaze)
Third-Party Support:
- Hardware description language compilers
- Verification and simulation tools
- Board-level design services
- Training and consulting resources
The XC3S400A-5FGG320C benefits from extensive ecosystem support, including active user communities, online forums, and technical support channels that facilitate successful project implementation.
Environmental & Export Classifications
Environmental Compliance:
The XC3S400A-5FGG320C meets stringent environmental standards including RoHS (Restriction of Hazardous Substances) compliance, ensuring lead-free manufacturing processes and materials. The device is also REACH compliant, adhering to European chemical safety regulations.
Operating Conditions:
- Temperature Range: 0ยฐC to +85ยฐC (commercial grade)
- Humidity: 85% relative humidity maximum
- Altitude: Up to 2,000 meters operational
- Shock/Vibration: MIL-STD-883 qualified
Export Control Classification:
- ECCN: 3A001.a.7 (Electronics Technology)
- HTS Code: 8542.39.0001
- Country of Origin: Varies by manufacturing location
Quality Standards:
- Automotive: AEC-Q100 qualified versions available
- Industrial: Extended temperature variants (-40ยฐC to +100ยฐC)
- Military: Screened versions meeting MIL-PRF-38535 requirements
The device packaging utilizes environmentally friendly materials and manufacturing processes, supporting sustainable electronics design practices while maintaining high reliability and performance standards required for demanding applications.
XC3S400A-5FGG320C represents an optimal balance of features, performance, and cost-effectiveness for FPGA-based designs across telecommunications, automotive, industrial automation, and consumer electronics markets.
