The XC3S1400A-5FGG676C is a powerful Field-Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-3A family, designed to deliver exceptional performance for demanding digital applications. This versatile programmable logic device combines high-density architecture with cost-effective pricing, making it an ideal choice for engineers and developers working on complex digital signal processing, embedded systems, and communication applications.
Product Specifications
The XC3S1400A-5FGG676C offers impressive technical capabilities that set it apart in the FPGA market:
Logic Capacity & Architecture:
- System gates: 1,400,000 gates equivalent
- Logic cells: 25,344 configurable logic blocks
- Distributed RAM: 239 Kbits
- Block RAM: 576 Kbits total memory
- Multipliers: 32 dedicated 18×18 hardware multipliers
Performance Specifications:
- Speed grade: -5 (high-performance variant)
- Maximum operating frequency: Up to 320 MHz
- Low power consumption with advanced power management
- Temperature range: Commercial (0ยฐC to +85ยฐC)
Package & I/O Configuration:
- Package type: FGG676 (Fine-pitch Ball Grid Array)
- Pin count: 676 pins
- User I/O pins: 487 available
- Differential I/O pairs: 190 pairs supported
- Package dimensions: 27mm x 27mm footprint
Memory & Storage Features:
- Embedded memory blocks for data buffering
- Support for external memory interfaces
- Configuration memory for design storage
- JTAG boundary scan for testing and debugging
Pricing Information
The XC3S1400A-5FGG676C offers competitive pricing in the mid-range FPGA segment. Pricing varies based on quantity and supplier, with typical costs ranging from $45-85 per unit for standard commercial quantities. Volume discounts are available for orders exceeding 100 units. For current pricing and availability, contact authorized Xilinx distributors or electronic component suppliers.
Documents & Media
Technical Documentation:
- Official Xilinx datasheet with complete electrical specifications
- Spartan-3A FPGA family user guide
- Configuration and programming manual
- Package and pinout reference documents
- Thermal and power consumption guidelines
Design Resources:
- Reference designs and application notes
- ISE Design Suite compatibility documentation
- Constraint files and PCB layout guidelines
- Signal integrity and timing analysis reports
Development Tools:
- Xilinx ISE WebPACK (free development environment)
- ChipScope Pro analyzer support
- Third-party synthesis tool compatibility
- Simulation model libraries (VHDL/Verilog)
Related Resources
Compatible Development Boards:
- Spartan-3A evaluation kits and starter boards
- Third-party development platforms supporting XC3S1400A
- Educational FPGA training modules
Design Software:
- Xilinx Vivado Design Suite (for newer projects)
- ModelSim simulation environment
- Synopsys and Mentor Graphics tool support
Application Areas:
- Digital signal processing systems
- Communications and networking equipment
- Industrial automation and control
- Medical device electronics
- Automotive electronics applications
Technical Support:
- Xilinx community forums and knowledge base
- Application engineering support
- Training courses and webinars
- Design consultation services
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Conflict minerals reporting available
- Environmental product declarations provided
Operating Conditions:
- Junction temperature range: -40ยฐC to +125ยฐC
- Storage temperature: -65ยฐC to +150ยฐC
- Humidity tolerance: Up to 85% non-condensing
- Altitude rating: Up to 2000 meters
Export Control Information:
- ECCN (Export Control Classification Number): 3A001.a.7
- Country of origin: Manufactured in various global facilities
- Export licensing requirements vary by destination
- Dual-use technology classification applies
Quality & Reliability:
- Automotive qualification available (extended temperature)
- Military/aerospace screening options
- Long-term supply commitment from Xilinx
- Comprehensive quality assurance testing
Package Marking & Identification:
- Device part number clearly marked
- Date code and lot traceability
- Speed grade and temperature range indicators
- Anti-counterfeiting security features
The XC3S1400A-5FGG676C represents an excellent balance of performance, features, and cost-effectiveness for engineers seeking a reliable FPGA solution. Its robust architecture and comprehensive development ecosystem make it suitable for both prototyping and production applications across diverse industries.
