The XC3S1600E-4FG484C is a powerful Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-3E family, designed to deliver exceptional performance for cost-sensitive applications. This advanced programmable logic device combines high-density architecture with versatile I/O capabilities, making it an ideal choice for digital signal processing, embedded processing, and system integration projects.
Product Specifications
Core Architecture
The XC3S1600E-4FG484C features a robust architecture built on advanced 90nm process technology, delivering superior performance while maintaining power efficiency. This FPGA incorporates 1,600,000 system gates with 33,280 logic cells, providing ample resources for complex digital designs.
Key Technical Specifications:
- Device Family: Spartan-3E
- Logic Cells: 33,280
- System Gates: 1,600,000
- Block RAM: 648 Kbits (36 blocks of 18 Kbits each)
- Distributed RAM: 416 Kbits
- Multipliers: 36 dedicated 18×18 multipliers
- Maximum User I/O: 376 pins
- Package Type: Fine-pitch Ball Grid Array (FBGA)
- Pin Count: 484 pins
- Speed Grade: -4 (high performance)
- Operating Voltage: 1.2V core, 2.5V/3.3V I/O
Package and Thermal Characteristics
The XC3S1600E-4FG484C utilizes a 484-pin Fine-pitch Ball Grid Array (FG484) package measuring 23mm x 23mm, optimized for high-density PCB layouts. The device operates reliably across commercial temperature ranges from 0ยฐC to +85ยฐC, ensuring consistent performance in various environmental conditions.
Performance Features
This FPGA delivers exceptional clock performance with maximum frequencies exceeding 300 MHz for internal logic operations. The integrated Digital Clock Manager (DCM) provides advanced clock synthesis, phase shifting, and frequency multiplication capabilities, enabling precise timing control for demanding applications.
Pricing Information
Current Market Pricing for XC3S1600E-4FG484C:
- Single Unit Price: Contact authorized distributors for current pricing
- Volume Pricing: Available for quantities of 100+ units
- OEM Pricing: Custom pricing available for high-volume production runs
Note: Pricing varies based on market conditions, quantity, and supplier. Contact authorized Xilinx distributors or AMD (Xilinx) directly for the most current pricing information and availability.
Documents & Media
Technical Documentation
Datasheet: Complete electrical specifications, AC/DC characteristics, and package information for the XC3S1600E-4FG484C are available in the Spartan-3E FPGA Family Data Sheet (DS312).
User Guides:
- Spartan-3E FPGA User Guide (UG331)
- Spartan-3E FPGA Configuration User Guide (UG332)
- Spartan-3E FPGA PCB Design and Pin Planning Guide
Development Tools
Vivado Design Suite: Modern development environment supporting the XC3S1600E-4FG484C with comprehensive synthesis, implementation, and debugging capabilities.
ISE Design Suite: Legacy development tools specifically optimized for Spartan-3E family devices, including the XC3S1600E-4FG484C.
Application Notes
- Power Management techniques for Spartan-3E FPGAs
- High-Speed Design considerations for FG484 package
- Clock Domain Crossing best practices
Related Resources
Development Boards
Spartan-3E Starter Kit: Entry-level development platform featuring the XC3S1600E-4FG484C, complete with essential peripherals, expansion connectors, and comprehensive documentation.
Third-Party Development Boards: Various commercial and open-source development platforms supporting the XC3S1600E-4FG484C are available from multiple vendors.
IP Cores and Reference Designs
- MicroBlaze soft processor configurations optimized for XC3S1600E-4FG484C
- DSP IP cores leveraging the integrated multiplier blocks
- Communication protocol implementations (UART, SPI, I2C, Ethernet)
- Video processing reference designs
Software Tools
- Xilinx Platform Studio (XPS) for embedded system development
- ChipScope Pro for advanced debugging and signal analysis
- ModelSim simulation tools for design verification
Community Resources
- Xilinx Community Forums for XC3S1600E-4FG484C support
- Application-specific design examples and tutorials
- Technical support documentation and troubleshooting guides
Environmental & Export Classifications
Environmental Compliance
The XC3S1600E-4FG484C meets stringent environmental standards and regulatory requirements:
RoHS Compliance: Fully compliant with RoHS (Restriction of Hazardous Substances) directive, containing no prohibited materials including lead, mercury, cadmium, hexavalent chromium, or brominated flame retardants.
REACH Regulation: Compliant with European REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals) requirements for chemical substance management.
Conflict Minerals: Manufactured using conflict-free materials in accordance with Dodd-Frank Act Section 1502 requirements.
Operating Environment
- Temperature Range: Commercial grade (0ยฐC to +85ยฐC junction temperature)
- Humidity: Non-condensing environments up to 95% relative humidity
- Altitude: Operational up to 3,000 meters above sea level
- Shock and Vibration: Meets JEDEC standards for semiconductor device reliability
Export Classifications
ECCN (Export Control Classification Number): The XC3S1600E-4FG484C is classified under ECCN 3A001.a.7, subject to Export Administration Regulations (EAR).
HTS Code: Harmonized Tariff Schedule classification for international trade documentation and customs processing.
Country of Origin: Manufactured in facilities compliant with international quality standards and export control requirements.
Licensing Requirements: Standard commercial export licensing applies; specific restrictions may apply for certain end-users or destinations. Consult current export control regulations for detailed requirements.
The XC3S1600E-4FG484C represents an excellent balance of performance, features, and cost-effectiveness for FPGA-based system designs. Its comprehensive feature set, robust development ecosystem, and proven reliability make it a preferred choice for engineers developing next-generation electronic systems across automotive, industrial, communications, and consumer electronics applications.
