The XC3S1400AN-4FGG676I is a powerful Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-3AN family, designed to deliver exceptional performance for embedded applications requiring integrated configuration memory and robust processing capabilities.
Product Specifications
Core Features
The XC3S1400AN-4FGG676I integrates 1.4 million system gates with advanced Spartan-3AN architecture, providing designers with a comprehensive solution for complex digital processing applications. This FPGA features built-in configuration memory, eliminating the need for external configuration devices and reducing overall system cost.
Key Technical Specifications:
- Logic Cells: 29,504 logic cells with 4-input LUTs
- System Gates: 1.4 million equivalent system gates
- Block RAM: 576 Kbits of dual-port block RAM
- Distributed RAM: 58 Kbits distributed RAM
- Digital Clock Managers (DCMs): 4 DCMs for advanced clock management
- Package Type: Fine-pitch Ball Grid Array (FBGA) 676-pin
- Speed Grade: -4 (fastest commercial speed grade)
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- Supply Voltage: 1.2V core, 3.3V I/O
Advanced Architecture
The XC3S1400AN-4FGG676I incorporates Xilinx’s proven Spartan-3AN technology with integrated In-System Flash memory, enabling single-chip configuration storage. The device supports up to 487 user I/O pins, providing extensive connectivity options for complex system designs.
Pricing Information
Pricing for the XC3S1400AN-4FGG676I varies based on quantity, supplier, and market conditions. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities, making the XC3S1400AN-4FGG676I cost-effective for large-scale deployments.
Factors affecting XC3S1400AN-4FGG676I pricing include:
- Order quantity and delivery requirements
- Regional market conditions
- Supplier inventory levels
- Long-term supply agreements
Documents & Media
Technical Documentation
Comprehensive documentation supports XC3S1400AN-4FGG676I implementation:
Datasheets and Reference Manuals:
- Spartan-3AN FPGA Family Data Sheet
- XC3S1400AN-4FGG676I Device-Specific Datasheet
- Package and Pinout Documentation
- Thermal and Power Consumption Guidelines
Design Resources:
- Xilinx ISE Design Suite compatibility information
- Timing and performance specifications
- Configuration and programming guides
- Application notes for optimal XC3S1400AN-4FGG676I utilization
Development Tools
The XC3S1400AN-4FGG676I is supported by Xilinx’s comprehensive development environment, including synthesis tools, simulation software, and debugging utilities optimized for Spartan-3AN devices.
Related Resources
Compatible Development Boards
Several development platforms support the XC3S1400AN-4FGG676I, enabling rapid prototyping and system validation:
- Spartan-3AN Starter Kit boards
- Third-party development modules
- Custom evaluation platforms
Software Compatibility
The XC3S1400AN-4FGG676I integrates seamlessly with industry-standard design flows:
- Xilinx ISE Design Suite
- ModelSim simulation environment
- Synopsys synthesis tools
- Third-party EDA tool compatibility
Application Areas
The XC3S1400AN-4FGG676I excels in diverse applications:
- Industrial automation and control systems
- Communications infrastructure equipment
- Medical device implementations
- Automotive electronics
- Consumer electronics requiring reconfigurable logic
Environmental & Export Classifications
Environmental Compliance
The XC3S1400AN-4FGG676I meets stringent environmental standards:
RoHS Compliance: Fully compliant with RoHS directives, ensuring lead-free manufacturing and environmental responsibility.
Operating Conditions:
- Temperature Range: 0ยฐC to +85ยฐC (commercial grade)
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters operational
Export Classifications
The XC3S1400AN-4FGG676I is subject to export control regulations:
ECCN Classification: Export control classification numbers apply to international shipments of the XC3S1400AN-4FGG676I. Consult current export documentation for specific requirements.
Country of Origin: Manufactured under Xilinx quality standards with full traceability.
Quality and Reliability
The XC3S1400AN-4FGG676I undergoes comprehensive testing to ensure reliability:
- Extended burn-in testing procedures
- Statistical quality control monitoring
- Long-term reliability validation
- Industrial-grade qualification standards
The XC3S1400AN-4FGG676I represents an optimal balance of performance, integration, and cost-effectiveness for demanding FPGA applications. Its combination of substantial logic resources, integrated configuration memory, and comprehensive development tool support makes the XC3S1400AN-4FGG676I an excellent choice for both prototype development and production deployment.
