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XC3S1600E-4FGG320I: High-Performance Spartan-3E FPGA for Advanced Digital Applications

Original price was: $20.00.Current price is: $19.00.

Product Specification

The XC3S1600E-4FGG320I is a powerful member of Xilinx’s Spartan-3E FPGA family, designed to deliver exceptional performance for cost-sensitive applications. This field-programmable gate array combines advanced silicon technology with comprehensive design tools to provide an ideal solution for digital signal processing, embedded processing, and general-purpose logic applications.

Key Technical Specifications:

  • Logic Cells: 1,600,000 system gates equivalent
  • Package Type: FGG320 (Fine-pitch Ball Grid Array)
  • Speed Grade: -4 (industrial temperature range)
  • Operating Temperature: -40ยฐC to +100ยฐC (Industrial grade)
  • Supply Voltage: 1.2V core, 3.3V I/O
  • Configurable Logic Blocks (CLBs): 3,688 slices
  • Block RAM: 648 Kbits distributed across 36 blocks
  • Dedicated Multipliers: 36 embedded 18×18 multipliers
  • I/O Pins: 264 user I/O pins
  • Digital Clock Managers (DCMs): 8 units for advanced clocking
  • Maximum Operating Frequency: Up to 250 MHz

The XC3S1600E-4FGG320I features enhanced memory capabilities and improved power efficiency compared to previous generations, making it suitable for battery-powered and thermally-constrained applications.

Price

Pricing for the XC3S1600E-4FGG320I varies based on quantity, distributor, and current market conditions. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for orders exceeding 100 units. Lead times may vary depending on global supply chain conditions.

Documents & Media

Essential Documentation:

  • XC3S1600E-4FGG320I Datasheet (DS312)
  • Spartan-3E FPGA Family Complete Data Sheet
  • Package and Pinout Specifications
  • PCB Design Guidelines for FGG320 Package
  • Spartan-3E FPGA User Guide (UG331)
  • ISE Design Suite Documentation
  • Application Notes for Spartan-3E Implementation
  • Thermal and Power Management Guidelines

Development Tools:

  • Xilinx ISE Design Suite (legacy support)
  • Vivado Design Suite (for migration projects)
  • ChipScope Pro Analyzer for debugging
  • Reference designs and example projects

Related Resources

Compatible Development Boards:

  • Spartan-3E Starter Kit
  • Third-party evaluation boards featuring XC3S1600E
  • Custom PCB reference designs

Software Tools:

  • Xilinx ISE WebPACK (free version)
  • ISE Foundation (full version)
  • ModelSim simulation software
  • Synplify synthesis tools

Technical Support:

  • Xilinx Community Forums
  • Application Engineering support
  • Training courses and webinars
  • Design consultation services

Migration Path: For new designs, consider migrating to current-generation FPGAs such as the Artix-7 or Spartan-7 families, which offer improved performance, lower power consumption, and continued long-term support.

Environmental & Export Classifications

Environmental Compliance:

  • RoHS Compliant (Lead-free package available)
  • REACH Regulation compliant
  • Conflict Minerals compliant
  • ISO 14001 environmental management certified manufacturing

Operating Conditions:

  • Operating Temperature Range: -40ยฐC to +100ยฐC (Industrial)
  • Storage Temperature: -65ยฐC to +150ยฐC
  • Humidity: 5% to 95% non-condensing
  • Altitude: Up to 3,000 meters

Reliability Standards:

  • JEDEC standards compliant
  • Automotive qualification available (contact factory)
  • Military temperature screening options

Export Classifications:

  • ECCN (Export Control Classification Number): 3A001.a.7
  • Country of Origin: Varies by manufacturing location
  • Export licensing requirements may apply for certain destinations
  • Consult current export regulations before international shipment

Quality Certifications:

  • ISO 9001:2015 quality management
  • AS9100 aerospace quality standard
  • IPC standards for electronic assemblies

The XC3S1600E-4FGG320I represents a mature, proven FPGA solution ideal for applications requiring reliable performance in demanding environmental conditions. While this device is part of a legacy product family, it continues to provide excellent value for established designs and applications where long-term availability and cost optimization are priorities.