The XC3S1400AN-5FG676C is a powerful field-programmable gate array (FPGA) from Xilinx’s Spartan-3AN family, designed to deliver exceptional performance for embedded applications requiring integrated configuration memory and advanced processing capabilities.
Product Specifications
Core Features
The XC3S1400AN-5FG676C offers robust specifications that make it ideal for demanding applications:
Logic Capacity & Architecture:
- 1,400,000 system gates providing extensive logic resources
- 29,504 logic cells for complex digital designs
- 1,536 configurable logic blocks (CLBs) with advanced routing
- Speed grade -5 for high-performance operation
Memory Resources:
- 576 Kb of distributed RAM for flexible memory implementation
- 126 dedicated 18Kb block RAMs totaling 2,268 Kb
- Integrated configuration memory eliminating external configuration devices
I/O Capabilities:
- 487 user I/O pins supporting various interface standards
- Multi-standard I/O support including LVTTL, LVCMOS, and differential signaling
- High-speed I/O performance for demanding interface requirements
Package Details:
- FG676 Fine-pitch Ball Grid Array (FBGA) package
- 676-pin configuration optimizing board space utilization
- Industrial temperature range operation (-40ยฐC to +100ยฐC)
- Commercial grade reliability standards
Price Information
The XC3S1400AN-5FG676C pricing varies based on quantity and distribution channel. Contact authorized Xilinx distributors for current pricing and availability. Bulk pricing discounts are typically available for production quantities exceeding 100 units.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical specifications and performance characteristics
- User Guide: Comprehensive implementation guidelines and best practices
- Package Information: Detailed pinout diagrams and mechanical specifications
- Application Notes: Design examples and optimization techniques
Design Resources
- Reference Designs: Pre-validated implementation examples
- Simulation Models: SPICE and behavioral models for design verification
- PCB Layout Guidelines: Recommended routing and placement practices
- Thermal Management: Heat dissipation recommendations and thermal models
Related Resources
Development Tools
The XC3S1400AN-5FG676C integrates seamlessly with Xilinx development tools:
- ISE Design Suite: Complete design flow from synthesis to bitstream generation
- ChipScope Pro: Integrated logic analyzer for real-time debugging
- PlanAhead: Advanced floorplanning and constraint management
- Embedded Development Kit (EDK): Comprehensive embedded system design tools
Compatible Products
- Spartan-3AN Family: Pin-compatible alternatives for different capacity requirements
- Configuration Solutions: External configuration memory options for specialized applications
- Development Boards: Evaluation platforms featuring the XC3S1400AN-5FG676C
Support Resources
- Xilinx Answer Database: Searchable knowledge base with design solutions
- Community Forums: Peer-to-peer technical discussions and troubleshooting
- Technical Support: Direct access to Xilinx engineering expertise
- Training Materials: Online courses and certification programs
Environmental & Export Classifications
Environmental Compliance
The XC3S1400AN-5FG676C meets stringent environmental standards:
- RoHS Compliant: Lead-free manufacturing process
- REACH Regulation: Compliant with EU chemical safety requirements
- Conflict Minerals: Sourced from responsible supply chains
- Green Package: Environmentally conscious packaging materials
Export Control Information
- ECCN Classification: 3A001.a.7 under U.S. Export Administration Regulations
- HTS Code: 8542.31.0001 for customs classification
- Country of Origin: Manufacturing location information available upon request
- Export Licensing: Standard commercial licensing requirements apply
Quality Standards
- ISO 9001: Manufactured under certified quality management systems
- Automotive Grade: AEC-Q100 qualified versions available for automotive applications
- Reliability Testing: Comprehensive qualification testing including temperature cycling and humidity exposure
- Quality Metrics: Statistical quality control with documented failure rates
The XC3S1400AN-5FG676C represents an optimal balance of performance, integration, and cost-effectiveness for applications requiring high-density programmable logic with integrated configuration memory. Its comprehensive feature set and robust design make it suitable for telecommunications, industrial automation, medical devices, and aerospace applications where reliability and performance are paramount.
