The XC3S1400A-4FG676I is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3A family, designed to deliver exceptional performance for cost-sensitive applications. This versatile programmable logic device combines advanced features with competitive pricing, making it an ideal choice for digital signal processing, embedded control, and communication systems.
Product Specifications
The XC3S1400A-4FG676I offers robust technical capabilities that meet demanding design requirements across various industries.
Core Architecture:
- Logic cells: 1,400,000 system gates
- Configurable Logic Blocks (CLBs): 8,064 slices
- Distributed RAM: 126 Kb
- Block RAM: 576 Kb total memory
- Dedicated multipliers: 32 embedded 18×18 multipliers
- Digital Clock Manager (DCM) blocks: 4 units
Package and Interface:
- Package type: Fine-pitch Ball Grid Array (FBGA)
- Pin count: 676 pins
- Operating temperature range: Industrial grade (-40ยฐC to +100ยฐC)
- Speed grade: -4 (high performance)
- Supply voltage: 1.2V core, 3.3V I/O
Performance Characteristics:
- Maximum frequency: Up to 200+ MHz
- Low power consumption with advanced power management
- High-speed I/O capabilities with LVDS support
- On-chip debugging and configuration options
Pricing Information
The XC3S1400A-4FG676I is competitively priced within the mid-range FPGA market segment. Pricing varies based on order quantity, distribution channel, and current market conditions. For accurate pricing information, contact authorized Xilinx distributors or visit official supplier websites. Volume discounts are typically available for quantities exceeding 100 units, making this device cost-effective for both prototyping and production applications.
Documents & Media
Technical Documentation:
- Complete datasheet with electrical specifications and timing parameters
- User guide covering configuration and programming procedures
- Application notes for specific implementation scenarios
- Reference designs and example projects
- Pin assignment and packaging documentation
Development Resources:
- ISE Design Suite compatibility information
- Constraint files and design templates
- Simulation models and timing analysis data
- Programming file formats and configuration options
Additional Media:
- Product selection guides and comparison charts
- Training materials and video tutorials
- Webinar recordings covering advanced features
- Technical support documentation and FAQ resources
Related Resources
Development Tools:
- Xilinx ISE Design Suite for design entry and implementation
- ChipScope Pro for on-chip debugging and analysis
- ModelSim or other supported simulation environments
- Third-party synthesis tools compatibility
Evaluation Platforms:
- Spartan-3A development boards and starter kits
- Reference designs for common applications
- Demonstration projects and code examples
- Community forums and user groups
Complementary Products:
- Configuration memory devices and programming solutions
- Power management ICs optimized for FPGA applications
- Clock generation and distribution components
- Interface and connectivity solutions
Environmental & Export Classifications
Environmental Compliance: The XC3S1400A-4FG676I meets stringent environmental standards including RoHS compliance for lead-free manufacturing. The device is manufactured using environmentally responsible processes and materials, ensuring compatibility with green electronics initiatives.
Export Control Information: This product is subject to US export control regulations under the Export Administration Regulations (EAR). The Export Control Classification Number (ECCN) applies to international shipments and may require appropriate export licenses for certain destinations. Customers should verify current export requirements before international distribution.
Quality and Reliability:
- Industrial temperature grade qualification
- Extended lifecycle support and availability
- Comprehensive quality assurance testing
- Long-term supply commitment from Xilinx
The XC3S1400A-4FG676I represents an excellent balance of performance, features, and cost-effectiveness for engineers developing next-generation digital systems. Its combination of ample logic resources, high-speed capabilities, and industrial-grade reliability makes it suitable for demanding applications across telecommunications, automotive, industrial automation, and consumer electronics markets.
