The XC3S1400A-4FG484I is a powerful FPGA (Field-Programmable Gate Array) from Xilinx’s renowned Spartan-3 family, designed to deliver exceptional performance for a wide range of digital signal processing and embedded system applications. This advanced programmable logic device combines high logic density with cost-effective functionality, making it an ideal choice for engineers developing complex digital systems.
Product Specifications
Core Architecture
The XC3S1400A-4FG484I features a robust architecture with 1,400,000 system gates, providing substantial logic capacity for demanding applications. This FPGA incorporates 29,504 logic cells organized in a flexible array structure that supports complex digital designs. The device includes 120 dedicated multipliers optimized for DSP operations, enabling efficient arithmetic processing.
Memory and I/O Configuration
This Spartan-3 device offers 576 Kb of distributed RAM and 1,728 Kb of block RAM, providing versatile memory options for data storage and buffering. The XC3S1400A-4FG484I supports up to 333 user I/O pins in the 484-pin Fine-Pitch Ball Grid Array (FBGA) package, offering extensive connectivity options for interfacing with external components.
Performance Characteristics
Operating at a -4 speed grade, the XC3S1400A-4FG484I delivers fast switching speeds with maximum frequencies exceeding 300 MHz for many applications. The device operates across an industrial temperature range from -40ยฐC to +100ยฐC, ensuring reliable performance in challenging environmental conditions. Power consumption is optimized through advanced design techniques, making it suitable for battery-powered and low-power applications.
Package Details
The XC3S1400A-4FG484I comes in a compact 484-pin Fine-Pitch Ball Grid Array (FBGA) package measuring 23mm x 23mm. This space-efficient packaging provides excellent thermal characteristics while maintaining signal integrity for high-speed applications.
Pricing Information
The XC3S1400A-4FG484I is competitively priced within the mid-range FPGA market segment. Pricing varies based on order quantity, with significant volume discounts available for production quantities. Contact authorized distributors for current pricing and availability, as semiconductor prices fluctuate based on market conditions and supply chain factors.
Typical pricing ranges from $45-85 per unit in moderate quantities, with lower per-unit costs available for high-volume orders exceeding 1,000 pieces. Educational and development discounts may be available through participating distributors.
Documents & Media
Technical Documentation
Comprehensive technical resources are available for the XC3S1400A-4FG484I, including detailed datasheets specifying electrical characteristics, timing parameters, and mechanical specifications. The product datasheet provides complete pin-out information, power consumption data, and recommended operating conditions.
Design Resources
Xilinx provides extensive design support through their ISE Design Suite, which includes synthesis, implementation, and debugging tools specifically optimized for Spartan-3 devices. Reference designs and application notes demonstrate best practices for implementing common functions such as digital filters, communication interfaces, and control systems.
Development Tools
The XC3S1400A-4FG484I is fully supported by Xilinx’s development ecosystem, including ChipScope Pro for in-system debugging and various IP cores for accelerated development. VHDL and Verilog code examples are available to help engineers quickly prototype and validate their designs.
Related Resources
Development Boards
Several development and evaluation boards are available featuring the XC3S1400A-4FG484I, providing immediate hands-on experience with the device. These boards typically include peripheral interfaces, memory modules, and expansion connectors for rapid prototyping.
Compatible Devices
The XC3S1400A-4FG484I is part of the broader Spartan-3 family, offering migration paths to both smaller and larger devices within the same architecture. Pin-compatible options and similar packages facilitate design scalability across different project requirements.
Support Communities
Active user communities and forums provide peer support for XC3S1400A-4FG484I development, sharing design techniques, troubleshooting solutions, and optimization strategies. Professional technical support is available through Xilinx’s customer service channels.
Environmental & Export Classifications
Environmental Compliance
The XC3S1400A-4FG484I meets stringent environmental standards including RoHS (Restriction of Hazardous Substances) compliance, ensuring lead-free manufacturing processes. The device is manufactured using environmentally responsible methods and materials that minimize ecological impact.
Operating Specifications
This FPGA operates reliably across an extended temperature range of -40ยฐC to +100ยฐC, making it suitable for industrial, automotive, and aerospace applications where temperature extremes are common. Humidity tolerance and shock resistance specifications ensure dependable operation in harsh environments.
Export Classifications
The XC3S1400A-4FG484I falls under standard commercial export classifications for semiconductor devices. Export compliance documentation is available for international shipments, though specific restrictions may apply to certain countries or end-use applications. Consult current export regulations and Xilinx export compliance policies for detailed shipping requirements.
Quality Standards
Manufacturing follows ISO 9001 quality management standards, with comprehensive testing protocols ensuring device reliability and performance consistency. The XC3S1400A-4FG484I undergoes rigorous quality assurance procedures including electrical testing, thermal cycling, and package integrity verification before shipment.
The XC3S1400A-4FG484I represents an excellent balance of performance, features, and cost-effectiveness for FPGA-based system design. Its proven Spartan-3 architecture, comprehensive development support, and reliable operation make it a preferred choice for engineers developing next-generation digital systems.
