The XC3S250E-4PQ208C is a versatile field-programmable gate array (FPGA) from Xilinx’s proven Spartan-3E family, designed to deliver exceptional performance for cost-sensitive applications. This FPGA combines advanced features with reliable operation, making it an ideal choice for engineers developing digital signal processing, embedded control, and communication systems.
Product Specifications
Core Architecture
The XC3S250E-4PQ208C features a robust architecture built on advanced 90nm process technology, delivering optimal power efficiency and performance:
- Logic Cells: 250,000 system gates equivalent
- Configurable Logic Blocks (CLBs): 1,164 CLBs containing 4,656 logic cells
- Block RAM: 216 Kbits of fast, dual-port block RAM
- Distributed RAM: 58 Kbits for flexible memory implementation
- Digital Clock Managers (DCMs): 4 DCMs for advanced clock management
- I/O Standards: Support for over 20 single-ended and differential I/O standards
Package and Performance
- Package Type: 208-pin Plastic Quad Flat Pack (PQFP)
- Speed Grade: -4 (commercial temperature range)
- Operating Temperature: 0ยฐC to +85ยฐC (commercial grade)
- Supply Voltage: 1.2V core, 3.3V I/O
- Maximum User I/O Pins: 158 pins available for user applications
Key Features
The XC3S250E-4PQ208C incorporates several advanced features that enhance design flexibility and system performance:
- Dedicated Multipliers: 12 embedded 18×18 multipliers for efficient DSP operations
- IEEE 1149.1 JTAG Boundary Scan: Built-in testability and debugging support
- Configuration Options: Multiple configuration modes including master/slave serial and parallel
- Low-Power Design: Optimized for battery-powered and portable applications
- SelectRAM+ Memory: Hierarchical memory architecture for optimal resource utilization
Price
Current Market Price: Contact authorized distributors for competitive pricing on the XC3S250E-4PQ208C. Volume discounts are typically available for quantities over 100 units.
Price Factors:
- Quantity breaks available at 25, 100, 500, and 1,000+ units
- Lead times vary based on current inventory levels
- Custom packaging options may affect pricing
- Extended temperature variants available at premium pricing
Note: Pricing subject to change based on market conditions and availability. Contact sales representatives for current quotations.
Documents & Media
Technical Documentation
Essential resources for implementing the XC3S250E-4PQ208C in your designs:
Datasheets & Specifications:
- XC3S250E Complete Product Specification (DS312)
- Spartan-3E FPGA Family Data Sheet
- Package thermal characteristics and mechanical drawings
- DC and switching characteristics specifications
Design Guides:
- Spartan-3E FPGA User Guide covering architecture details
- Configuration and readback procedures
- Power management and thermal design guidelines
- PCB design considerations and layout recommendations
Application Notes:
- Clock management best practices using DCMs
- Memory interface implementation guides
- I/O standards selection and implementation
- Power optimization techniques and strategies
Software Resources
- Xilinx ISE Design Suite: Complete development environment
- IP Core Generator: Pre-verified intellectual property blocks
- ChipScope Pro: Advanced debugging and analysis tools
- Reference designs: Proven starting points for common applications
Related Resources
Development Tools
Accelerate your XC3S250E-4PQ208C development with these recommended tools and resources:
Hardware Platforms:
- Spartan-3E Starter Kit featuring the XC3S500E (pin-compatible upgrade path)
- Custom evaluation boards from third-party vendors
- Socket adapters for prototyping and testing
Software Tools:
- Xilinx Platform Studio for embedded processor development
- ModelSim simulation environment for comprehensive verification
- Third-party synthesis tools including Synplify Pro
Learning Resources:
- Online training modules covering FPGA design fundamentals
- University program materials and courseware
- Community forums and technical support resources
- Webinar series on advanced FPGA design techniques
Compatible Products
The XC3S250E-4PQ208C integrates seamlessly with various system components:
- Memory Interfaces: DDR, DDR2, SRAM, and Flash memory controllers
- Communication Protocols: Ethernet, USB, PCIe, and serial interfaces
- Analog Front-Ends: ADC and DAC interface circuits
- Power Management: Switching regulators and linear power supplies
Environmental & Export Classifications
Environmental Compliance
The XC3S250E-4PQ208C meets stringent environmental standards ensuring reliable operation across diverse applications:
RoHS Compliance: Fully compliant with EU Restriction of Hazardous Substances directive, containing no lead, mercury, cadmium, hexavalent chromium, or brominated flame retardants above specified thresholds.
REACH Regulation: Compliant with EU REACH (Registration, Evaluation, Authorization of Chemicals) requirements for safe chemical use.
Conflict Minerals: Certified conflict-free sourcing in accordance with Dodd-Frank Act Section 1502 requirements.
Export Classifications
ECCN (Export Control Classification Number): 3A001.a.7
- Subject to Export Administration Regulations (EAR)
- May require export license depending on destination country
- Consult current Bureau of Industry and Security guidelines
Country of Origin: Manufactured in ISO-certified facilities with full traceability HS Code: 8542.39.0001 for customs and import documentation
Temperature Classifications:
- Commercial Grade: 0ยฐC to +85ยฐC junction temperature
- Moisture Sensitivity Level: MSL-3 requiring proper handling and storage
- Thermal Resistance: ฮธJA = 44ยฐC/W in still air conditions
Quality and Reliability
The XC3S250E-4PQ208C undergoes comprehensive testing to ensure long-term reliability:
- Qualification Standards: Meets JEDEC standards for semiconductor reliability
- MTBF Rating: Greater than 1 million hours under normal operating conditions
- ESD Protection: Human Body Model (HBM) rating exceeding 2kV
- Latch-up Immunity: Tested to JEDEC standard JESD78
The XC3S250E-4PQ208C represents proven FPGA technology with the flexibility and performance needed for demanding applications. Contact authorized distributors or Xilinx representatives for technical support, pricing information, and availability updates.
