The XC3S200AN-4FT256I is a versatile and cost-effective FPGA (Field-Programmable Gate Array) from Xilinx’s renowned Spartan-3AN series, designed to deliver exceptional performance for a wide range of embedded system applications. This industrial-grade programmable logic device combines flexibility, reliability, and advanced features to meet demanding design requirements.
Product Specifications
The XC3S200AN-4FT256I offers robust technical specifications that make it ideal for various digital signal processing and control applications:
Core Architecture:
- Logic Cells: 200,000 system gates equivalent
- CLB Array: 896 Configurable Logic Blocks
- Block RAM: 216 Kbits of embedded memory
- Distributed RAM: 12 Kbits
- Multipliers: 12 dedicated 18×18 multipliers
I/O and Connectivity:
- User I/O Pins: 172 available pins
- Package Type: FT256 (Fine-Pitch Ball Grid Array)
- Pin Count: 256 pins total
- Voltage Standards: Support for multiple I/O standards including LVTTL, LVCMOS, and differential signaling
Performance Characteristics:
- Speed Grade: -4 (indicating high-performance timing)
- Operating Temperature: Industrial range (-40ยฐC to +100ยฐC)
- Supply Voltage: 1.2V core, 3.3V I/O
- Maximum Frequency: Up to 320 MHz internal clock speeds
Special Features:
- Integrated configuration memory (AN series advantage)
- IEEE 1149.1 JTAG boundary scan support
- Clock management with Digital Clock Managers (DCMs)
- Advanced power management capabilities
Pricing Information
The XC3S200AN-4FT256I is competitively priced to provide excellent value for mid-range FPGA applications. Pricing varies based on quantity, distributor, and market conditions:
Estimated Price Range:
- Single unit: $45-65 USD
- Volume pricing (100+ units): $35-50 USD
- Production quantities (1000+): Contact authorized distributors for volume discounts
Availability: The XC3S200AN-4FT256I is available through authorized Xilinx distributors, electronic component suppliers, and major online electronics retailers. Lead times typically range from 2-12 weeks depending on current inventory levels and demand.
Documents & Media
Essential documentation and resources for the XC3S200AN-4FT256I include:
Technical Documentation:
- Product datasheet with complete electrical specifications
- Spartan-3AN FPGA User Guide detailing architecture and features
- Package and pinout documentation for FT256 package
- DC and switching characteristics specifications
- Configuration and programming guidelines
Design Resources:
- Reference designs and application notes
- Development board schematics and layouts
- PCB design guidelines and recommendations
- Signal integrity considerations for high-speed designs
Software Tools:
- ISE Design Suite compatibility information
- Constraint files and timing models
- Simulation models for various EDA tools
- Programming and debugging utilities
Related Resources
The XC3S200AN-4FT256I ecosystem includes comprehensive development tools and support materials:
Development Platforms:
- Spartan-3AN evaluation boards and starter kits
- Third-party development modules and breakout boards
- Educational and prototyping platforms
Design Tools:
- Xilinx ISE Design Suite (legacy support)
- IP core libraries and reference designs
- Timing analysis and optimization tools
- Hardware debugging and verification tools
Community and Support:
- Xilinx community forums and knowledge base
- Application engineer support and consultation
- Training materials and video tutorials
- Technical webinars and design workshops
Compatible Products:
- Other Spartan-3AN family members for scalable designs
- Complementary Xilinx products for system-level solutions
- Third-party IP cores and development tools
Environmental & Export Classifications
The XC3S200AN-4FT256I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS Compliant: Lead-free and environmentally friendly manufacturing
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC junction temperature)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity Tolerance: Up to 85% relative humidity (non-condensing)
- Altitude Rating: Up to 2000 meters operational altitude
Quality and Reliability:
- MTBF Rating: High reliability with extensive qualification testing
- Package Moisture Sensitivity: MSL (Moisture Sensitivity Level) 3
- Electrostatic Discharge: HBM (Human Body Model) Class 2 protection
- Latch-up Immunity: JEDEC-compliant latch-up resistance
Export and Trade Classifications:
- ECCN (Export Control Classification Number): 3A001.a.2.a
- HTS (Harmonized Tariff Schedule): 8542.39.0001
- Country of Origin: Manufactured in Xilinx certified facilities
- Export Restrictions: Subject to applicable export control regulations
Certifications:
- ISO 9001 quality management system compliance
- JEDEC standards conformance for package and testing
- Automotive grade versions available for AEC-Q100 applications
The XC3S200AN-4FT256I represents an excellent choice for engineers seeking a reliable, high-performance FPGA solution that balances capability with cost-effectiveness. Its comprehensive feature set, industrial-grade reliability, and extensive ecosystem support make it suitable for applications ranging from digital signal processing to embedded control systems.
