The XC3S1400AN-4FG676I is a cutting-edge Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-3AN family, designed to deliver exceptional performance for demanding digital signal processing and embedded system applications. This advanced programmable logic device combines high-density architecture with integrated configuration memory, making it an ideal solution for engineers seeking reliable, cost-effective FPGA implementation.
Product Specifications
Core Architecture
The XC3S1400AN-4FG676I features robust system gates totaling 1.4 million, providing substantial logic capacity for complex digital designs. This FPGA incorporates 29,504 logic cells organized in a highly efficient architecture that maximizes performance while minimizing power consumption.
Memory Configuration
This Spartan-3AN device includes dedicated block RAM totaling 576 Kbits, distributed across 32 blocks of 18 Kbit each. The integrated configuration memory eliminates the need for external configuration devices, streamlining board design and reducing overall system cost.
I/O Capabilities
The XC3S1400AN-4FG676I offers 372 user I/O pins in the FG676 package, providing extensive connectivity options for interfacing with external components. The device supports multiple I/O standards including LVTTL, LVCMOS, SSTL, and HSTL, ensuring compatibility with various system requirements.
Performance Characteristics
- Speed Grade: -4 (high-performance option)
- Package Type: FG676 (Fine Pitch Ball Grid Array)
- Operating Temperature: Industrial grade (-40ยฐC to +85ยฐC)
- Supply Voltage: 1.2V core, 3.3V I/O
- Maximum Clock Frequency: Up to 326 MHz
Pricing Information
The XC3S1400AN-4FG676I is competitively priced within the mid-range FPGA market segment. Pricing varies based on order quantity, with volume discounts available for production quantities. Contact authorized Xilinx distributors for current pricing and availability, as semiconductor prices fluctuate based on market conditions and supply chain factors.
For budget planning purposes, the XC3S1400AN-4FG676I typically falls within the $50-150 range per unit for moderate quantities, with significant cost reductions available for high-volume production orders.
Documents & Media
Technical Documentation
Complete technical resources for the XC3S1400AN-4FG676I include detailed datasheets, user guides, and application notes available through Xilinx’s official documentation portal. Key documents include:
- Product Datasheet: Comprehensive electrical and mechanical specifications
- User Guide: Detailed implementation guidelines and best practices
- Package Information: Mechanical drawings and pin assignments
- Characterization Reports: Performance benchmarks and timing analysis
Development Tools
The XC3S1400AN-4FG676I is fully supported by Xilinx ISE Design Suite, providing complete design entry, synthesis, implementation, and verification capabilities. Additional tools include ChipScope Pro for real-time debugging and analysis.
Reference Designs
Xilinx provides numerous reference designs and application examples specifically optimized for the Spartan-3AN architecture, helping accelerate development cycles and reduce time-to-market.
Related Resources
Development Boards
Several evaluation and development platforms support the XC3S1400AN-4FG676I, including Spartan-3AN starter kits and third-party development boards. These platforms provide essential hardware for prototyping and validation phases.
Compatible Components
The XC3S1400AN-4FG676I integrates seamlessly with various peripheral components including memory controllers, communication interfaces, and analog front-end devices commonly used in embedded system designs.
Software Ecosystem
Extensive software support includes IP cores, embedded processors, and connectivity solutions that complement the XC3S1400AN-4FG676I’s capabilities in system-on-chip implementations.
Environmental & Export Classifications
Environmental Compliance
The XC3S1400AN-4FG676I meets stringent environmental standards including RoHS compliance for lead-free manufacturing processes. The device is manufactured using environmentally responsible processes that minimize ecological impact while maintaining high reliability standards.
Export Control Classification
This product is subject to export control regulations and may require appropriate export licenses for international shipments. The XC3S1400AN-4FG676I falls under standard semiconductor export classifications, with specific restrictions varying by destination country.
Quality Standards
Manufacturing processes for the XC3S1400AN-4FG676I comply with ISO 9001 quality management standards, ensuring consistent product quality and reliability. The device undergoes comprehensive testing and qualification procedures to meet automotive and industrial application requirements.
Packaging and Shipping
The XC3S1400AN-4FG676I is available in moisture-sensitive packaging with appropriate ESD protection for safe handling and storage. Proper handling procedures ensure device integrity throughout the supply chain.
The XC3S1400AN-4FG676I represents an excellent balance of performance, features, and cost-effectiveness for engineers developing advanced digital systems. Its combination of high logic density, integrated configuration memory, and comprehensive development tool support makes it an optimal choice for a wide range of applications from telecommunications to industrial automation.
