The XC3S1600E-4FGG400CS1 is a high-performance Field-Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-3E family. This versatile programmable logic device delivers exceptional performance and flexibility for a wide range of digital design applications, making it an ideal choice for engineers and developers seeking reliable, cost-effective FPGA solutions.
Product Specifications
Core Features
- Device Family: Xilinx Spartan-3E
- Logic Cells: 1,600,000 system gates
- Package Type: Fine-pitch Ball Grid Array (FBGA)
- Pin Count: 400 pins
- Speed Grade: -4 (Commercial grade)
- Operating Temperature: 0ยฐC to +85ยฐC (Commercial)
- Supply Voltage: 1.2V core, 3.3V I/O
Technical Specifications
- Configurable Logic Blocks (CLBs): 3,688
- Distributed RAM: 231 Kb
- Block RAM: 648 Kb (36 blocks)
- Digital Clock Manager (DCM): 8 units
- Maximum User I/O: 376 pins
- Differential I/O Pairs: 185
- Package Dimensions: 17mm x 17mm
- Ball Pitch: 0.8mm
Performance Characteristics
- Maximum Frequency: Up to 200+ MHz
- Power Consumption: Low-power CMOS technology
- Configuration Time: Fast configuration via multiple interfaces
- Supported I/O Standards: LVTTL, LVCMOS, SSTL, HSTL, and differential standards
Price Information
The XC3S1600E-4FGG400CS1 pricing varies based on quantity and supplier. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for orders exceeding 100 units. Educational institutions may qualify for special academic pricing programs.
Pricing Factors:
- Order quantity (unit vs. volume pricing)
- Lead time requirements
- Packaging options (tape and reel vs. tray)
- Geographic location and distributor
Documents & Media
Official Documentation
- Datasheet: XC3S1600E complete specifications and electrical characteristics
- User Guide: Spartan-3E FPGA Family Complete Data Sheet
- Application Notes: Design guidelines and best practices
- Package Information: Mechanical drawings and footprint recommendations
Development Resources
- ISE Design Suite: Compatible development environment
- Reference Designs: Example projects and code samples
- Simulation Models: IBIS and timing models
- CAD Symbols: Schematic symbols and PCB footprints
Training Materials
- Webinars: Spartan-3E design tutorials
- Quick Start Guides: Getting started with XC3S1600E-4FGG400CS1
- Video Tutorials: Step-by-step implementation guides
- White Papers: Advanced design techniques and optimization strategies
Related Resources
Compatible Development Boards
- Spartan-3E Starter Kit
- Spartan-3E Evaluation Platform
- Custom evaluation boards from third-party vendors
Software Tools
- Xilinx ISE WebPACK: Free development software
- ChipScope Pro: Logic analyzer for debugging
- System Generator: MATLAB/Simulink integration
- EDK (Embedded Development Kit): Embedded processor design
Support Services
- Technical Support: Xilinx Answer Database and forums
- Design Services: Professional consulting and support
- Training Programs: Hands-on workshops and certification courses
- Application Engineering: Direct technical assistance
Complementary Products
- Configuration Devices: Platform Flash PROMs
- Clock Management: Clock generators and buffers
- Power Management: Voltage regulators and power modules
- Interface Devices: Level shifters and signal conditioning
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- REACH Compliant: Complies with EU chemical regulations
- Halogen-Free: Environmentally friendly packaging materials
- MSL Rating: Moisture Sensitivity Level classification available
Export Control Information
- ECCN: Export Control Classification Number as per US regulations
- Country of Origin: Manufacturing location details
- Export Restrictions: Subject to US Export Administration Regulations (EAR)
- Documentation: Required export/import certificates and declarations
Quality Standards
- ISO Certification: Manufactured under ISO 9001 quality management
- Automotive Grade: AEC-Q100 qualified versions available
- Military Grade: Extended temperature and screening options
- Quality Assurance: Comprehensive testing and reliability programs
Packaging & Shipping
- Electrostatic Discharge (ESD): Proper ESD handling procedures
- Packaging Options: Anti-static packaging and moisture barrier bags
- Shipping Classifications: Proper handling and transportation requirements
- Storage Conditions: Temperature and humidity specifications for long-term storage
The XC3S1600E-4FGG400CS1 represents Xilinx’s commitment to providing high-quality, reliable FPGA solutions for demanding applications. For the most current technical specifications, pricing, and availability, consult authorized Xilinx distributors or visit the official Xilinx website.
