The XC3S200A-4FTG256I is a versatile field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3A family, designed to deliver exceptional performance for cost-sensitive applications. This advanced programmable logic device combines high functionality with energy efficiency, making it ideal for telecommunications, industrial automation, consumer electronics, and embedded system designs.
Product Specifications
The XC3S200A-4FTG256I features robust technical specifications that meet demanding application requirements:
Core Architecture:
- Logic Cells: 200,000 system gates
- Configurable Logic Blocks (CLBs): 1,792 slices
- Block RAM: 216 Kbits total memory
- Distributed RAM: 25 Kbits
- Multipliers: 12 dedicated 18×18 multipliers
- Digital Clock Managers (DCMs): 4 units
I/O and Connectivity:
- Package Type: FTG256 (Fine-Pitch BGA)
- Total I/O Pins: 195 user I/O pins
- Differential I/O Pairs: 68 pairs
- Speed Grade: -4 (commercial temperature range)
- Operating Temperature: 0ยฐC to +85ยฐC (commercial grade)
Power and Performance:
- Supply Voltage: 1.2V core, 3.3V I/O
- Low power consumption design
- High-speed performance up to 326 MHz
- Advanced power management features
The XC3S200A-4FTG256I incorporates Xilinx’s proven 90nm process technology, ensuring reliable operation across various environmental conditions while maintaining optimal power efficiency.
Price Information
Pricing for the XC3S200A-4FTG256I varies based on quantity, supplier, and market conditions. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities. The competitive cost structure of the Spartan-3A family makes the XC3S200A-4FTG256I an economical choice for high-volume applications.
Documents & Media
Essential documentation and resources for the XC3S200A-4FTG256I include:
Technical Documentation:
- Official datasheet with complete electrical specifications
- Pin configuration and package diagrams
- DC and AC electrical characteristics
- Timing specifications and performance data
- Programming and configuration guidelines
Design Resources:
- Reference designs and application notes
- PCB layout guidelines for FTG256 package
- Power supply design recommendations
- Thermal management guidelines
- Migration guides from other FPGA families
Development Tools:
- ISE Design Suite compatibility information
- Synthesis and implementation flow documentation
- Debugging and verification resources
- IP core integration guides
All documentation is available through Xilinx’s official website and authorized distribution channels, ensuring designers have access to the most current technical information for successful XC3S200A-4FTG256I implementation.
Related Resources
The XC3S200A-4FTG256I ecosystem includes comprehensive development resources:
Development Boards:
- Spartan-3A starter kits featuring the XC3S200A
- Evaluation boards for rapid prototyping
- Reference design platforms
Compatible IP Cores:
- Memory controllers and interfaces
- Communication protocol implementations
- Digital signal processing cores
- Embedded processor solutions
Design Tools:
- Xilinx ISE Design Suite support
- Third-party synthesis and simulation tools
- Programming and configuration utilities
- Power analysis and optimization tools
Technical Support:
- Application engineering assistance
- Online forums and community resources
- Training materials and tutorials
- Migration support services
These resources accelerate development time and ensure successful implementation of XC3S200A-4FTG256I designs across various applications.
Environmental & Export Classifications
The XC3S200A-4FTG256I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free)
- WEEE directive compliance
- Green packaging initiatives
- Conflict minerals reporting
Quality Standards:
- Automotive grade options available
- Industrial temperature range variants
- Military and aerospace qualified versions
- ISO 9001 certified manufacturing
Export Classifications:
- ECCN (Export Control Classification Number) compliance
- International trade regulation adherence
- Country-specific import/export documentation
- Customs classification codes
Reliability Testing:
- Extended temperature cycling
- Humidity and moisture sensitivity testing
- Electrostatic discharge (ESD) protection
- Long-term reliability validation
The XC3S200A-4FTG256I environmental classifications ensure global deployment capability while meeting regional regulatory requirements. Proper handling and storage guidelines maintain device integrity throughout the supply chain and manufacturing process.
The XC3S200A-4FTG256I represents an optimal balance of performance, cost, and flexibility for modern FPGA applications, backed by Xilinx’s industry-leading support and development ecosystem.
