The XC3S1200E-5FTG256C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3E family, designed to deliver exceptional performance for complex digital logic applications. This versatile FPGA combines high logic density with advanced features, making it an ideal choice for demanding embedded systems, telecommunications, and industrial automation projects.
Product Specifications
The XC3S1200E-5FTG256C offers impressive technical capabilities that set it apart in the FPGA market. This device features 1,200,000 system gates with 8,672 configurable logic blocks (CLBs), providing ample resources for complex digital designs. The FPGA includes 40 dedicated multipliers and 504 Kbits of block RAM, enabling efficient implementation of DSP algorithms and data buffering applications.
Key specifications of the XC3S1200E-5FTG256C include a -5 speed grade for enhanced performance, operating at commercial temperature ranges from 0ยฐC to +85ยฐC. The device utilizes a 256-ball Fine-Pitch Ball Grid Array (FTBGA) package, offering excellent thermal performance and signal integrity. With 196 user I/O pins, the XC3S1200E-5FTG256C provides extensive connectivity options for interfacing with external components and systems.
The FPGA supports multiple I/O standards including LVTTL, LVCMOS, SSTL, and HSTL, ensuring compatibility with various system architectures. Built on advanced 90nm process technology, the XC3S1200E-5FTG256C delivers optimal power efficiency while maintaining high performance characteristics essential for modern digital applications.
Pricing Information
The XC3S1200E-5FTG256C is competitively priced to provide excellent value for professional FPGA applications. Pricing varies based on order quantity, with volume discounts available for large-scale production requirements. Contact authorized Xilinx distributors for current pricing information, as costs may fluctuate based on market conditions and availability.
Educational institutions and research organizations may qualify for special academic pricing on the XC3S1200E-5FTG256C. Many suppliers offer flexible payment terms and expedited shipping options to meet project deadlines and budget constraints.
Documents & Media
Comprehensive technical documentation supports the XC3S1200E-5FTG256C implementation process. The official datasheet provides detailed electrical characteristics, timing specifications, and package information essential for system design. Application notes offer practical guidance for common implementation challenges and optimization techniques.
The Spartan-3E Family User Guide contains in-depth information about device architecture, configuration options, and design methodologies specific to the XC3S1200E-5FTG256C. PCB design guidelines ensure proper board layout and signal integrity for optimal performance.
Development tools include ISE Design Suite compatibility, enabling seamless integration with Xilinx’s comprehensive FPGA development environment. Reference designs and example projects accelerate development timelines and demonstrate best practices for the XC3S1200E-5FTG256C.
Related Resources
The XC3S1200E-5FTG256C ecosystem includes various development boards and evaluation kits that facilitate rapid prototyping and system validation. Popular development platforms feature the XC3S1200E-5FTG256C along with essential peripherals, power management, and programming interfaces.
Compatible IP cores expand the functionality of the XC3S1200E-5FTG256C, including soft processors, communication interfaces, and signal processing blocks. These pre-verified IP solutions reduce development time and improve design reliability.
Training resources and online communities provide valuable support for XC3S1200E-5FTG256C users, including webinars, tutorials, and peer-to-peer assistance. Xilinx Alliance Program partners offer specialized services and solutions tailored to specific application requirements.
Environmental & Export Classifications
The XC3S1200E-5FTG256C meets stringent environmental and regulatory standards for global deployment. The device complies with RoHS (Restriction of Hazardous Substances) regulations, ensuring environmental responsibility in manufacturing and disposal processes.
Export classification information for the XC3S1200E-5FTG256C varies by destination country and application. Users must verify current export control regulations and obtain necessary licenses for international shipments. The device typically falls under standard commercial export categories for most applications.
Environmental operating specifications include commercial temperature range operation and standard humidity tolerance. The XC3S1200E-5FTG256C package design provides excellent thermal dissipation and mechanical reliability for demanding operating conditions.
Quality certifications and manufacturing standards ensure consistent performance and reliability of the XC3S1200E-5FTG256C across production lots. Xilinx maintains comprehensive quality management systems that meet ISO standards and customer-specific requirements.
The XC3S1200E-5FTG256C represents an excellent choice for engineers seeking a high-performance FPGA solution with proven reliability and comprehensive development support. Its combination of advanced features, competitive pricing, and extensive resources makes it suitable for a wide range of applications from prototype development to volume production.
