The XC3S200A-5FG320C is a versatile field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3A family, designed to deliver exceptional performance for cost-sensitive digital signal processing and embedded applications. This FPGA combines advanced programmable logic capabilities with robust design features, making it an ideal choice for engineers developing complex digital systems.
Product Specifications
Core Architecture
The XC3S200A-5FG320C features a comprehensive architecture built on proven Spartan-3A technology:
Logic Resources:
- 200,000 system gates capacity
- 4,320 logic cells for flexible design implementation
- 432 configurable logic blocks (CLBs) arranged in a 24 x 18 array
- Each CLB contains four slices with dedicated carry logic and RAM capability
Memory Configuration:
- 216 Kb total block RAM organized in 12 dedicated blocks
- 18 Kb per block RAM module for efficient data storage
- Distributed RAM capability using LUT resources
- Support for single-port and dual-port RAM configurations
Input/Output Capabilities:
- 264 user I/O pins in FG320 package configuration
- LVTTL, LVCMOS, SSTL, and HSTL I/O standard support
- Differential signaling support including LVDS and RSDS
- Hot-swappable I/O capability for system flexibility
Clock Management:
- Four Digital Clock Manager (DCM) blocks
- Clock multiplication, division, and phase shifting
- Duty cycle correction and deskew functionality
- Up to 16 global clock networks for distribution
Package Details:
- FG320 Fine-Pitch Ball Grid Array (FBGA) package
- 320-pin configuration with 1.0mm ball pitch
- Compact 17mm x 17mm package size
- -5 speed grade for enhanced performance timing
Pricing Information
The XC3S200A-5FG320C is competitively priced to support volume production requirements. Pricing varies based on order quantity, lead time, and distributor selection. For current pricing information:
- Contact authorized Xilinx distributors for volume quotes
- Educational discounts available through university programs
- Development kit pricing available for prototyping phases
- Long-term supply agreements supported for production planning
Typical price ranges fall within industry-standard FPGA pricing tiers, offering excellent value for the feature set and performance capabilities provided by the XC3S200A-5FG320C.
Documents & Media
Technical Documentation
Datasheet Resources:
- Complete XC3S200A-5FG320C datasheet with electrical specifications
- Spartan-3A family overview documentation
- Package and pinout reference guides
- AC/DC characteristics and timing specifications
Design Resources:
- Xilinx ISE Design Suite compatibility information
- Constraint file templates for FG320 package
- Reference designs and application notes
- PCB layout guidelines and recommendations
Software Support:
- ISE WebPACK free design software support
- ChipScope Pro debugging tool compatibility
- IP core library access and integration guides
- Simulation model files for popular simulators
Development Tools
- Spartan-3A development boards and kits
- Programming cable compatibility information
- JTAG boundary scan support documentation
- Configuration memory interface specifications
Related Resources
Compatible Products
Development Platforms:
- Spartan-3A DSP evaluation boards
- Custom development kits featuring XC3S200A-5FG320C
- Prototyping platforms with expansion capabilities
- Educational training boards for learning applications
Supporting Components:
- Configuration memory devices (Platform Flash, SPI Flash)
- Power management solutions optimized for Spartan-3A
- Clock generation and distribution components
- Interface and connectivity solutions
Application Areas
The XC3S200A-5FG320C excels in diverse application domains:
Digital Signal Processing:
- Audio and video processing applications
- Communications signal conditioning
- Image processing and enhancement systems
- Real-time filtering and transformation operations
Embedded Control Systems:
- Industrial automation and control
- Motor control and power management
- Sensor interface and data acquisition
- Protocol conversion and communication bridges
Educational and Research:
- University coursework and research projects
- Algorithm development and prototyping
- Hardware design training and certification
- Academic research in reconfigurable computing
Environmental & Export Classifications
Environmental Specifications
Operating Conditions:
- Commercial temperature range: 0ยฐC to +85ยฐC ambient
- Extended temperature variants available upon request
- RoHS compliant lead-free package construction
- Halogen-free package materials for environmental compliance
Reliability Standards:
- JEDEC qualification testing completed
- Moisture sensitivity level (MSL) classification provided
- Electrostatic discharge (ESD) protection integrated
- Long-term reliability data available for mission-critical applications
Export and Regulatory Compliance
Classification Information:
- Export Control Classification Number (ECCN) documented
- Country of origin marking and compliance
- International shipping and customs documentation
- Regional regulatory approval status
Quality Certifications:
- ISO 9001 manufacturing quality standards
- Automotive qualification available for specific variants
- Military and aerospace screening options
- Third-party quality verification and testing
The XC3S200A-5FG320C represents an optimal balance of performance, features, and cost-effectiveness for modern FPGA applications. Its comprehensive feature set, combined with extensive development tool support and documentation, makes it an excellent choice for both prototyping and production deployment across multiple industry segments.
