The XC3S250E-4TQ144I is a versatile and cost-effective FPGA (Field-Programmable Gate Array) from Xilinx’s Spartan-3E family, designed to deliver exceptional performance for embedded systems, digital signal processing, and prototyping applications. This industrial-grade device combines advanced programmable logic capabilities with robust environmental specifications, making it ideal for demanding applications across telecommunications, automotive, and industrial automation sectors.
Product Specifications
Core Architecture
The XC3S250E-4TQ144I features a comprehensive set of specifications that make it suitable for complex digital designs:
Logic Resources:
- 250,000 system gates equivalent
- 5,888 logic cells with 4-input look-up tables (LUTs)
- 360 CLB (Configurable Logic Block) slices
- 12 dedicated multipliers (18×18-bit)
- 216 Kbits of distributed RAM
Memory Configuration:
- 216 Kbits block RAM organized in 12 dedicated blocks
- Each block RAM provides 18 Kbits of true dual-port memory
- Supports various memory configurations including FIFO, ROM, and RAM modes
I/O Capabilities:
- 108 user I/O pins in TQFP-144 package
- Support for multiple I/O standards including LVTTL, LVCMOS, SSTL, and HSTL
- Advanced I/O features with programmable drive strength and slew rate control
Performance Specifications:
- Speed grade: -4 (standard performance)
- Maximum operating frequency up to 326 MHz
- Low power consumption with multiple power management modes
- Industrial temperature range: -40ยฐC to +100ยฐC
Package Details:
- TQFP-144 (Thin Quad Flat Pack) package
- 144-pin surface-mount configuration
- Compact 20mm x 20mm footprint
- Lead-free and RoHS compliant construction
Price Information
The XC3S250E-4TQ144I offers excellent value for mid-range FPGA applications. Pricing varies based on quantity, distribution channel, and current market conditions. For the most current pricing information and volume discounts, contact authorized Xilinx distributors or semiconductor suppliers. Educational discounts may be available for qualifying institutions and students working on academic projects.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical specifications, timing parameters, and package information
- User Guide: Comprehensive programming and configuration instructions
- Application Notes: Design guidelines, best practices, and implementation examples
- Errata: Known issues and recommended workarounds
Development Resources
- Reference Designs: Pre-built designs for common applications
- IP Core Library: Ready-to-use intellectual property blocks
- Evaluation Boards: Development platforms featuring the XC3S250E-4TQ144I
- Software Tools: ISE Design Suite compatibility information
Multimedia Resources
- Video Tutorials: Step-by-step programming and design implementation guides
- Webinar Recordings: Technical presentations and application-specific content
- 3D Package Models: CAD files for mechanical design integration
Related Resources
Development Tools
The XC3S250E-4TQ144I is fully supported by Xilinx’s comprehensive development ecosystem:
ISE Design Suite: Complete design environment supporting HDL synthesis, implementation, and debugging for the XC3S250E-4TQ144I. The software includes integrated simulation tools, timing analysis, and power estimation capabilities.
Configuration Options: Multiple programming methods including JTAG boundary scan, master/slave serial modes, and parallel configuration interfaces ensure flexible system integration.
Compatible Devices
- XC3S200E series: Pin-compatible alternatives with different logic densities
- XC3S400E-4TQ144I: Higher-density option in the same package
- XC3S100E-4TQ144I: Lower-cost alternative for smaller designs
Application Areas
The XC3S250E-4TQ144I excels in numerous application domains:
Digital Signal Processing: Real-time filtering, FFT processing, and audio/video processing applications benefit from the dedicated multipliers and block RAM resources.
Communications: Protocol processing, packet filtering, and software-defined radio implementations leverage the high-speed I/O capabilities.
Industrial Control: Motor control, sensor interfacing, and real-time control systems utilize the deterministic timing and robust I/O features.
Embedded Processing: Soft processor implementations and custom instruction set architectures take advantage of the flexible logic resources.
Environmental & Export Classifications
Environmental Specifications
The XC3S250E-4TQ144I meets stringent environmental standards for industrial applications:
Operating Conditions:
- Junction temperature range: -40ยฐC to +100ยฐC
- Supply voltage: 1.2V core, 3.3V I/O (with 2.5V and 1.8V I/O support)
- Humidity: Up to 85% relative humidity, non-condensing
- Altitude: Up to 2000 meters above sea level
Reliability Standards:
- JEDEC qualification testing compliance
- Electrostatic discharge (ESD) protection exceeding 2kV HBM
- Latch-up immunity greater than 200mA
- MTBF (Mean Time Between Failures) exceeding 1 million hours
Compliance Certifications
- RoHS Compliant: Lead-free construction meeting European environmental standards
- REACH Regulation: Compliance with European chemical safety requirements
- Conflict Minerals: Responsible sourcing certification
- ISO 14001: Environmental management system compliance
Export Control Information
The XC3S250E-4TQ144I is subject to various export control regulations:
ECCN Classification: Specific Export Control Classification Number assigned by relevant authorities Country Restrictions: Certain destination countries may require additional licensing End-Use Considerations: Military and dual-use applications may require special export permits
Licensing Requirements: Consult with trade compliance specialists for specific export scenarios involving the XC3S250E-4TQ144I, particularly for international shipments or sensitive applications.
The XC3S250E-4TQ144I represents an excellent balance of performance, features, and cost-effectiveness for FPGA-based designs. Its comprehensive specification set, robust environmental ratings, and extensive development ecosystem support make it an ideal choice for engineers developing next-generation embedded systems and digital processing applications.
