The XC3S400A-4FT256I is a versatile and cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s acclaimed Spartan-3A family. This industrial-grade device delivers exceptional performance and flexibility for a wide range of digital signal processing, control, and communication applications.
Product Specifications
The XC3S400A-4FT256I features robust specifications designed for demanding industrial environments:
Core Architecture:
- Logic Cells: 8,064 system gates with 400,000 equivalent gates
- CLB Array: 22 x 22 Configurable Logic Blocks
- Block RAM: 360 Kbits total embedded memory
- Distributed RAM: 56 Kbits
- Multipliers: 20 dedicated 18×18 hardware multipliers
- DCM Units: 4 Digital Clock Managers for precise timing control
Package & I/O:
- Package Type: FT256 (Fine-pitch Ball Grid Array)
- Total I/O Pins: 195 user I/O pins
- Operating Temperature Range: -40°C to +100°C (Industrial grade)
- Speed Grade: -4 (standard performance)
Power & Performance:
- Supply Voltage: 1.2V core, 3.3V I/O
- Low power consumption optimized for battery-powered applications
- High-speed operation suitable for real-time processing
Pricing Information
The XC3S400A-4FT256I offers excellent value for industrial FPGA applications. Pricing varies based on quantity and supplier, with typical ranges from authorized distributors starting around $15-25 per unit for production quantities. For current pricing and availability, contact authorized Xilinx distributors or electronic component suppliers.
Cost-Effective Benefits:
- Competitive pricing in the mid-range FPGA segment
- Lower total system cost through integration capabilities
- Reduced development time with proven architecture
Documents & Media
Essential documentation for the XC3S400A-4FT256I includes:
Technical Documentation:
- Spartan-3A FPGA Family Data Sheet
- XC3S400A-4FT256I Product Brief
- Packaging and Pinout Specifications
- AC/DC Characteristics and Timing Parameters
Design Resources:
- Xilinx ISE Design Suite compatibility guides
- Reference designs and application notes
- PCB layout guidelines for FT256 package
- Signal integrity design recommendations
Software Tools:
- ISE WebPACK (free development environment)
- ChipScope Pro for debugging
- EDK (Embedded Development Kit) support
Related Resources
The XC3S400A-4FT256I integrates seamlessly with various development tools and complementary products:
Development Boards:
- Spartan-3A Starter Kit
- Third-party evaluation boards
- Custom development platforms
Compatible Products:
- Other Spartan-3A family members (XC3S50A to XC3S1400A)
- Xilinx configuration memories
- Power management solutions
Application Areas:
- Industrial automation and control
- Digital signal processing systems
- Communication infrastructure
- Automotive electronics
- Medical device applications
Environmental & Export Classifications
The XC3S400A-4FT256I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS Compliant: Lead-free manufacturing process
- REACH Regulation: Compliant with EU chemical safety standards
- Operating Temperature: -40°C to +100°C industrial range
- Storage Temperature: -65°C to +150°C
- Humidity Tolerance: Up to 85% relative humidity
Quality Standards:
- Automotive Grade: AEC-Q100 qualified versions available
- Industrial Grade: Extended temperature and reliability testing
- Quality Management: ISO 9001 certified manufacturing
Export Classifications:
- ECCN (Export Control Classification Number): 3A001
- HTS (Harmonized Tariff Schedule): 8542.39.0001
- Country of Origin: Varies by manufacturing location
- Export compliance with international trade regulations
The XC3S400A-4FT256I represents an ideal balance of performance, cost, and reliability for industrial FPGA applications. Its proven architecture, comprehensive development support, and robust environmental specifications make it an excellent choice for demanding embedded system designs.
