The XC3S400A-4FGG400I is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3A family, designed to deliver exceptional performance for digital signal processing, embedded systems, and complex logic applications. This versatile FPGA combines high-speed operation with cost-effective implementation, making it an ideal choice for engineers developing cutting-edge electronic solutions.
Product Specifications
Core Architecture
The XC3S400A-4FGG400I features a robust architecture built on advanced 90nm process technology, delivering superior performance and power efficiency:
Logic Resources:
- Logic Cells: 8,064 equivalent logic cells
- System Gates: 400,000 system gates
- Configurable Logic Blocks (CLBs): 896 CLBs
- Slices: 3,584 slices (4 slices per CLB)
- 4-input LUTs: 7,168 lookup tables
- Flip-Flops: 7,168 flip-flops
Memory Capabilities:
- Block RAM: 360 Kbits total block RAM
- Block RAM Blocks: 20 dedicated 18Kb block RAMs
- Distributed RAM: Configurable as distributed memory using LUTs
DSP and Multiplication:
- Dedicated Multipliers: 16 embedded 18×18 multipliers
- DSP Slices: Optimized for digital signal processing applications
- MAC Operations: Hardware-accelerated multiply-accumulate functions
I/O and Connectivity:
- User I/O Pins: 264 user I/O pins
- Package Type: 400-pin Fine-Pitch Ball Grid Array (FBGA)
- I/O Standards: Support for multiple I/O standards including LVTTL, LVCMOS, SSTL, HSTL
- Differential I/O Pairs: High-speed differential signaling capability
Clock Management:
- Digital Clock Managers (DCMs): 4 DCMs for advanced clock synthesis
- Clock Frequency: Up to 320+ MHz internal clock frequencies
- Phase-Locked Loops: Integrated clock generation and management
Performance Specifications:
- Speed Grade: -4 (high-performance grade)
- Operating Temperature: Industrial grade (-40°C to +100°C)
- Supply Voltage: 1.2V core, 2.5V/3.3V I/O
- Power Consumption: Optimized for low-power applications
Pricing Information
XC3S400A-4FGG400I Pricing:
- Unit Price (1-99 qty): Contact manufacturer for current pricing
- Volume Pricing: Significant discounts available for quantities 100+
- Educational Pricing: Special rates available for academic institutions
- Distributors: Available through authorized Xilinx distributors worldwide
Note: Pricing varies based on quantity, lead time, and market conditions. Contact your local distributor for current pricing and availability.
Documents & Media
Technical Documentation
Datasheet and Reference Materials:
- XC3S400A-4FGG400I Official Datasheet (PDF)
- Spartan-3A FPGA Family Data Sheet
- DC and AC Switching Characteristics
- Package Mechanical Drawings and Pinout Information
Design Resources:
- ISE Design Suite compatibility documentation
- Vivado Design Suite migration guides
- Constraint files (.ucf format)
- Reference designs and application notes
Programming and Configuration:
- Configuration memory requirements
- Programming cable compatibility (Platform Cable USB, JTAG)
- Bitstream generation guidelines
- Multi-boot configuration options
Development Tools
- ISE WebPACK: Free development environment
- ChipScope Pro: Logic analyzer for debugging
- EDK (Embedded Development Kit): For embedded processor designs
- System Generator: MATLAB/Simulink integration
Related Resources
Development Boards and Kits
Recommended Evaluation Platforms:
- Spartan-3A Starter Kit
- Spartan-3A DSP Starter Kit
- Custom development boards from third-party vendors
Compatible Components
Memory Interfaces:
- DDR/DDR2 SDRAM controllers
- SRAM interface implementations
- Flash memory programming solutions
Communication Protocols:
- Ethernet MAC implementations
- USB 2.0 interface cores
- SPI, I2C, UART communication blocks
- PCIe endpoint implementations
Processing Cores:
- MicroBlaze soft processor
- Third-party processor IP cores
- Custom DSP processing blocks
Software and IP Cores
Free IP Cores:
- LogiCORE IP from Xilinx
- Open-source HDL libraries
- Community-developed cores
Premium IP Solutions:
- High-speed communication protocols
- Advanced DSP functions
- Cryptographic acceleration cores
Environmental & Export Classifications
Environmental Compliance
RoHS Compliance:
- The XC3S400A-4FGG400I is fully RoHS compliant
- Lead-free package and assembly process
- Environmentally friendly manufacturing
Operating Conditions:
- Temperature Range: -40°C to +100°C (Industrial grade)
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters above sea level
Reliability Standards:
- JEDEC qualification standards
- Automotive AEC-Q100 compatible versions available
- Military and aerospace grade variants (contact Xilinx)
Export and Trade Classifications
Export Control Information:
- ECCN (Export Control Classification Number): 5A002
- Schedule B Number: 8542.31.0001
- Country of Origin: Varies by manufacturing location
- REACH Compliance: EU REACH regulation compliant
Import/Export Considerations:
- Subject to US export administration regulations
- May require export licenses for certain destinations
- Dual-use technology restrictions may apply
- Consult with legal counsel for specific export requirements
Quality and Certifications
Manufacturing Standards:
- ISO 9001:2015 certified manufacturing
- Six Sigma quality processes
- Comprehensive testing and validation procedures
Industry Certifications:
- CE marking for European markets
- FCC compliance for electronic equipment
- UL recognition for safety standards
The XC3S400A-4FGG400I represents an excellent balance of performance, features, and cost-effectiveness for FPGA-based designs. Its robust architecture, comprehensive I/O capabilities, and extensive development ecosystem make it suitable for a wide range of applications from industrial automation to telecommunications infrastructure.
For technical support, design consultation, or volume pricing inquiries, contact your authorized Xilinx distributor or visit the official Xilinx website for the latest resources and documentation.
