The XC3S250E-5FT256C is a versatile and cost-effective FPGA (Field-Programmable Gate Array) from Xilinx’s renowned Spartan-3E family. This programmable logic device delivers exceptional performance for a wide range of applications, from consumer electronics to industrial automation systems. The XC3S250E-5FT256C combines advanced features with an affordable price point, making it an ideal choice for both prototype development and volume production.
Product Specifications
The XC3S250E-5FT256C offers robust technical specifications designed to meet demanding application requirements:
Core Architecture:
- Logic Cells: 250,000 system gates
- Configurable Logic Blocks (CLBs): 1,164 CLBs
- Distributed RAM: 18 Kbits
- Block RAM: 216 Kbits (12 blocks of 18 Kbits each)
- Digital Clock Manager (DCM): 4 DCMs for advanced clock management
I/O and Connectivity:
- User I/O Pins: 172 I/O pins
- Package Type: FT256 (Fine-Pitch Ball Grid Array)
- Speed Grade: -5 (high-performance option)
- Operating Voltage: 1.2V core, 3.3V I/O
- Temperature Range: Commercial (0ยฐC to +85ยฐC)
Performance Features:
- Maximum frequency: Up to 326 MHz
- Low power consumption with advanced power management
- Support for multiple I/O standards including LVTTL, LVCMOS, and differential signaling
- Integrated multiply-accumulate functions for DSP applications
The XC3S250E-5FT256C supports various configuration modes and includes built-in boundary scan testing capabilities for enhanced debugging and manufacturing test coverage.
Price
The XC3S250E-5FT256C is competitively priced to provide excellent value for embedded system designers and engineers. Pricing varies based on order quantity, packaging options, and current market conditions. For the most current pricing information and volume discounts on the XC3S250E-5FT256C, please contact authorized Xilinx distributors or visit official pricing portals. Educational institutions and startups may be eligible for special pricing programs.
Documents & Media
Comprehensive technical documentation is available for the XC3S250E-5FT256C to support your design and development process:
Technical Documentation:
- XC3S250E-5FT256C Datasheet with complete electrical specifications
- Spartan-3E FPGA Family User Guide
- Configuration and Programming Guidelines
- Package and Pinout Documentation (FT256 BGA package details)
- PCB Design Guidelines and Layout Recommendations
Development Resources:
- Reference designs and application notes
- Timing analysis and constraint files
- Power consumption analysis tools and calculators
- Migration guides from other FPGA families
Software and Tools:
- Xilinx ISE Design Suite compatibility information
- Synthesis and implementation flow documentation
- Debugging and verification methodologies
- Programming cable and configuration device specifications
All documentation for the XC3S250E-5FT256C is available through the official Xilinx website and authorized distributor portals.
Related Resources
The XC3S250E-5FT256C ecosystem includes numerous supporting components and development resources:
Development Boards:
- Spartan-3E Starter Kit featuring the XC3S250E-5FT256C
- Third-party evaluation boards and development platforms
- Custom carrier boards and reference designs
Configuration Devices:
- Platform Flash PROMs for non-volatile configuration storage
- Serial Flash memory options for configuration data
- JTAG programming and debugging interfaces
IP Cores and Libraries:
- Xilinx LogiCORE intellectual property for common functions
- Digital signal processing (DSP) libraries optimized for Spartan-3E
- Communication protocol stacks and interface controllers
- Math and algorithm libraries for embedded processing
Design Tools:
- Xilinx ISE WebPACK (free development software)
- Third-party synthesis and simulation tools
- Hardware description language (HDL) development environments
- Constraint and timing analysis utilities
The XC3S250E-5FT256C integrates seamlessly with industry-standard development workflows and tool chains.
Environmental & Export Classifications
The XC3S250E-5FT256C meets stringent environmental and regulatory standards for global deployment:
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant
- REACH regulation compliance for European markets
- Conflict minerals reporting compliance
- Halogen-free package options available upon request
Operating Conditions:
- Commercial temperature range: 0ยฐC to +85ยฐC
- Industrial temperature variants available
- Humidity tolerance: Up to 95% non-condensing
- Shock and vibration resistance per industry standards
Export Control Classifications:
- Export Control Classification Number (ECCN): 3A001.a.7
- Subject to U.S. Export Administration Regulations (EAR)
- Country-specific export licensing requirements may apply
- Dual-use technology classification for international shipping
Quality and Reliability:
- Automotive-grade versions available (AEC-Q100 qualified)
- Military and aerospace grade options for critical applications
- Extended lifecycle support and long-term availability programs
- Comprehensive quality assurance and testing procedures
The XC3S250E-5FT256C undergoes rigorous testing and qualification processes to ensure reliable operation across diverse environmental conditions and applications. For specific regulatory requirements in your target market, consult with Xilinx support or authorized distributors to ensure proper compliance documentation and certifications.
