The XC3S1400AN-4FGG484I is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3AN family, designed to deliver exceptional performance for complex digital applications. This versatile programmable logic device combines advanced features with cost-effective manufacturing, making it an ideal choice for engineers developing sophisticated embedded systems, digital signal processing applications, and custom computing solutions.
Product Specifications
The XC3S1400AN-4FGG484I features robust technical specifications that enable high-performance digital design implementations:
Core Architecture:
- Logic cells: 1,400,000 system gates equivalent
- Configurable Logic Blocks (CLBs): 8,064 slices
- Block RAM: 576 Kbits total memory
- Distributed RAM: 201 Kbits capacity
- Speed grade: -4 (high-performance variant)
Package Details:
- Package type: Fine-pitch Ball Grid Array (FBGA)
- Pin count: 484 pins
- Package size: 23mm x 23mm
- Operating temperature range: Industrial grade (-40ยฐC to +85ยฐC)
I/O Capabilities:
- User I/O pins: 333 maximum
- Differential I/O pairs: 166 pairs
- High-speed serial connectivity support
- Multiple I/O standards compatibility including LVDS, SSTL, and HSTL
Performance Characteristics:
- Maximum system clock frequency: 326 MHz
- Low power consumption with advanced power management
- Built-in configuration memory eliminates external configuration devices
- Enhanced security features for IP protection
Price Information
The XC3S1400AN-4FGG484I pricing varies based on order quantity, distribution channel, and current market conditions. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for quantities exceeding 100 units. Educational institutions may qualify for special academic pricing programs.
Documents & Media
Technical Documentation:
- XC3S1400AN-4FGG484I datasheet with complete electrical specifications
- Spartan-3AN family user guide and reference manual
- Package mechanical drawings and PCB layout guidelines
- Thermal characteristics and power consumption analysis
- Pin assignment and I/O planning documentation
Development Resources:
- Xilinx ISE Design Suite compatibility information
- Vivado Design Suite migration guidelines
- Reference designs and application notes
- FPGA configuration and programming tutorials
- Signal integrity and PCB design best practices
Software Tools:
- Compatible with Xilinx development environments
- Third-party synthesis tool support documentation
- Simulation model libraries and testbench examples
- Constraint files and timing analysis resources
Related Resources
Development Boards:
- Spartan-3AN starter kits featuring the XC3S1400AN-4FGG484I
- Evaluation platforms for rapid prototyping
- Third-party development boards and modules
- Custom carrier board reference designs
Compatible Components:
- Recommended power supply solutions and voltage regulators
- Clock generation and distribution components
- Memory interfaces and external storage options
- Communication interface controllers and transceivers
Design Services:
- Xilinx alliance partner design services directory
- Training courses and certification programs
- Technical support and consulting resources
- Community forums and knowledge base access
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant manufacturing process
- REACH regulation compliance for European markets
- Conflict minerals reporting and responsible sourcing
- ISO 14001 environmental management system certified
Export Control Classifications:
- Export Control Classification Number (ECCN): 3A001.a.7
- HTS classification for customs and import procedures
- Country-specific export licensing requirements
- International Traffic in Arms Regulations (ITAR) exempt
Quality Standards:
- Automotive qualification available (contact for AEC-Q100 variants)
- Military and aerospace screening options
- Extended temperature range variants for harsh environments
- Long-term availability commitment for critical applications
Packaging and Shipping:
- Moisture sensitivity level classification
- Anti-static packaging and handling requirements
- Lead-free and halogen-free manufacturing options
- Tape and reel packaging for automated assembly
The XC3S1400AN-4FGG484I represents an excellent choice for engineers requiring high-performance FPGA capabilities in a compact, cost-effective package. Its comprehensive feature set, extensive documentation, and broad ecosystem support make it suitable for diverse applications ranging from industrial automation to telecommunications infrastructure.
