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XC3S1400AN-5FGG676I: High-Performance Spartan-3AN FPGA for Advanced Applications

Original price was: $20.00.Current price is: $19.00.

The XC3S1400AN-5FGG676I is a powerful field-programmable gate array (FPGA) from Xilinx’s Spartan-3AN family, designed to deliver exceptional performance and flexibility for a wide range of electronic applications. This advanced FPGA combines high logic density with integrated flash memory, making it an ideal choice for cost-sensitive designs requiring non-volatile configuration storage.

Product Specifications

Core Features of XC3S1400AN-5FGG676I

The XC3S1400AN-5FGG676I offers impressive technical specifications that make it suitable for demanding applications:

Logic Resources:

  • 1,400,000 system gates capacity
  • 29,504 logic cells for complex digital designs
  • 126 user I/O pins for extensive connectivity options
  • 32 dedicated multipliers for high-speed arithmetic operations

Memory Architecture:

  • 576 Kbits of distributed SelectRAM memory
  • 1,728 Kbits of block SelectRAM for data storage
  • Integrated In-System Flash memory for configuration storage
  • Non-volatile configuration eliminates external boot memory requirements

Package and Environmental Specifications:

  • FGG676 package type with fine-pitch BGA footprint
  • Industrial temperature range: -40ยฐC to +100ยฐC
  • Speed grade: -5 (high performance)
  • RoHS compliant for environmental sustainability

Clock Management:

  • Digital Clock Manager (DCM) for precise timing control
  • Multiple clock domains support
  • Low-jitter clock distribution networks

Pricing Information

The XC3S1400AN-5FGG676I pricing varies based on quantity and supplier. Contact authorized Xilinx distributors for current pricing:

  • Small quantities (1-99 units): Contact for quote
  • Volume pricing (100+ units): Significant discounts available
  • Production quantities (1000+ units): Custom pricing options

Note: Prices subject to change based on market conditions and availability. Request official quotes from authorized distributors for accurate pricing.

Documents & Media

Technical Documentation for XC3S1400AN-5FGG676I

Datasheets and Specifications:

  • Spartan-3AN FPGA Family Complete Data Sheet
  • XC3S1400AN-5FGG676I Product Brief
  • DC and AC Switching Characteristics
  • Package thermal characteristics and mechanical drawings

Design Resources:

  • Spartan-3AN FPGA User Guide
  • Configuration User Guide for In-System Flash
  • Design methodology and best practices documentation
  • Application notes for specific use cases

Software Tools:

  • ISE Design Suite compatibility information
  • Vivado Design Suite migration guidelines
  • Programming and debugging tool documentation
  • IP core integration guides

Related Resources

Development Tools and Support

Design Software:

  • Xilinx ISE Design Suite (legacy support)
  • Vivado Design Suite for newer designs
  • ChipScope Pro Analyzer for debugging
  • EDK (Embedded Development Kit) compatibility

Evaluation Platforms:

  • Spartan-3AN Starter Kit for rapid prototyping
  • Development boards featuring XC3S1400AN-5FGG676I
  • Reference designs and demo applications
  • Educational resources and tutorials

IP Cores and Libraries:

  • LogiCORE IP portfolio compatibility
  • DSP functions and communication protocols
  • Interface controllers and memory controllers
  • Custom IP development resources

Application Areas

The XC3S1400AN-5FGG676I excels in various applications:

Communications and Networking:

  • Protocol processing and packet switching
  • Baseband processing for wireless systems
  • Network interface controllers
  • Software-defined radio implementations

Industrial and Automotive:

  • Motor control and power management
  • Industrial automation systems
  • Automotive infotainment and control units
  • Test and measurement equipment

Consumer Electronics:

  • Digital signal processing applications
  • Video and image processing systems
  • Gaming and multimedia devices
  • Portable electronic devices

Environmental & Export Classifications

Environmental Compliance

The XC3S1400AN-5FGG676I meets stringent environmental standards:

RoHS Compliance:

  • Lead-free assembly process compatible
  • Halogen-free package options available
  • Compliant with EU RoHS Directive 2011/65/EU
  • WEEE Directive compliance for end-of-life recycling

Environmental Certifications:

  • ISO 14001 environmental management system
  • REACH regulation compliance
  • Conflict minerals reporting compliance
  • Green packaging initiatives support

Export Classification Information

Export Control Classification:

  • ECCN (Export Control Classification Number): Check current regulations
  • Country of origin: Varies by manufacturing location
  • HTS (Harmonized Tariff Schedule) code for customs classification
  • Export license requirements vary by destination country

Regulatory Compliance:

  • FCC Part 15 Class B certification available
  • CE marking for European market compliance
  • UL recognition for safety standards
  • Various international safety and EMC certifications

Quality and Reliability Standards

The XC3S1400AN-5FGG676I undergoes rigorous quality testing:

  • AEC-Q100 automotive qualification (where applicable)
  • Military and aerospace screening options available
  • Extended temperature range testing
  • Long-term reliability validation programs

The XC3S1400AN-5FGG676I represents an excellent balance of performance, features, and cost-effectiveness for FPGA-based designs. Its integrated flash memory, robust I/O capabilities, and comprehensive development ecosystem make it a preferred choice for engineers developing next-generation electronic systems. Contact authorized distributors for detailed specifications, pricing, and technical support for your XC3S1400AN-5FGG676I implementation.